摘要:
Disclosed is a method of manufacturing a semiconductor device, comprising forming a bottom electrode film of a capacitor above a semiconductor substrate, forming a dielectric film of the capacitor on the bottom electrode film, forming a top electrode film of the capacitor on the dielectric film, and forming a hydrogen barrier film after forming the top electrode film, the hydrogen barrier film preventing hydrogen from diffusing into the dielectric film, wherein forming the hydrogen barrier film includes forming an oxide film containing silicon and nitriding the oxide film.
摘要:
A semiconductor device comprises a semiconductor substrate including a diffusion area, a capacitor provided above the semiconductor substrate and including a lower electrode, a dielectric film, and an upper electrode, a plug provided between the semiconductor substrate and the capacitor and having a lower end connected to the diffusion area and an upper end connected to the lower electrode, and a dummy plug provided between the semiconductor substrate and the capacitor and having a lower end not connected to the diffusion area and an upper end connected to the lower electrode.
摘要:
A ferroelectric device includes a bottom electrode on which are formed ferrocapacitor elements and, over the ferroelectric elements, top electrodes. The bottom electrodes are connected to lower layers of the device via conductive plugs, and the plugs and bottom electrodes are spaced apart by barrier elements of Ir and/or IrO2. The barrier elements are narrower than the bottom electrode elements, and are formed by a separate etching process. This means that Ir fences are not formed during the etching of the bottom electrode. Also, little Ir and/or IrO2 diffuses through the bottom electrode to the ferroelectric elements, and therefore there is little risk of damage to the ferroelectric material.
摘要:
A semiconductor device includes a MOS transistor, an interlayer insulating film, a contact plug, a capacitor lower electrode, a ferroelectric film and two capacitor upper electrodes. The MOS transistor is formed on a semiconductor substrate. The interlayer insulating film covers the MOS transistor. The contact plug is connected to an impurity diffusion layer of the MOS transistor. The capacitor lower electrode is formed on the contact plug. The two capacitor upper electrodes are formed on the capacitor lower electrode with the ferroelectric film interposed therebetween. A contact area between the contact plug and the capacitor lower electrode is greater than a contact area between each of the two capacitor upper electrodes and the ferroelectric film. At least a part of a gate electrode of the MOS transistor is located just below a region of the contact plug, which region is in contact with the capacitor lower electrode.
摘要:
A semiconductor memory including a ferroelectric gate capacitor structure includes an insulating interlayer formed on the surface of a semiconductor substrate. The insulating interlayer includes a hole at a position corresponding to a channel region. In the channel length direction, the hole extends across the channel region. A ferroelectric gate capacitor structure is formed in the hole. The ferroelectric gate capacitor structure includes a dielectric film, ferroelectric film, and upper electrode formed in this order from the substrate side.
摘要:
A synchronizing method and circuit accurately and stably operates a direct spread spectrum multiple access communication system. A signal transmitted by modulating the spreading code with data at the transmission side is sampled by a signal of n times (n: 1 or larger integer) the clock speed of the spread spectrum signal at the reception side, and the correlation is detected by a digital matched filter. Consequently, the detection output in every sample in the symbol period is compared with the envelope detection output determined in every sampling period, and the sample positions for a specific number of determined samples are stored in the descending order of the output. The number of times of storage of large sample positions in the stored detection output is counted in every symbol period, and the position of the largest number of storage times is detected as the peak position. From this peak position, capturing or holding the symbol period, and setting of the reception window position results.