摘要:
A method is disclosed for forming a single crystal cantilever and tip on a substrate. The method can include the operation of defining an implant area on the substrate with a layer of photoresist. A further operation can be implanting oxygen into the substrate in the implant area to a predetermined depth to form a buried oxide layer. The buried oxide layer can define a bottom of the single crystal cantilever and tip. Another operation can involve shaping the single crystal cantilever and tip from the substrate above the buried oxide layer.
摘要:
A semiconductor integrated circuit device comprising a semiconductor substrate, e.g., silicon wafer, silicon on insulator. The device has a dielectric layer overlying the semiconductor substrate and a gate structure overlying the dielectric layer. The device also has a channel region within a portion of the semiconductor substrate within a vicinity of the gate structure and a lightly doped source/drain regions in the semiconductor substrate to from diffused pocket regions underlying portions of the gate structure. The device has sidewall spacers on edges of the gate structure. The device also has an etched source region and an etched drain region. Each of the first source region and the first drain region is characterized by a recessed region having substantially vertical walls, a bottom region, and rounded corner regions connecting the vertical walls to the bottom region.
摘要:
A method for forming an strained silicon integrated circuit device. The method includes providing a semiconductor substrate and forming a dielectric layer overlying the semiconductor substrate. The method also includes forming a gate layer overlying the dielectric layer and forming a hard mask overlying the gate layer. The method patterns the gate layer to form a gate structure including edges using the hard mask as a protective layer. The method forms a dielectric layer overlying the gate structure to protect the gate structure including the edges. The method forms spacers from the dielectric layer, while maintaining the hard mask overlying the gate structure. The method etches a source region and a drain region adjacent to the gate structure using the dielectric layer and the hard mask as a protective layer, while the hard mask prevents any portion of the gate structure from being exposed. In a preferred embodiment, the method maintains the hard mask overlying the gate structure. The method includes depositing silicon germanium material into the source region and the drain region to fill the etched source region and the etched drain region, while maintaining any portion of the gate layer from being exposed using the hard mask such that the gate structure is substantially free from any permanent deposition of silicon germanium material, which causes a channel region between the source region and the drain region to be strained in compressive mode from at least the silicon germanium material formed in the source region and the drain region. In a preferred embodiment, the method removing the hard mask from the gate structure to expose a top portion of the gate structure and maintains the top portion of the gate structure being substantially free from any silicon germanium material.
摘要:
The economics of a catalytic process using a fluidized conversion zone and a relatively expensive catalyst for converting an oxygenate to light olefins are substantially improved by recovering and recycling effluent contaminating catalyst particles from the product effluent stream withdrawn from the conversion zone which are present despite the use of one or more vapor-solid cyclone separating means to clean up this effluent stream. The contaminating catalyst particles are separated from this product effluent stream using a wet scrubbing zone and an optional dewatering zone to recover a slurry containing the contaminated particles which, quite surprisingly, can be successfully directly recycled to the oxygenate conversion zone or to the associated catalyst regeneration zone without loss of any substantial amount of catalytic activity thereby decreasing the amount of fresh catalyst addition required to make up for this source of catalyst loss.
摘要:
The present invention is a method and apparatus for resource allocation signaling for grouping user real time services. Uplink signaling for voice activity reporting of each user's transition between an active state and an inactive voice state is sent from a wireless transmit/receive unit to a Node B. Radio resource allocation to users of a wireless communication system varies based on user measurement reporting, a pre-determined pattern such as frequency hopping, or a pseudorandom function. Grouping methods are adjusted to better utilize the voice activity factor, so that statistical multiplexing can be used to more efficiently utilize physical resources.
摘要:
A high voltage semiconductor device. The high voltage device has a substrate (e.g., silicon wafer) having a surface region. The substrate has a well region within the substrate and a double diffused drain region within the well region. A gate dielectric layer is overlying the surface region. A gate polysilicon layer is overlying the gate dielectric layer. A mask layer is overlying the gate polysilicon layer. The device also has a gate electrode formed within the gate polysilicon layer. The gate electrode has a first predetermined width and a first predetermined thickness. Preferably, the gate electrode has a first side and a second side formed between the first predetermined width. The gate electrode is coupled to the double diffused drain region within the well region. Preferably, the first side has a lower corner overlying the gate dielectric layer and an upper corner underlying the mask layer and the second side has a lower corner overlying the gate dielectric layer and an upper corner underlying the mask layer. A first insulating region formed from polysilicon is formed at the lower corner on the first side of the gate electrode. The first insulating region extends from the first side toward a first preselect region within the gate electrode. A second insulating region formed from polysilicon material is at the lower corner on the second side of the gate electrode. The second insulating region extends from the second side toward a second preselected region within the gate electrode. A second predetermined width is formed between the first preselect region and the second preselected region. The second predetermined width comprises substantially polysilicon material. Preferably, the high voltage device has a breakdown voltage of the high voltage semiconductor device is characterized by a voltage of greater than 20 volts.
摘要:
A receiver sends hybrid automatic repeat request (H-ARQ) feedback for a current packet and at least one previous packet, whereby an error is detected based on the H-ARQ feedback. The receiver sends H-ARQ feedback with an identification of the packet or a sequence number of a packet that the receiver expects to receive next. The receiver stores a packet in a memory before combining the packet with a previously received packet, and decodes the stored packet after failing to decode a combined packet to avoid a corruption error. The receiver may set a timer when sending a NACK. If the receiver fails to receive a packet until expiration of the timer, the receiver initiates a process for recovering the packet. Each H-ARQ feedback may be associated with other attributes. Some H-ARQ processes may operate in an asynchronous mode while others in a synchronous mode in the same direction.
摘要:
A process for producing light olefins from oxygenates wherein internal reactor are protected from metal-catalyzed coking preferably by employing a protective layer.
摘要:
A tear and fatigue resistant gel article comprising two or more communicating internal volumes like cavities when depressed by external pressure or force is capable of collapsing unto itself in a controllable and directionally preselected manner by venting static air within said internal through openings in said gel article, said gel article is made from gel compositions having rigidity of from about 20 gram Bloom to about 1,800 gram Bloom suitable for cushioning and other uses.