公开(公告)号：US07767472B2

公开(公告)日：2010-08-03

申请号：US11882398

申请日：2007-08-01

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： H01L21/00

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20060019417A1

公开(公告)日：2006-01-26

申请号：US11187024

申请日：2005-07-22

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： H01L21/66 ,  H01L21/302

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20100255757A1

公开(公告)日：2010-10-07

申请号：US12819578

申请日：2010-06-21

申请人： Atsushi SHIGETA ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi SHIGETA ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： B24B49/10 ,  B24B49/16 ,  B24B21/12

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20070287364A1

公开(公告)日：2007-12-13

申请号：US11882398

申请日：2007-08-01

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： B24B7/00 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20050245174A1

公开(公告)日：2005-11-03

申请号：US11085495

申请日：2005-03-22

申请人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

发明人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

IPC分类号： B24B9/00 ,  B24B1/00 ,  B24B9/06 ,  B24B37/00 ,  B24D3/28 ,  H01L21/304

CPC分类号： B24B37/00 ,  B24B9/065 ,  B24D3/28

摘要： A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center.

摘要翻译： 公开了一种处理基板的方法，其中通过使用以轴线作为旋转中心可旋转的圆柱形抛光头来抛光形成在待处理基板的圆周部分中的切口部分的侧壁表面。

公开(公告)号：US20070178701A1

公开(公告)日：2007-08-02

申请号：US11730890

申请日：2007-04-04

申请人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

发明人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/02043 ,  B24B9/065 ,  B24B37/02 ,  H01L21/02021 ,  H01L21/30625

摘要： There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.

摘要翻译： 公开了一种处理基材的方法，该方法包括将表面活性剂或水溶性聚合物试剂涂布到待加工基材的表面上，并将基材的圆周部分和抛光部件相互滑动以使周向 部分基板。

公开(公告)号：US07241205B2

公开(公告)日：2007-07-10

申请号：US11085495

申请日：2005-03-22

申请人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

发明人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

IPC分类号： B24B1/00

CPC分类号： B24B37/00 ,  B24B9/065 ,  B24D3/28

摘要： A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center.

摘要翻译： 公开了一种处理基板的方法，其中通过使用以轴线作为旋转中心可旋转的圆柱形抛光头来抛光形成在待处理基板的圆周部分中的切口部分的侧壁表面。

公开(公告)号：US07217662B2

公开(公告)日：2007-05-15

申请号：US11088199

申请日：2005-03-24

申请人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

发明人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

IPC分类号： H01L21/461 ,  H01L21/302

CPC分类号： H01L21/02043 ,  B24B9/065 ,  B24B37/02 ,  H01L21/02021 ,  H01L21/30625

摘要： There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.

公开(公告)号：US20050221615A1

公开(公告)日：2005-10-06

申请号：US11088199

申请日：2005-03-24

申请人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

发明人： Gen Toyota ,  Atsushi Shigeta ,  Hiroyuki Yano

IPC分类号： B24B9/06 ,  B24B37/02 ,  H01L21/00 ,  H01L21/302 ,  H01L21/304 ,  H01L21/306 ,  H01L21/461 ,  H01L21/76

CPC分类号： H01L21/02043 ,  B24B9/065 ,  B24B37/02 ,  H01L21/02021 ,  H01L21/30625

摘要： There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.

摘要翻译： 公开了一种处理基材的方法，该方法包括将表面活性剂或水溶性聚合物试剂涂布到待加工基材的表面上，并将基材的圆周部分和抛光部件相互滑动以使周向 部分基板。

公开(公告)号：US08119517B2

公开(公告)日：2012-02-21

申请号：US12477332

申请日：2009-06-03

申请人： Hirotaka Shida ,  Yukiteru Matsui ,  Atsushi Shigeta ,  Shinichi Hirasawa ,  Hirokazu Kato ,  Masako Kinoshita ,  Takeshi Nishioka ,  Hiroyuki Yano

发明人： Hirotaka Shida ,  Yukiteru Matsui ,  Atsushi Shigeta ,  Shinichi Hirasawa ,  Hirokazu Kato ,  Masako Kinoshita ,  Takeshi Nishioka ,  Hiroyuki Yano

IPC分类号： H01L21/4763 ,  H01L21/461

CPC分类号： H01L21/7681 ,  C09G1/02 ,  H01L21/31058 ,  H01L21/31144 ,  H01L21/76835

摘要： A chemical mechanical polishing method comprises polishing an organic film using a slurry including polymer particles having a surface functional group and a water-soluble polymer.

摘要翻译： 化学机械抛光方法包括使用包含具有表面官能团的聚合物颗粒和水溶性聚合物的浆料来抛光有机膜。