摘要:
On a transparent substrate to which a gate electrode is arranged, a silicon nitride film and a silicon oxide film to be gate insulating films are deposited, and further, a polycrystalline silicon film as a semiconductor film to be an active region is formed. On the polycrystalline silicon film corresponding to the gate electrode, a stopper is arranged, and a silicon oxide film and a silicon nitride film to be an interlayer insulating films are deposited so as to cover this stopper. The film thickness T0 of the stopper is set in a range of 800 angstroms to 1200 angstroms. Furthermore, the film thickness T0 of the stopper is set in the range to fulfill the following expression: T0+T1≦(T2×8000 Å) where T1 is the film thickness of the silicon oxide film and T2 is the film thickness of the silicon nitride film.
摘要:
In an organic electroluminescence (EL) display, a TFT (40) and an organic EL element (60) are formed on an insulating substrate (10) such as a glass substrate. The contact portion between the first electrode region (e.g. the source 43s) of the active layer (43) of the TFT (40) and the organic EL element (60) is formed of a laminated structure. The laminated structure is formed of the structure stacked in layers with p-si forming the source (43s), a refractory metal (Mo), aluminum, a refractory metal (Mo), and ITO forming the anode 61. The reliable contact between the source 43s and the anode 61 can prevent variations in brightness and early degradation in characteristic of the TFT 40 and the organic EL element 60.
摘要:
Side faces of anodes have a tapered incline that becomes broader toward a lower layer. Thus, an emissive element layer is smoothly formed on the anodes making it possible to prevent field contraction of the electric field. An EL display apparatus having long life and high yield is provided by preventing the emissive element layer from rupturing between an anode and a cathode and by preventing concentration of the electric field at an upper edge of the anode facing the cathode and localized deterioration in the emissive element layer.
摘要:
In an active matrix type EL device, a semiconductor layer (intersection protective film F1, F2, F3, F4) is inserted between lines at an intersection of a gate line GL and a data line DL; an intersection of the gate line GL and a power source line VL; an intersection of a storage capacitor line CL and the data line DL; and an intersection of the storage capacitor line CL and the power source line VL for inter-line insulation. No impurities are doped in the regions corresponding to these intersections CR1˜CR4, to thereby maintain high resistance. The intersection protective films are integrally formed for the intersections CR1 and CR2 and for the intersections CR3 and CR4 and extend over the respective two intersections. With the above-described structure, it is possible to prevent short circuit or deterioration of voltage withstanding characteristics at the intersections on the panel where lines intersect, without a drastic increase in the number of processes.
摘要:
An emissive element layer (65) composed of an organic compound is formed on an anode (61) of an organic EL element or the like, using an evaporation mask (150) in which the width d of an opening (151) and the thickness h of the mask (150) satisfy the relationship h>n×d, Where n>1, and more preferably 1
摘要:
A thin-film transistor is provided in which the thickness of the insulating film is optimized. A gate electrode is formed on a transparent substrate. A silicon nitride film and a silicon oxide film, acting as a gate insulating film, are formed over the transparent substrate. A polycrystalline silicon film, being a semiconductor film, is formed acting as an active region. A stopper is formed on the polycrystalline silicon film corresponding to the gate electrode. A silicon oxide film and a silicon nitride film, acting as an interlayer insulating film, are deposited as to cover the stopper region. The total film thickness T1 of the stopper and the silicon oxide film is formed to be thinner than (the thickness T2 of the silicon nitride film×8000 Å)½. This structure allows hydrogen atoms to be sufficiently supplied from the silicon nitride film into the polycrystalline silicon film via the stopper and the silicon oxide film, so that crystalline defects in the polycrystalline silicon film can be filled with the hydrogen atoms.
摘要:
A single shared line (VLc) is provided as a power source line (VL) between two display pixels disposed adjoining each other in a row direction. Such a layout with the shared line (VLc) makes it possible to set the width of the shared line (VLc) equal to the sum of twice the width (Wd) of the power source line and the space (Ws) between the lines, even with the area of a single pixel is the same as in a conventional design. As a result, an increase in line resistance of the power source line can be suppressed, and variation in display luminance in accordance with the distance from a power source terminal due to a voltage drop can be reliably reduced.
摘要:
Thin film transistors TFT2a and TFT2b for driving elements are formed in parallel between a power source line (16) and an organic EL element (60), and active layers (12) of the transistors TFT2a and TFT2b are spaced apart in a scanning direction of a laser used for annealing for polycrystallization. As a result, the annealing conditions for the transistors TFT2a and TFT2b will not be exactly the same, thereby reducing the chance of a same problem being caused in both transistors TFT2a and TFT2b.
摘要:
There is provided an input/output device having of not exerting any adverse influence on other expansion devices connected to a system bus at the time of insertion or removal. An expansion device 800 comprises an electronic circuit 400 and a MOS switch 300, and is connected to a system bus (BUS) via a connector having long and short pins. The expansion device 800 two power supply systems, namely a stable power supply 250 and an unstable power supply 260. At the time of insertion or removal of the expansion device 800, power is provided to the MOS switch 300 and a high impedance maintaining circuit from the stable power supply via a pair of long pins, so as to reliably place the MOS switch 300 in a high impedance state, inside the expansion device the high impedance maintaining circuit 350 drives an open/close control terminal, and power is provided to the electronic circuit 400 from the unstable power supply 260. At the time of insertion or removal, adverse influence is not exerted on the signal transmission on the system bus, and effects of load variation on the main power supply are reduced.
摘要:
For obtaining p-Si by irradiating a laser beam to an a-Si layer to polycrystallize, an energy level in a region to be irradiated by the laser beam is set such that a level at the rear area of the region along a scan direction of the laser beam is lower than that at the front area or the center area of the region. The energy level at the front area or the center area of the region is set such that it is substantially equal to or more than the upper limit energy level which maximizes a grain size of the p-Si obtained. since an energy profile is set as described above, when the laser beam is scanned on the a-Si layer, an irradiated energy of the laser on the region is gradually lowered from the upper limit as the laser beam passes through, which allows the semiconductor layer to be annealed within an optimal energy level during the latter half of the annealing process.