Laser anneal method of a semiconductor layer
    1.
    发明授权
    Laser anneal method of a semiconductor layer 有权
    半导体层的激光退火方法

    公开(公告)号:US07439114B2

    公开(公告)日:2008-10-21

    申请号:US11207458

    申请日:2005-08-18

    IPC分类号: H01L21/00

    摘要: For obtaining p-Si by irradiating a laser beam to an a-Si layer to polycrystallize, an energy level in a region to be irradiated by the laser beam is set such that a level at the rear area of the region along a scan direction of the laser beam is lower than that at the front area or the center area of the region. The energy level at the front area or the center area of the region is set such that it is substantially equal to or more than the upper limit energy level which maximizes a grain size of the p-Si obtained. Since an energy profile is set as described above, when the laser beam is scanned on the a-Si layer, an irradiated energy of the laser on the region is gradually lowered from the upper limit as the laser beam passes through, which allows the semiconductor layer to be annealed within an optimal energy level during the latter half of the annealing process.

    摘要翻译: 为了通过将激光束照射到a-Si层进行多晶化来获得p-Si,将由激光束照射的区域中的能级设定为使沿着扫描方向的区域的后部区域的电平 激光束比区域前区域或中心区域低。 该区域的前部区域或中心区域的能级被设定为使得所获得的p-Si的粒径最大化的上限能级基本上等于或大于该能级。 由于如上所述设定能量分布,当在a-Si层上扫描激光束时,该区域上的激光的照射能量随着激光束通过而从上限逐渐降低,这允许半导体 在退火过程的后半期间在最佳能级内退火的层。

    Laser anneal method of a semiconductor layer
    2.
    发明授权
    Laser anneal method of a semiconductor layer 有权
    半导体层的激光退火方法

    公开(公告)号:US07061017B2

    公开(公告)日:2006-06-13

    申请号:US10714829

    申请日:2003-11-14

    IPC分类号: H01L29/76

    摘要: For obtaining p-Si by irradiating a laser beam to an a-Si layer to polycrystallize, an energy level in a region to be irradiated by the laser beam is set such that a level at the rear area of the region along a scan direction of the laser beam is lower than that at the front area or the center area of the region. The energy level at the front area or the center area of the region is set such that it is substantially equal to or more than the upper limit energy level which maximizes a grain size of the p-Si obtained. Since an energy profile is set as described above, when the laser beam is scanned on the a-Si layer, an irradiated energy of the laser on the region is gradually lowered from the upper limit as the laser beam passes through, which allows the semiconductor layer to be annealed within an optimal energy level during the latter half of the annealing process.

    摘要翻译: 为了通过将激光束照射到a-Si层进行多晶化来获得p-Si,将由激光束照射的区域中的能级设定为使沿着扫描方向的区域的后部区域的电平 激光束比区域前区域或中心区域低。 该区域的前部区域或中心区域的能级被设定为使得所获得的p-Si的粒径最大化的上限能级基本上等于或大于该能级。 由于如上所述设定能量分布,当在a-Si层上扫描激光束时,该区域上的激光的照射能量随着激光束通过而从上限逐渐降低,这允许半导体 在退火过程的后半期间在最佳能级内退火的层。

    Laser anneal method of a semiconductor layer
    3.
    发明授权
    Laser anneal method of a semiconductor layer 失效
    半导体层的激光退火方法

    公开(公告)号:US06274414B1

    公开(公告)日:2001-08-14

    申请号:US08911505

    申请日:1997-08-14

    IPC分类号: H01L21324

    摘要: For obtaining p-Si by irradiating a laser beam to an a-Si layer to polycrystallize, an energy level in a region to be irradiated by the laser beam is set such that a level at the rear area of the region along a scan direction of the laser beam is lower than that at the front area or the center area of the region. The energy level at the front area or the center area of the region is set such that it is substantially equal to or more than the upper limit energy level which maximizes a grain size of the p-Si obtained. since an energy profile is set as described above, when the laser beam is scanned on the a-Si layer, an irradiated energy of the laser on the region is gradually lowered from the upper limit as the laser beam passes through, which allows the semiconductor layer to be annealed within an optimal energy level during the latter half of the annealing process.

    摘要翻译: 为了通过将激光束照射到a-Si层进行多晶化来获得p-Si,将由激光束照射的区域中的能级设定为使沿着扫描方向的区域的后部区域的电平 激光束比区域前区域或中心区域低。 该区域的前部区域或中心区域的能级被设定为使得所获得的p-Si的粒径最大化的上限能级基本上等于或大于该能级。 由于如上所述设定能量分布,当在a-Si层上扫描激光束时,该区域上的激光的照射能量随着激光束通过而从上限逐渐降低,这允许半导体 在退火过程的后半期间在最佳能级内退火的层。

    Laser anneal method for a semiconductor device
    6.
    发明授权
    Laser anneal method for a semiconductor device 有权
    半导体器件的激光退火方法

    公开(公告)号:US6072194A

    公开(公告)日:2000-06-06

    申请号:US327219

    申请日:1999-06-07

    CPC分类号: H01L29/66757 H01L21/2026

    摘要: Laser anneal processing of a semiconductor layer is repeated in a number of steps. Grain size is increased using high energy ELA for a first step, and grain sizes are uniformed using ELA with low energy for a later step. As a defective crystallization region occurs in an excessive energy region during the ELA for the first step, in the ELA for the second time, excessive energy is removed and the defective crystallization region is eliminated by reducing the energy to an optimal value, thereby improving the crystallinity of a p-Si layer.

    摘要翻译: 在多个步骤中重复半导体层的激光退火处理。 使用高能ELA进行第一步的晶粒尺寸增加,并且使用具有低能量的ELA将晶粒尺寸均匀化以用于后续步骤。 由于在第一阶段的ELA期间,在过量的能量区域中出现缺陷结晶区域,所以在ELA中第二次,通过将能量减少到最佳值来消除过多的能量并消除不良结晶区域,从而改善 p-Si层的结晶度。

    Method for producing a silicon thin film by MBE using silicon beam
precleaning
    8.
    发明授权
    Method for producing a silicon thin film by MBE using silicon beam precleaning 失效
    使用硅光束预清洗通过MBE制造硅薄膜的方法

    公开(公告)号:US4833100A

    公开(公告)日:1989-05-23

    申请号:US939101

    申请日:1986-12-08

    IPC分类号: H01L21/20 H01L21/203

    摘要: The present invention relates to a method for producing a semiconductor thin film, in which a single crystalline silicon film is grown on an insulative single crystalline substrate, such as a single crystalline sapphire substrate, by the molecular beam epitaxy method. Silicon molecular beams are irradiated onto the substrate under the conditions wherein a substrate temperature is kept at 700.degree. to 900.degree. C. and an intensity of the molecular beams is kept within a range from 1.times.10.sup.12 atoms/cm.sup.2 .multidot.sec to 1.times.10.sup.13 atoms/cm.sup.2 .multidot.sec to clean a surface of the substrate and then the intensity of the molecular beams is increased to form the single crystalline silicon film. Thus, the substrate can be cleaned without being defected.

    摘要翻译: 本发明涉及通过分子束外延法在单晶蓝宝石衬底等绝缘性单晶衬底上生长单晶硅膜的半导体薄膜的制造方法。 在基板温度保持在700〜900℃的条件下将硅分子束照射到基板上,分子束的强度保持在1×10 12原子/ cm 2×1〜1×10 13原子/ cm 2×的范围内,以清洁 然后增加分子束的强度,形成单晶硅膜。 因此,可以清洁基板而不会发生缺陷。

    Organic EL display unit and organic EL display device
    9.
    发明授权
    Organic EL display unit and organic EL display device 有权
    有机EL显示单元和有机EL显示装置

    公开(公告)号:US09082730B2

    公开(公告)日:2015-07-14

    申请号:US13976014

    申请日:2011-12-27

    摘要: An organic EL display unit is an organic EL display unit which includes a first substrate; an organic EL element which is located on the first substrate, which includes a first electrode, an organic layer containing at least an organic light emitting layer, and a second electrode, and which is configured to emit excitation light; a second substrate; and an optical conversion layer which is located on the second substrate and which is configured to emit light to the outside through a display surface, the light being obtained by conversion of a color tone of the excitation light, the display surface is flat and rectangular, and the second substrate is divided into a plurality of sections along a long side direction of the display surface.

    摘要翻译: 有机EL显示单元是包括第一基板的有机EL显示单元; 位于第一基板上的有机EL元件,其包括第一电极,至少含有有机发光层的有机层和第二电极,并且被配置为发射激发光; 第二基板; 以及光转换层,其位于所述第二基板上并且被配置为通过显示表面向外部发光,所述光通过转换所述激发光的色调而获得,所述显示面是平坦且矩形的, 并且第二基板沿着显示表面的长边方向被分成多个部分。

    ORGANIC ELEMENT AND ORGANIC DEVICE INCLUDING THE SAME
    10.
    发明申请
    ORGANIC ELEMENT AND ORGANIC DEVICE INCLUDING THE SAME 有权
    有机元素和有机器件包括它们

    公开(公告)号:US20120126218A1

    公开(公告)日:2012-05-24

    申请号:US13387332

    申请日:2010-04-13

    摘要: An organic electric-field element includes an elongated support base member, a first electrode provided on the support base member, an organic layer provided to cover the first electrode, and a second electrode provided to cover the organic layer. At one end portion of the support base member, a two-layer structure region including the support base member and the first electrode is provided, and a three-layer structure region including the support base member, the first electrode, and the organic layer is provided, extending continuously from the other end of the two-layer structure region. At the other end portion of the support base member, a two-layer structure region including the support base member and the second electrode is provided, and a three-layer structure region including the support base member, the second electrode, and the organic layer is provided, extending continuously from one end of the two-layer structure region.

    摘要翻译: 有机电场元件包括细长的支撑基底构件,设置在支撑基底构件上的第一电极,设置成覆盖第一电极的有机层和设置成覆盖有机层的第二电极。 在支撑基体的一个端部设置有包括支撑基体和第一电极的两层结构区域,并且包括支撑基底构件,第一电极和有机层的三层结构区域是 提供,从两层结构区域的另一端连续延伸。 在支撑基体的另一端部设置包括支撑基体和第二电极的两层结构区域,并且包括支撑基底构件,第二电极和有机层的三层结构区域 设置成从两层结构区域的一端连续延伸。