Method for manufacturing semiconductor device
    82.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08772771B2

    公开(公告)日:2014-07-08

    申请号:US13870370

    申请日:2013-04-25

    Inventor: Tetsuhiro Tanaka

    CPC classification number: H01L29/66742 H01L27/1225 H01L29/78642 H01L29/7869

    Abstract: Miniaturized transistors having high and stable electric characteristics using high precision microfabrication are provided with high yield. Further, high performance, high reliability, and high productivity also of a semiconductor device including the transistor are achieved. A semiconductor device includes a vertical transistor in which a first electrode layer, a first oxide film containing indium, gallium, zinc, and nitrogen as main components, an oxide semiconductor film containing indium, gallium, and zinc as main components, a second oxide film containing indium, gallium, zinc, and nitrogen as main components, and a second electrode layer are stacked in this order, and a first gate insulating film and a first gate electrode layer are provided at one side of the columnar oxide semiconductor film and a second gate insulating film and a second gate electrode layer are provided at the other side of the columnar oxide semiconductor film.

    Abstract translation: 具有高精度微细加工的高稳定电特性的小型化晶体管以高产率被提供。 此外,实现了包括晶体管的半导体器件的高性能,高可靠性和高生产率。 半导体器件包括垂直晶体管,其中第一电极层,包含铟,镓,锌和氮作为主要成分的第一氧化物膜,以铟,镓和锌为主要成分的氧化物半导体膜,第二氧化物膜 含有铟,镓,锌和氮作为主要成分,第二电极层依次层叠,第一栅极绝缘膜和第一栅电极层设置在柱状氧化物半导体膜的一侧, 栅极绝缘膜和第二栅电极层设置在柱状氧化物半导体膜的另一侧。

    Semiconductor device and manufacturing method of semiconductor device

    公开(公告)号:US10217870B2

    公开(公告)日:2019-02-26

    申请号:US14926737

    申请日:2015-10-29

    Abstract: A highly reliable semiconductor device including an oxide semiconductor is provided. Oxygen is supplied from a base insulating layer provided below an oxide semiconductor layer to a channel formation region, whereby oxygen vacancies which might be generated in the channel formation region are filled. Further, a protective insulating layer containing a small amount of hydrogen and functioning as a barrier layer having a low permeability to oxygen is formed over the gate electrode layer so as to cover side surfaces of an oxide layer and a gate insulating layer that are provided over the oxide semiconductor layer, whereby release of oxygen from the gate insulating layer and/or the oxide layer is prevented and generation of oxygen vacancies in a channel formation region is prevented.

    Semiconductor device
    87.
    发明授权

    公开(公告)号:US10141337B2

    公开(公告)日:2018-11-27

    申请号:US15723227

    申请日:2017-10-03

    Abstract: A nitride insulating film which prevents diffusion of hydrogen into an oxide semiconductor film in a transistor including an oxide semiconductor is provided. Further, a semiconductor device which has favorable electrical characteristics by using a transistor including a silicon semiconductor and a transistor including an oxide semiconductor is provided. Two nitride insulating films having different functions are provided between the transistor including a silicon semiconductor and the transistor including an oxide semiconductor. Specifically, a first nitride insulating film which contains hydrogen is provided over the transistor including a silicon semiconductor, and a second nitride insulating film which has a lower hydrogen content than the first nitride insulating film and functions as a barrier film against hydrogen is provided between the first nitride insulating film and the transistor including an oxide semiconductor.

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