Leakage power estimation
    81.
    发明申请
    Leakage power estimation 审中-公开
    泄漏功率估计

    公开(公告)号:US20080103708A1

    公开(公告)日:2008-05-01

    申请号:US11549165

    申请日:2006-10-13

    IPC分类号: G06F19/00 G06F17/40

    摘要: Methods and apparatus provide for estimating leakage power as a function of delay times. Delay times and leakage power values may be measured for a test circuit of a given circuit design. A statistical sampling of the measurements may be obtained for the test circuit. The delay data and leakage power data may be correlated to express and estimate leakage power as a function of delay distribution. The test circuit may include a proposed circuit that is simulated, and the method and apparatus also may provide for: creating a schematic design of the test circuit, having, for example, defined poly gate lengths, on-chip devices, and power sources; incorporating a delay chain into the schematic design to get delay distribution data; and utilizing the schematic design, wherein the utilitzation may be a simulation.

    摘要翻译: 方法和装置提供了估计泄漏功率作为延迟时间的函数。 对于给定电路设计的测试电路,可以测量延迟时间和漏电功率值。 测试电路可以获得测量的统计采样。 可以将延迟数据和泄漏功率数据相关联以表示和估计作为延迟分布的函数的泄漏功率。 测试电路可以包括被仿真的所提出的电路,并且该方法和装置还可以提供:创建测试电路的示意性设计,具有例如限定的多栅极长度,片上器件和电源; 将延迟链结合到原理图设计中以获得延迟分布数据; 并且利用示意图设计,其中该功能可以是模拟。

    FinFET TRANSISTOR AND CIRCUIT
    82.
    发明申请
    FinFET TRANSISTOR AND CIRCUIT 有权
    FinFET晶体管和电路

    公开(公告)号:US20080099795A1

    公开(公告)日:2008-05-01

    申请号:US11969339

    申请日:2008-01-04

    IPC分类号: H01L29/04 H01L21/336

    摘要: A drive strength tunable FinFET, a method of drive strength tuning a FinFET, a drive strength ratio tuned FinFET circuit and a method of drive strength tuning a FinFET, wherein the FinFET has either at least one perpendicular and at least one angled fin or has at least one double-gated fin and one split-gated fin.

    摘要翻译: 驱动强度可调谐FinFET,FinFET的驱动强度调谐方法,驱动强度比调谐FinFET电路和FinFET的驱动强度调谐方法,其中FinFET具有至少一个垂直和至少一个成角度的鳍或具有 最少一个双门翅和一个分闸门。

    Modified cellulose films
    83.
    发明申请
    Modified cellulose films 审中-公开
    改性纤维素膜

    公开(公告)号:US20080091007A1

    公开(公告)日:2008-04-17

    申请号:US11999545

    申请日:2007-12-06

    摘要: A hydroxypropyl methyl cellulose film comprises hydroxypropyl methyl cellulose plasticised with a plasticiser comprising a fruit acid or a salt or a fruit acid, preferably lactic acid. The film is safe for human consumption and finds use as a wall material of an ingestible delivery capsule, e.g. containing a dose of a pharmaceutical preparation.

    摘要翻译: 羟丙基甲基纤维素膜包括用包含果酸或盐或果酸,优选乳酸的增塑剂增塑的羟丙基甲基纤维素。 该片对于人类消费是安全的,并且被用作可摄取递送胶囊的壁材料,例如, 含有一定剂量的药物制剂。

    CORNER DOMINATED TRIGATE FIELD EFFECT TRANSISTOR
    84.
    发明申请
    CORNER DOMINATED TRIGATE FIELD EFFECT TRANSISTOR 有权
    角陶瓷触发场效应晶体管

    公开(公告)号:US20080090361A1

    公开(公告)日:2008-04-17

    申请号:US11866435

    申请日:2007-10-03

    IPC分类号: H01L21/336

    摘要: Disclosed are embodiments of a trigate field effect transistor that comprises a fin-shaped semiconductor body with a channel region and source/drain regions on either side of the channel region. Thick gate dielectric layers separate the top surface and opposing sidewalls of the channel region from the gate conductor in order to suppress conductivity in the channel planes. A thin gate dielectric layer separates the upper corners of the channel region from the gate conductor in order to optimize conductivity in the channel corners. To further emphasize the current flow in the channel corners, the source/drain regions can be formed in the upper corners of the semiconductor body alone. Alternatively, source/drain extension regions can be formed only in the upper corners of the semiconductor body adjacent to the gate conductor and deep source/drain diffusion regions can be formed in the ends of the semiconductor body.

    摘要翻译: 公开了一种触发场效应晶体管的实施例,其包括具有沟道区的鳍状半导体本体和沟道区两侧的源极/漏极区。 厚栅电介质层将沟道区的顶表面和相对的侧壁与栅极导体分开,以便抑制沟道平面中的导电性。 薄栅极电介质层将沟道区的上角与栅极导体分开,以便优化沟道角中的导电性。 为了进一步强调通道角中的电流流动,源极/漏极区域可以单独形成在半导体主体的上角部。 或者,源极/漏极延伸区域仅可以形成在与栅极导体相邻的半导体本体的上角处,并且可以在半导体本体的端部形成深的源极/漏极扩散区域。

    FIN-TYPE FIELD EFFECT TRANSISTOR
    85.
    发明申请
    FIN-TYPE FIELD EFFECT TRANSISTOR 有权
    FIN型场效应晶体管

    公开(公告)号:US20080087968A1

    公开(公告)日:2008-04-17

    申请号:US11955579

    申请日:2007-12-13

    申请人: Edward Nowak

    发明人: Edward Nowak

    IPC分类号: H01L29/78

    摘要: Disclosed herein are improved fin-type field effect transistor (FinFET) structures and the associated methods of manufacturing the structures. In one embodiment FinFET drive current is optimized by configuring the FinFET asymmetrically to decrease fin resistance between the gate and the source region and to decrease capacitance between the gate and the drain region. In another embodiment device destruction at high voltages is prevented by ballasting the FinFET. Specifically, resistance is optimized in the fin between the gate and both the source and drain regions (e.g., by increasing fin length, by blocking source/drain implant from the fin, and by blocking silicide formation on the top surface of the fin) so that the FinFET is operable at a predetermined maximum voltage.

    摘要翻译: 本文公开了改进的鳍式场效应晶体管(FinFET)结构以及相关的制造结构的方法。 在一个实施例中,通过非限制地配置FinFET来优化FinFET驱动电流,以减小栅极和源极区域之间的鳍电阻并降低栅极和漏极区域之间的电容。 在另一个实施例中,通过对FinFET进行镇流器来防止在高电压下的破坏。 具体来说,在栅极和源极和漏极区域之间的鳍片(例如,通过增加鳍片长度,通过阻挡来自鳍片的源极/漏极注入以及通过阻挡鳍片的顶部表面上的硅化物)来优化电阻),因此 FinFET可在预定的最大电压下工作。

    PLANAR DUAL-GATE FIELD EFFECT TRANSISTORS (FETs)
    86.
    发明申请
    PLANAR DUAL-GATE FIELD EFFECT TRANSISTORS (FETs) 审中-公开
    平面双门场效应晶体管(FET)

    公开(公告)号:US20080036000A1

    公开(公告)日:2008-02-14

    申请号:US11876830

    申请日:2007-10-23

    IPC分类号: H01L29/786 H01L21/336

    摘要: A semiconductor structure and the associated method for fabricating the same. The semiconductor structure includes (a) a semiconductor substrate, (b) a back gate region on the semiconductor substrate, (c) a back gate dielectric region on the back gate region, (d) a semiconductor region on the back gate dielectric region comprising a channel region disposed between first and second source/drain (S/D) regions, (e) a main gate dielectric region on the semiconductor region, (f) a main gate region on the main gate dielectric region, (g) a first contact pad adjacent to the first S/D region and electrically insulated from the back gate region, and (h) a first buried dielectric region that physically and electrically isolates the first contact pad and the back gate region, and wherein the first buried dielectric region has a first thickness in the first direction at least 1.5 times a second thickness of the back gate region.

    摘要翻译: 半导体结构及其制造方法。 半导体结构包括(a)半导体衬底,(b)半导体衬底上的背栅区,(c)背栅区上的背栅电介质区,(d)背栅电介质区上的半导体区,包括 设置在第一和第二源极/漏极(S / D)区域之间的沟道区域,(e)半导体区域上的主栅极电介质区域,(f)主栅极电介质区域上的主栅极区域,(g) 接触垫,其与所述第一S / D区相邻并且与所述背栅区电绝缘,以及(h)物理地和电隔离所述第一接触焊盘和所述背栅区的第一掩埋介电区,并且其中所述第一掩埋介电区 在第一方向上具有至少1.5倍于后栅极区域的第二厚度的第一厚度。

    Dynamic control of back gate bias in a FinFET SRAM cell
    87.
    发明申请
    Dynamic control of back gate bias in a FinFET SRAM cell 失效
    FinFET SRAM单元中背栅偏置的动态控制

    公开(公告)号:US20070242497A1

    公开(公告)日:2007-10-18

    申请号:US11402400

    申请日:2006-04-12

    IPC分类号: G11C11/00

    CPC分类号: G11C11/412

    摘要: The present invention provides dynamic control of back gate bias on pull-up pFETs in a FinFET SRAM cell. A method according to the present invention includes providing a bias voltage to a back gate of at least one transistor in the SRAM cell, and dynamically controlling the bias voltage based on an operational mode (e.g., Read, Half-Select, Write, Standby) of the SRAM cell.

    摘要翻译: 本发明提供对FinFET SRAM单元中的上拉pFET的背栅极偏置的动态控制。 根据本发明的方法包括向SRAM单元中的至少一个晶体管的背栅提供偏置电压,并且基于操作模式(例如,读取,半选择,写入,待机)动态地控制偏置电压, 的SRAM单元。

    ULTRA-THIN LOGIC AND BACKGATED ULTRA-THIN SRAM
    88.
    发明申请
    ULTRA-THIN LOGIC AND BACKGATED ULTRA-THIN SRAM 失效
    超薄逻辑和背面超薄SRAM

    公开(公告)号:US20070187769A1

    公开(公告)日:2007-08-16

    申请号:US11276135

    申请日:2006-02-15

    IPC分类号: H01L21/337 H01L29/94

    摘要: Disclosed are embodiments of a structure that comprises a first device, having multiple FETs, and a second device, having at least one FET. Sections of a first portion of a semiconductor layer below the first device are doped and contacted to form back gates. A second portion of the semiconductor layer below the second device remains un-doped and un-contacted and, thus, functions as an insulator. Despite the performance degradation of the first device due to back gate capacitance, the back gates result in a net gain for devices such as, SRAM cells, which require precise Vt control. Contrarily, despite marginal Vt control in the second device due to the absence of back gates, the lack of capacitance loading and the added insulation result in a net gain for high performance devices such as, logic circuits.

    摘要翻译: 公开了包括具有多个FET的第一器件和具有至少一个FET的第二器件的结构的实施例。 第一器件下方的半导体层的第一部分的部分被掺杂并接触以形成后栅极。 第二器件下方的半导体层的第二部分保持未掺杂和未接触,并因此用作绝缘体。 尽管由于背栅电容而导致第一器件的性能下降,但是后栅导致需要精确Vt控制的诸如SRAM单元的器件的净增益。 相反,尽管由于不存在后门而导致第二器件中的边缘Vt控制,但由于缺少电容负载和增加的绝缘,导致高性能器件(如逻辑电路)的净增益。

    Films for use as dosage forms
    89.
    发明申请
    Films for use as dosage forms 审中-公开
    用作剂型的胶片

    公开(公告)号:US20070184099A1

    公开(公告)日:2007-08-09

    申请号:US10590038

    申请日:2005-02-18

    申请人: Edward Nowak

    发明人: Edward Nowak

    IPC分类号: A61K9/48 A61K9/24

    CPC分类号: A61K9/006 A61K9/7007

    摘要: Non gelatin film materials e.g. films of modified cellulose materials find use as dosage forms. Substances are incorporated into the film matrix and films thus prepared may be administered really, or otherwise internally, or epidermally. The administable form may comprise a matrix which contains at least one water soluble polymer in the form of a film, in addition to at least one active ingredient, to produce a therapeutic, organoleptic or cosmetic effect.

    摘要翻译: 非明胶膜材料 改性纤维素材料的薄膜可用作剂型。 物质被并入到膜基质中,并且由此制备的膜可以真正地或以其他方式在内部或在表皮上施用。 施用形式可以包含除了至少一种活性成分之外还含有至少一种薄膜形式的水溶性聚合物以产生治疗,感官或美容效果的基质。

    LOW-CAPACITANCE CONTACT FOR LONG GATE-LENGTH DEVICES WITH SMALL CONTACTED PITCH
    90.
    发明申请
    LOW-CAPACITANCE CONTACT FOR LONG GATE-LENGTH DEVICES WITH SMALL CONTACTED PITCH 有权
    低电容连接器用于具有小型接触器的长门设备

    公开(公告)号:US20070158762A1

    公开(公告)日:2007-07-12

    申请号:US11275513

    申请日:2006-01-11

    IPC分类号: H01L29/76 H01L21/336

    摘要: Disclosed are planar and non-planar field effect transistor (FET) structures and methods of forming the structures. The structures comprise segmented active devices (e.g., multiple semiconductor fins for a non-planar transistor or multiple semiconductor layer sections for a planar transistor) connected at opposite ends to source/drain bridges. A gate electrode is patterned on the segmented active devices between the source/drain bridges such that it has a reduced length between the segments (i.e., between the semiconductor fins or sections). Source/drain contacts land on the source/drain bridges such that they are opposite only those portions of the gate electrode with the reduced gate length. These FET structures can be configured to simultaneously maximize the density of the transistor, minimize leakage power and maintain the parasitic capacitance between the source/drain contacts and the gate conductor below a preset level, depending upon the performance and density requirements.

    摘要翻译: 公开了平面和非平面场效应晶体管(FET)结构和形成结构的方法。 这些结构包括在源极/漏极桥两端连接的分段有源器件(例如,用于非平面晶体管的多个半导体鳍片或用于平面晶体管的多个半导体层部分)。 在源极/漏极桥之间的分段有源器件上图案化栅电极,使得栅极电极在段之间(即,半导体鳍片或部分之间)具有减小的长度。 源极/漏极接触器接地在源/漏极桥上,使得它们仅与具有减小的栅极长度的栅电极的那些部分相对。 这些FET结构可以被配置为同时使晶体管的密度最大化,从而使漏极功率最小化,并且将源极/漏极触点和栅极导体之间​​的寄生电容保持在预定值以下,这取决于性能和密度要求。