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公开(公告)号：US20190304854A1
公开(公告)日：2019-10-03
申请号：US16369802
申请日：2019-03-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK
IPC: H01L21/66 , H01L25/075
Abstract: The present invention relates to an inspection and replacement method for a micro LED, the method being configured to inspect whether the micro LED is defective and replace a defective micro LED with a normal micro LED. More particularly, the present invention relates to an inspection and replacement method for a micro LED in which when micro LEDs are transferred to a display substrate, the micro LEDs are inspected so as to detect and remove a defective micro LED, and a normal micro LED is placed at a position where the defective micro LED is removed so as to be replaced with the defective micro LED.
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公开(公告)号：US20190189487A1
公开(公告)日：2019-06-20
申请号：US16216376
申请日：2018-12-11
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho Park , Sung Hyun BYUN
IPC: H01L21/677 , H01L25/075 , H01L33/06 , H01L33/00 , H01L27/15 , H01L33/44 , H01L33/40 , H01L33/42 , H01L21/683
CPC classification number: H01L21/67712 , H01L21/6838 , H01L25/0753 , H01L27/153 , H01L33/0079 , H01L33/06 , H01L33/405 , H01L33/42 , H01L33/44 , H01L2933/0016
Abstract: Disclosed is a transfer head for transferring micro-LEDs from a first substrate to a second substrate, particularly, using a vacuum adsorption method. The transfer head includes a porous member having a plurality of pores, in which the micro-LEDs are transferred by creating or releasing a vacuum pressure in the pore of the porous member.
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公开(公告)号：US20190165219A1
公开(公告)日：2019-05-30
申请号：US16198383
申请日：2018-11-21
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Disclosed is a substrate for an optical device. The substrate has a cavity for mounting an optical element. The cavity has a sloped wall surface having a surface roughness Ra controlled to fall within a range of 1 nm≤Ra≤100 nm, thereby increasing the surface reflectance inside the cavity in which the optical element is mounted and thus minimizing the loss of light emitted from the optical element. Further disclosed is an optical device package including the same substrate.
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公开(公告)号：US20180074033A1
公开(公告)日：2018-03-15
申请号：US15702666
申请日：2017-09-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.
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公开(公告)号：US20180045664A1
公开(公告)日：2018-02-15
申请号：US15674463
申请日：2017-08-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01N27/12
CPC classification number: G01N27/128 , G01N27/123
Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.
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Patent Agency Ranking
公开(公告)号：US20180045663A1
公开(公告)日：2018-02-15
申请号：US15674127
申请日：2017-08-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
CPC classification number: G01N27/128 , G01N33/0016 , G01N33/0031
Abstract: Disclosed is a micro sensor. Particularly, a first sensor electrode is provided on a first side of a substrate, a second sensor electrode is provided on a second side of the substrate, and the substrate is provided with an etching hole penetrating from the first side to the second side of the substrate. A sensing material provided between the first sensor electrode and the second sensor electrode is inserted in the etching hole. When detecting gas, the micro sensor can minimize influence of moisture in air.
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公开(公告)号：US20160035489A1
公开(公告)日：2016-02-04
申请号：US14816182
申请日：2015-08-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK
Abstract: The present invention relates to a multi-layered aluminum oxide capacitor comprising an aluminum substrate; a plurality of aluminum oxide layer formed in at least a portion of on both sides or one side of the substrate with respect to the aluminum substrate; and a plurality of electrode layers formed on the aluminum oxide layers. According to the present invention, manufacturing process is more simplified since Al2O3 insulation layer is formed by anodizing the aluminum layer without forming an extra insulation layer after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-layered capacitor having a high capacitance and a high reliability can be provided by stacking capacitors comprising a plurality of aluminum oxide layers using a more simplified process according to the present invention.
Abstract translation: 本发明涉及包含铝基板的多层氧化铝电容器; 多个氧化铝层，相对于铝基板在基板的两侧或一侧的至少一部分上形成; 以及形成在氧化铝层上的多个电极层。 根据本发明，由于通过在形成铝层之后不形成额外的绝缘层来阳极氧化铝层来形成Al 2 O 3绝缘层，所以制造工艺更简化，从而可以降低制造成本，并且还可以使用多层电容器 可以通过使用根据本发明的更简化的工艺堆叠包含多个氧化铝层的电容器来提供高电容和高可靠性。
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公开(公告)号：US20240426871A1
公开(公告)日：2024-12-26
申请号：US18684829
申请日：2022-07-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Proposed is a vertical probe card capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.
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公开(公告)号：US20240274564A1
公开(公告)日：2024-08-15
申请号：US18567363
申请日：2022-06-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/11 , H01L2224/1111 , H01L2224/11462 , H01L2224/13012 , H01L2224/13014 , H01L2224/13018 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1318 , H01L2224/13181 , H01L2224/13184
Abstract: The present invention relates to a micro bump, which is capable of coping with a narrow pitch between terminals and preventing an increase in current density and thermal energy density at a bump connection portion, and to an interposer for electrical connection having same, a semiconductor package, a multi-layer stacked semiconductor device, and a display. The micro bump may be manufactured using: an electrically conductive material part forming step of forming an electrically conductive material part inside a through hole provided in a body made of an anodized film; and a bonding material part forming step of forming a bonding material part on at least a portion of an upper portion and a lower portion of the electrically conductive material part.
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公开(公告)号：US20240159795A1
公开(公告)日：2024-05-16
申请号：US18284066
申请日：2022-03-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Chang Hee HONG
IPC: G01R1/04
CPC classification number: G01R1/0466
Abstract: Proposed is an electrically conductive contact pin, including a pin portion including a first contact portion, a second contact portion, and an elastic portion between the first contact portion and the second contact portion, a fixing portion provided outside the pin portion, and a connecting portion provided between the pin portion and the fixing portion to connect the pin portion and the fixing portion to each other.
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