Storage device for reliably maintaining data in a reproducible state for
a long period of time

    公开(公告)号:US5923485A

    公开(公告)日:1999-07-13

    申请号:US811570

    申请日:1997-03-05

    申请人: Kenya Ito

    发明人: Kenya Ito

    摘要: A time counting device, a cache memory and a copy control circuit are added to a conventional disk drive so that recorded information is copied periodically and automatically. Alternatively, a cache memory, a copy control circuit, a reference control circuit, a first time counting device and a second time counting device are added to the conventional disk drive so that information which remains recorded for a predetermined period of time after its last recording date is automatically copied. According to another embodiment, a reference signal is recorded in advance and a reproduced output is periodically measured. If the reproduced output is lower than a reference value, recorded information is automatically copied. According to yet another embodiment, the temperature in the disk drive is measured by a thermometer 18, and if the temperature is higher than a reference value, information is automatically copied at shorter intervals than when the temperature is less than the reference value. Other embodiments are also disclosed with the aim of ensuring that information recorded on a magnetic media can always be reproduced reliably, even in the case of high density recording.

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    83.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20110207294A1

    公开(公告)日:2011-08-25

    申请号:US13027551

    申请日:2011-02-15

    IPC分类号: H01L21/762

    摘要: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

    摘要翻译: 一种制造半导体器件的方法使得可以在抛光条件下,在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下,用研磨带有效地抛光硅衬底的周边部分。 该方法包括:在第一旋转速度旋转器件基板的同时,将第一研磨带压在具有沉积膜的器件基板的周边部分上,同时以第一转速旋转器件基板,从而去除位于器件基板周边部分的沉积膜 并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上,从而将所述硅抛光至预定的深度。

    Fluorine-containing polymer and resin composition
    85.
    发明授权
    Fluorine-containing polymer and resin composition 有权
    含氟聚合物和树脂组合物

    公开(公告)号:US07868112B2

    公开(公告)日:2011-01-11

    申请号:US12519347

    申请日:2007-12-17

    IPC分类号: C08F30/08

    摘要: A polymer containing: a constitutional unit A that is derived from fluorosilsesquioxane having one addition polymerizable functional group in a molecule; a constitutional unit B that is derived from organopolysiloxane having an addition polymerizable functional group; and a constitutional unit C that is derived from an addition polymerizable monomer and has a group having a polymerizable unsaturated bond on a side chain, and optionally containing a constitutional unit D that is derived from an addition polymerizable monomer other than the fluorosilsesquioxane having one addition polymerizable functional group in a molecule, the organopolysiloxane having an addition polymerizable functional group and the addition polymerizable monomer having a functional group capable of introducing a group having a polymerizable unsaturated bond.

    摘要翻译: 含有:分子内具有一个加成聚合官能团的氟代倍半硅氧烷的结构单元A的聚合物; 衍生自具有可加聚官能团的有机聚硅氧烷的结构单元B; 和由可加成聚合单体衍生的具有在侧链上具有聚合性不饱和键的基团的结构单元C,并且任选地含有来自除了具有一个可加聚可聚合的氟代倍半硅氧烷之外的可加聚单体的结构单元D 分子中的官能团,具有加聚性官能团的有机聚硅氧烷和具有能够引入具有聚合性不饱和键的基团的官能团的加成聚合性单体。

    Silicon compounds
    86.
    发明授权
    Silicon compounds 有权
    硅化合物

    公开(公告)号:US07863396B2

    公开(公告)日:2011-01-04

    申请号:US10548365

    申请日:2004-03-05

    IPC分类号: C08F130/08

    摘要: The present invention provides a silicon compound represented by Formula (1) and a polymer obtained by using the same, and this makes it possible not only to obtain an organic-inorganic composite material having a distinct structure but also to control the structure of the above polymer as a molecular aggregate. wherein R1 is a group independently selected from hydrogen, alkyl having a carbon atom number of 1 to 40, substituted or non-substituted aryl and substituted or non-substituted arylalkyl; in this alkyl having a carbon atom number of 1 to 40, optional hydrogens may be substituted with fluorine, and optional —CH2— may be substituted with —O—, —CH═CH—, cycloalkylene or cycloalkenylene; in alkylene in this arylalkyl, optional hydrogens may be substituted with fluorine, and optional —CH2— may be substituted with —O— or —CH═CH—; and A1 is a group having an α-haloester group.

    摘要翻译: 本发明提供由式(1)表示的硅化合物和使用它的聚合物,不仅可以获得具有不同结构的有机 - 无机复合材料,而且可以控制上述结构 聚合物作为分子聚集体。 其中R1是独立地选自氢,碳原子数为1至40的烷基,取代或未取代的芳基和取代或未取代的芳基烷基的基团; 在该碳原子数为1至40的烷基中,任选的氢可以被氟取代,并且任选的-CH 2 - 可以被-O - , - CH = CH-,亚环烷基或环亚烯基取代; 在该芳烷基中的亚烷基中,任选的氢可以被氟取代,并且任选的-CH 2 - 可以被-O-或-CH = CH-取代; A1为具有α-卤代基团的基团。

    Substrate processing method and substrate processing apparatus
    87.
    发明授权
    Substrate processing method and substrate processing apparatus 有权
    基板处理方法和基板处理装置

    公开(公告)号:US07767472B2

    公开(公告)日:2010-08-03

    申请号:US11882398

    申请日:2007-08-01

    IPC分类号: H01L21/00

    CPC分类号: B24B37/013 B24B9/065

    摘要: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

    摘要翻译: 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13,通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面,确定第一面的研磨终点 通过监测第一表面的抛光状态,根据确定抛光终点停止抛光,确定抛光所用的抛光时间,基于抛光时间确定周边部分的第二表面的抛光时间 第一表面,并抛光第二表面以确定抛光时间。

    POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    88.
    发明申请
    POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
    抛光设备和基板加工设备

    公开(公告)号:US20100136886A1

    公开(公告)日:2010-06-03

    申请号:US12699318

    申请日:2010-02-03

    摘要: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

    摘要翻译: 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括:用于在其中形成抛光室的壳体,用于保持和旋转基板的旋转台;抛光带供给机构,用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头,用于将液体供应到基板的前表面和后表面的液体供应源,以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

    FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION
    89.
    发明申请
    FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION 有权
    含氟聚合物和树脂组合物

    公开(公告)号:US20100093951A1

    公开(公告)日:2010-04-15

    申请号:US12519354

    申请日:2007-12-17

    IPC分类号: C08L83/06 C08G77/04 C08G77/14

    摘要: A polymer containing: a constitutional unit A that is derived from fluorosilsesquioxane having one addition polymerizable functional group in a molecule; a constitutional unit B that is derived from organopolysiloxane having an addition polymerizable functional group; and a constitutional unit C that is derived from an addition polymerizable functional monomer containing a group having active hydrogen, and optionally containing a constitutional unit D that is derived from an addition polymerizable monomer other than the fluorosilsesquioxane having one addition polymerizable functional group in a molecule, the organopolysiloxane having an addition polymerizable functional group and the addition polymerizable monomer containing a group having active hydrogen.

    摘要翻译: 含有:分子内具有一个加成聚合官能团的氟代倍半硅氧烷的结构单元A的聚合物; 衍生自具有可加聚官能团的有机聚硅氧烷的结构单元B; 和由含有具有活性氢的基团的加成聚合性官能单体衍生的结构单元C,并且任选地含有来自除了在分子中具有一个加成聚合官能团的氟代倍半硅氧烷以外的加聚性单体的结构单元D, 具有加聚性官能团的有机聚硅氧烷和含有具有活性氢的基团的加成聚合性单体。

    Substrate processing apparatus and substrate processing method
    90.
    发明申请
    Substrate processing apparatus and substrate processing method 审中-公开
    基板加工装置及基板处理方法

    公开(公告)号:US20090090397A1

    公开(公告)日:2009-04-09

    申请号:US12314197

    申请日:2008-12-05

    IPC分类号: B08B3/04

    摘要: The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.

    摘要翻译: 本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。 本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。 用于蚀刻的基板处理装置包括基板保持器11,用于基本上水平地保持基板W并旋转基板W;以及处理液体供应单元15,用于将处理液体供应到正在旋转的基板W的周边部分 处理液体相对于基板W是静止的。用于清洗基板的基板处理装置包括:基板保持件54,用于基本上水平地保持基板W并旋转基板W;以及清洗液供给部 单元53具有从基板W的中心朝向基板W的周边部分取向的清洗液出口53a,其与基板W的表面的仰角不大于45°。清洗液供给单元53 以不小于0.1m / s的流速将清洗液供给到基板W的表面。