Abstract:
A system for optimizing analog circuit designs includes an input device, a data processing device, and a data storage device. The data processing device includes a selecting module, a calculation module, and a determining module. The selecting module is for receiving input from the input device and selecting electronic components composing the circuit from the data storage device. The calculation module is for calculating average values and standard deviations of each electronic component, generating normal distribution samples of each electronic component, and calculating output voltages of the circuit. The determining module is for determining whether the circuit meets a process capability standard.
Abstract:
A printed circuit board includes a plurality of differential pairs arranged thereon side-by-side. Each differential pair includes two transmission lines. Each transmission line includes a plurality of sections of equal length. Every two adjacent sections in each transmission line meet at an angle, and all angles are equal. The length of each section is determined by dividing the distance between two corresponding angles of the two transmission lines of each differential pair by the cosine of half of the angle.
Abstract:
A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.
Abstract:
A method for evaluating a temperature rise of a printed circuit board (PCB) trace receives a plurality of attribute parameters of the PCB trace. A temperature rise formula is determined for the PCB trace. The method further calculates the temperature rise by applying the temperature rise formula, and outputs the temperature rise.
Abstract:
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.
Abstract:
A motherboard includes a chipset, a first connector pad suitable for receiving a first type of PCI connector, a second connector pad suitable for receiving a second type of PCI connector, a plurality of first transmission lines, a plurality of second transmission lines, and a plurality of areas for mounting switches. One end of each first transmission line is connected to the chipset, another end of each first transmission line is connected to an end of a corresponding area, one end of each second transmission line is connected to another end of the corresponding area, another end of each second transmission line is connected to the second connector pad, the first connector pad is connected to the plurality of first transmission lines, and the switches are selectively mounted on the plurality of areas.
Abstract:
A printed circuit board includes a first signal layer, a second signal layer, a plurality of transmission lines respectively including first segments laid in parallel on the first signal layer and second segments laid in parallel on the second signal layer, and a plurality of vias, each via connecting the first segment with the second segment of a corresponding transmission line. One of the plurality of transmission lines has the first segment positioned in the middle of an array defined by the first segments of the plurality of transmission lines, and a second segment positioned in an outmost position of an array defined by the second segments of the plurality of transmission lines. The printed circuit board reduces the possibility of false action of electronic components coupled to transmission lines, which is caused by the crosstalk between transmission lines.
Abstract:
A printed circuit board (PCB) includes at least one signal layer, a ground layer, at least two signal lines, and at least one grounded line. The signal lines are arranged on the signal layer for transmitting signals. The grounded line is arranged on the signal layer and between the signal lines. A plurality of vias are defined in the grounded line, and the vias are connected to the ground layer. A distance between each two adjacent vias is so arranged that a resonant frequency of an electromagnetic wave transmitted on the grounded line must greater than a highest frequency of the signals transmitted on the signal lines. A related method for designing the PCB is also provided.
Abstract:
A signal transmission line used in a printed circuit board (PCB), the signal transmission line comprises a driving terminal for driving a signal, a contact portion, the signal line connected with the driving terminal and the contact portion to transmit the signal wherein a length of the signal line is so arranged that a time for the signal transmitted from the driving terminal to the contact portion is not less than half of a time for the transmitted signal to reach a receiving terminal.
Abstract:
A computer-based method and a computing device for checking stub lengths of via stubs of a printed circuit board (PCB) layout are provided. The computing device displays a check interface, selects signal transmission line from a currently run PCB layout through the check interface, receives a reference stub length input through the check interface, and determines the actual stub length of each via stub of each via each selected signal transmission line connected to. The computing device further determines that a design of one via stub satisfies the design standards, if the actual stub length of the one stub via is less than or equal to the reference length, and determines that a design of one via stub does not satisfy the design standards if the actual stub length of the one via stub is greater than the reference stub length.