公开(公告)号：US08445360B2

公开(公告)日：2013-05-21

申请号：US13027551

申请日：2011-02-15

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

公开(公告)号：US08641480B2

公开(公告)日：2014-02-04

申请号：US13036114

申请日：2011-02-28

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

IPC分类号： B24B1/00

CPC分类号： B24B1/00 ,  B24B55/00

摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

摘要翻译： 抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。 抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

公开(公告)号：US20110207294A1

公开(公告)日：2011-08-25

申请号：US13027551

申请日：2011-02-15

申请人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： H01L21/762

CPC分类号： H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括：在第一旋转速度旋转器件基板的同时，将第一研磨带压在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板周边部分的沉积膜 并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上，从而将所述硅抛光至预定的深度。

公开(公告)号：US20110217906A1

公开(公告)日：2011-09-08

申请号：US13036114

申请日：2011-02-28

申请人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

发明人： Masayuki NAKANISHI ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

IPC分类号： B24B1/00 ,  B24B55/00

CPC分类号： B24B1/00 ,  B24B55/00

摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

摘要翻译： 抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。 抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

公开(公告)号：US20110256811A1

公开(公告)日：2011-10-20

申请号：US13080821

申请日：2011-04-06

申请人： Masayuki NAKANISHI ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki NAKANISHI ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： B24B1/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/04 ,  B24B37/042

摘要： A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.

摘要翻译： 抛光方法可以获得良好的抛光轮廓，其例如不会导致半导体层从硅衬底剥离。 抛光方法包括：将抛光头定位在旋转基板的边缘部分中的抛光开始位置上方的位置; 降低抛光头的抛光工具，直到研磨工具与旋转基板的边缘部分中的抛光开始位置接触，并且抛光工具和抛光开始位置之间的压力达到设定压力; 允许抛光工具在抛光开始位置停留预定的时间量; 然后将抛光头朝向基板的周缘移动，同时保持抛光工具在旋转基板的边缘部分处于设定压力。

公开(公告)号：US09199352B2

公开(公告)日：2015-12-01

申请号：US12986481

申请日：2011-01-07

申请人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B21/00 ,  B24B37/27

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构，其构造成水平地保持基板并旋转基板和设置在基板的周边部分附近的至少一个抛光头。 抛光头具有沿着基板周向延伸的至少一个突出部，并且抛光头构造成通过突起抵靠基板的周边部分从上方或下方按压抛光带的抛光表面。

公开(公告)号：US20110237164A1

公开(公告)日：2011-09-29

申请号：US12986481

申请日：2011-01-07

申请人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。

公开(公告)号：US06578891B1

公开(公告)日：2003-06-17

申请号：US09612212

申请日：2000-07-07

申请人： Hiroo Suzuki ,  Kenya Ito ,  Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

发明人： Hiroo Suzuki ,  Kenya Ito ,  Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

IPC分类号： B25J1500

CPC分类号： H01L21/67259 ,  B25J13/086 ,  B25J15/00 ,  B25J19/021 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S294/907 ,  Y10S414/141

摘要： The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.

摘要翻译： 本发明提供了一种用于保持和转印薄基板的基板保持器，包括：具有用于放置薄基板的凹陷区域的基板支撑构件和形成在其周缘附近的凹陷区域中的基板安装部分。 基板安装部分适于与放置在凹陷区域中的基板的背面的外周部分接合。 衬底保持器还包括用于检测凹陷区域中的衬底的存在或不存在的衬底检测器。

公开(公告)号：US08506362B2

公开(公告)日：2013-08-13

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B7/26

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光 胶带沿其纵向行进。 压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

公开(公告)号：US07976361B2

公开(公告)日：2011-07-12

申请号：US12213186

申请日：2008-06-16

申请人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

发明人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

IPC分类号： B24B1/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/68707 ,  H01L21/68792

摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.

摘要翻译： 抛光装置适用于抛光半导体晶片等基板的周边。 抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。 抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动， 其枢轴在预定点。