公开(公告)号：US10263312B2

公开(公告)日：2019-04-16

申请号：US15282050

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P3/16 ,  H01P11/00 ,  H01P3/14

Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.

公开(公告)号：US20180183561A1

公开(公告)日：2018-06-28

申请号：US15388204

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04W72/04 ,  H04B1/44

CPC classification number: H04L5/14 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US20170084554A1

公开(公告)日：2017-03-23

申请号：US14860614

申请日：2015-09-21

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.