公开(公告)号：US20150362908A1

公开(公告)日：2015-12-17

申请号：US14736250

申请日：2015-06-10

Applicant: KLA-Tencor Corporation

Inventor： Hucheng Lee ,  Lisheng Gao ,  Govindarajan Thattaisundaram

IPC: G05B19/401 ,  G05B19/406

Abstract: Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.

Abstract translation: 提供了用于监视晶片检查配方随时间的稳定性的系统和方法。 一种方法包括随时间收集检验结果。 检查结果由至少一个晶片检查工具产生，同时在不同的时间点对晶片进行晶片检查配方。 该方法还包括通过将在不同时间产生的检查结果相互比较来识别检查结果中的异常变化。 此外，该方法包括确定异常变化是否归因于晶片，晶片检查配方或至少一个晶片检查工具中的一个或多个，从而确定晶片检查配方是否随时间稳定。

公开(公告)号：US20150120220A1

公开(公告)日：2015-04-30

申请号：US14512446

申请日：2014-10-12

Applicant: KLA-Tencor Corporation

Inventor： Joanne Wu ,  Ellis Chang ,  Lisheng Gao ,  Satya Kurada ,  Allen Park ,  Raghav Babulnath

IPC: G01N21/95

CPC classification number: H01L22/12 ,  G01N21/8851 ,  G01N21/956 ,  H01L22/14 ,  H01L22/20

Abstract: Methods and systems for detecting reliability defects on a wafer are provided. One method includes acquiring output for a wafer generated by an inspection system. The method also includes determining one or more geometric characteristics of one or more patterned features formed on the wafer based on the output. In addition, the method includes identifying which of the one or more patterned features will cause one or more reliability defects in a device being formed on the wafer based on the determined one or more characteristics.

Abstract translation: 提供了用于检测晶片上的可靠性缺陷的方法和系统。 一种方法包括获取由检查系统产生的晶片的输出。 该方法还包括基于输出来确定在晶片上形成的一个或多个图案特征的一个或多个几何特征。 此外，该方法包括基于所确定的一个或多个特性来识别一个或多个图案化特征中的哪一个将导致在晶片上形成的器件中的一个或多个可靠性缺陷。

公开(公告)号：US20150043804A1

公开(公告)日：2015-02-12

申请号：US14450170

申请日：2014-08-01

Applicant: KLA-Tencor Corporation

Inventor： Junqing Huang ,  Hucheng Lee ,  Kenong Wu ,  Lisheng Gao

IPC: G06T7/00 ,  G06T7/40

CPC classification number: G06T7/0008 ,  G06T7/0006 ,  G06T7/90 ,  G06T2207/10024 ,  G06T2207/20024 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a. wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.

Abstract translation: 提供了使用自适应局部阈值和颜色滤波来检测晶片上的缺陷的方法和系统。 一种方法包括确定a的输出中的像素的局部统计。 使用检查系统生成的晶片，基于本地统计确定哪个像素是异常值，以及将异常值与异常值周围的像素进行比较，以将不属于异常值聚类的异常值识别为缺陷候选。 该方法还包括确定缺陷候选的像素与围绕缺陷候选的像素之间的颜色差异的值。 该方法还包括将具有大于或等于预定值的颜色差值的缺陷候选识别为具有小于预定值的颜色差值作为真实缺陷的有害缺陷和缺陷候选。

公开(公告)号：US20140376802A1

公开(公告)日：2014-12-25

申请号：US14168011

申请日：2014-01-30

Applicant: KLA-TENCOR CORPORATION

Inventor： Kenong Wu ,  Tao Luo ,  Lisheng Gao ,  Eugene Shifrin ,  Aravindh Balaji

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于晶片图案确定晶片护理区域的特征。 确定特征包括确定护理区域的位置，为每个护理区域确定晶片图案中的至少一种感兴趣模式（POI），允许任何护理区域具有自由形状，允许护理区域 大于框架图像并且为至少一个护理区域选择两个或更多个POI。 该方法还包括使用检查系统搜索为晶片生成的图像中的POI。 此外，该方法包括通过确定图像中的护理区域的位置并基于图像中的护理区域的位置将一个或多个缺陷检测方法应用于图像来检测晶片上的缺陷。

公开(公告)号：US20140307947A1

公开(公告)日：2014-10-16

申请号：US14251415

申请日：2014-04-11

Applicant: KLA-Tencor Corporation

Inventor： Satya Kurada ,  Raghav Babulnath ,  Kwok Ng ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95676 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/10 ,  G01N2201/12 ,  G06K9/00 ,  G06K9/66 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.

Abstract translation: 提供了用于产量关键缺陷的基于设计的抽样和装箱的方法和系统。 一种方法包括通过检查系统的光学子系统对于为晶片生成的每个检查图像帧中的每个图像补片进行对准以设计晶片的信息。 该方法还包括在图像斑块中检测到的缺陷位置导出多层设计属性。 另外，该方法包括使用多层设计属性构建决策树。 决策树用于将缺陷分离成对晶片上形成的器件产生不同产量的影响。 该方法还包括使用决策树将缺陷合并。

公开(公告)号：US20140270474A1

公开(公告)日：2014-09-18

申请号：US13796955

申请日：2013-03-12

Applicant: KLA-Tencor Corporation

Inventor： Junqing Huang ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G01N21/88 ,  G01N21/8803 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8825 ,  G06T7/0002 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining difference values for pixels in first output for a wafer generated using a first optics mode of an inspection system and determining other values for pixels in second output for the wafer generated using a second optics mode of the inspection system. The first and second optics modes are different from each other. The method also includes generating a two-dimensional scatter plot of the difference values and the other values for the pixels in the first and second output corresponding to substantially the same locations on the wafer. The method further includes detecting defects on the wafer based on the two-dimensional scatter plot.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括确定使用检查系统的第一光学模式产生的晶片的第一输出中的像素的差值，并且使用检查系统的第二光学模式确定晶片的第二输出中的像素的其它值。 第一和第二光学模式彼此不同。 该方法还包括生成对应于晶片上基本上相同位置的第一和第二输出中的差值和其它值的二维散点图。 该方法还包括基于二维散点图检测晶片上的缺陷。

公开(公告)号：US20140185919A1

公开(公告)日：2014-07-03

申请号：US13733133

申请日：2013-01-02

Applicant: KLA-Tencor Corporation

Inventor： Jun Lang ,  Kan Chen ,  Lisheng Gao ,  Junqing Huang

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8867 ,  G03F7/70616 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/10152 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括识别对应于晶片上形成的图案化特征的一个或多个几何特征的晶片产生的第一原始输出的一个或多个特征，并且基于所识别的将针对晶片生成的第二原始输出中的各个输出分配给不同的段 第一原始输出的一个或多个特征，并且基于第二原始输出中的单独输出和在第一原始输出中在晶片上的基本相同位置处产生的单独输出，使得图案化的一个或多个几何特征 对应于第二原始输出中的每个不同段的特征是不同的。