公开(公告)号：US20250112218A1

公开(公告)日：2025-04-03

申请号：US18478831

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Brandon M. Rawlings ,  Adel Elsherbini ,  Thomas L. Sounart ,  Feras Eid ,  Tushar Kanti Talukdar ,  Kimin Jun ,  Johanna Swan ,  Richard F. Vreeland

IPC: H01L25/00 ,  H01L21/683 ,  H01L25/075

Abstract: In one embodiment, a selective layer transfer process includes forming a layer of integrated circuit (IC) components on a first substrate, forming first bonding structures on a second substrate, and partially bonding the first substrate to the second substrate, which includes bonding a first subset of IC components on the first substrate to respective bonding structures on the second substrate. The process also includes forming second bonding structures on a third substrate, where the second bonding structures are arranged in a layout that is offset from the layout of the second substrate. The process further includes partially bonding the first substrate to the third substrate, which includes bonding a second subset of IC components on the first substrate to respective bonding structures on the third substrate.

公开(公告)号：US20230094979A1

公开(公告)日：2023-03-30

申请号：US17484299

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Adel Elsherbini ,  Stephen Morein ,  Yoshihiro Tomita ,  Thomas L. Sounart ,  Johanna Swan ,  Brandon M. Rawlings

IPC: H01L23/50 ,  H01L23/532

Abstract: Technologies for conformal power delivery structures near high-speed signal traces are disclosed. In one embodiment, a dielectric layer may be used to keep a power delivery structure spaced apart from high-speed signal traces, preventing deterioration of signals on the high-speed signal traces due to capacitive coupling to the power delivery structure.

公开(公告)号：US10950919B2

公开(公告)日：2021-03-16

申请号：US16325522

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Richard J. Dischler ,  Johanna M. Swan

IPC: H01P5/02 ,  H01P3/12 ,  H01P3/16 ,  H01P1/04 ,  H01P1/02 ,  H01P11/00

Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

公开(公告)号：US10476545B2

公开(公告)日：2019-11-12

申请号：US15745980

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Brandon M. Rawlings ,  Georgios C. Dogiamis

IPC: H04B1/40 ,  H04B1/00 ,  H01L25/00 ,  H01L23/00

Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.

公开(公告)号：US20190198961A1

公开(公告)日：2019-06-27

申请号：US16329587

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01Q9/04 ,  H01P11/00

CPC classification number: H01P3/16 ,  H01P3/122 ,  H01P11/002 ,  H01P11/006 ,  H01Q9/045 ,  H04L67/10

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US20250105046A1

公开(公告)日：2025-03-27

申请号：US18473905

申请日：2023-09-25

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Thomas L. Sounart ,  Feras Eid ,  Tushar Kanti Talukdar ,  Brandon M. Rawlings ,  Andrey Vyatskikh ,  Carlos Bedoya Arroyave ,  Kimin Jun ,  Shawna M. Liff ,  Grant M. Kloster ,  Richard F. Vreeland ,  William P. Brezinski ,  Johanna Swan

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/065

Abstract: Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a layer of integrated circuit (IC) components is received, and a second substrate with one or more adhesive areas is received. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

公开(公告)号：US11031666B2

公开(公告)日：2021-06-08

申请号：US16325301

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H01P3/12 ,  H01P3/127

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

公开(公告)号：US10595410B2

公开(公告)日：2020-03-17

申请号：US15283352

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Fay Hua ,  Brandon M. Rawlings ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H05K1/16 ,  H01L21/48 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40

Abstract: Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.

公开(公告)号：US10249925B2

公开(公告)日：2019-04-02

申请号：US15282086

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P3/14 ,  H01P11/00 ,  G06F1/18 ,  H01P3/16

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

公开(公告)号：US10083923B2

公开(公告)日：2018-09-25

申请号：US14860614

申请日：2015-09-21

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/58 ,  H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.