Semiconductor apparatus
    82.
    发明授权
    Semiconductor apparatus 有权
    半导体装置

    公开(公告)号:US07847348B2

    公开(公告)日:2010-12-07

    申请号:US12382281

    申请日:2009-03-12

    摘要: Provided is a semiconductor apparatus including a substrate region, an active region on the substrate region, a gate pattern on the active region, and first and second impurities-doped regions along both edges of the active region that do not overlap the gate pattern. The length of the first and second impurities-doped regions in the horizontal direction may be shorter than in the vertical direction. The first and second impurities-doped regions may be formed to be narrow along both edges of the active region so as not to overlap the gate pattern.

    摘要翻译: 提供了一种半导体装置,其包括衬底区域,衬底区域上的有源区域,有源区域上的栅极图案,以及不与栅极图案重叠的有源区域沿着两个边缘的第一和第二杂质掺杂区域。 第一和第二杂质掺杂区域在水平方向上的长度可以比​​在垂直方向上短。 第一和第二杂质掺杂区域可以形成为沿着有源区域的两个边缘窄,以便不与栅极图案重叠。

    Non-volatile memory device and method of operating the same
    84.
    发明授权
    Non-volatile memory device and method of operating the same 有权
    非易失性存储器件及其操作方法

    公开(公告)号:US07986545B2

    公开(公告)日:2011-07-26

    申请号:US12465125

    申请日:2009-05-13

    IPC分类号: G11C11/00

    CPC分类号: G11C8/14 G11C5/02 G11C5/025

    摘要: A non-volatile memory device having a stack structure, and a method of operating the non-volatile memory device In which the non-volatile memory device includes a plurality of variable resistors arranged in at least one layer. At least one layer selection bit line and a plurality of bit lines coupled to the plurality of the variable resistors are provided. A plurality of selection transistors coupled between the plurality of the bit lines and the plurality of the variable resistors are provided.

    摘要翻译: 具有堆叠结构的非易失性存储器件以及操作非易失性存储器件的方法其中非易失性存储器件包括布置在至少一层中的多个可变电阻器。 提供耦合到多个可变电阻器的至少一个层选择位线和多个位线。 耦合在多个位线和多个可变电阻之间的多个选择晶体管被设置。

    METHOD OF MANUFACTURING NANO SCALE SEMICONDUCTOR DEVICE USING NANO PARTICLES
    85.
    发明申请
    METHOD OF MANUFACTURING NANO SCALE SEMICONDUCTOR DEVICE USING NANO PARTICLES 有权
    使用纳米颗粒制造纳米尺度半导体器件的方法

    公开(公告)号:US20070054445A1

    公开(公告)日:2007-03-08

    申请号:US11240473

    申请日:2005-10-03

    IPC分类号: H01L21/338 H01L21/461

    摘要: Provided is a method of manufacturing a nano scale semiconductor device, such as a nano scale P-N junction device or a CMOS using nano particles without using a mask or a fine pattern. The method includes dispersing uniformly a plurality of nano particles on a semiconductor substrate, forming an insulating layer covering the nano particles on the semiconductor substrate, partly removing the upper surfaces of the nano particles and the insulating layer, selectively removing the nano particles from the insulating layer, and partly forming doped semiconductor layers in the semiconductor substrate by partly doping the semiconductor substrate through spaces formed by removing the nano particles.

    摘要翻译: 提供了一种使用纳米级P-N结器件或使用纳米颗粒的CMOS而不使用掩模或精细图案的纳米级半导体器件的制造方法。 该方法包括在半导体衬底上均匀分散多个纳米颗粒,形成覆盖半导体衬底上的纳米颗粒的绝缘层,部分去除纳米颗粒和绝缘层的上表面,从绝缘体中选择性地除去纳米颗粒 层,并且通过部分地通过去除纳米颗粒形成的空间将半导体衬底部分地掺杂在半导体衬底中部分地形成掺杂半导体层。

    Metal line structure of optical scanner and method of fabricating the same
    86.
    发明授权
    Metal line structure of optical scanner and method of fabricating the same 失效
    光学扫描仪的金属线结构及其制造方法

    公开(公告)号:US07348535B2

    公开(公告)日:2008-03-25

    申请号:US11354014

    申请日:2006-02-15

    IPC分类号: H01J40/14 H01L21/30

    CPC分类号: G02B26/0841

    摘要: A metal line structure of an optical scanner and a method of fabricating the same are provided. The metal line structure of the optical scanner includes: a glass substrate having a metal line region etched to a predetermined depth; a metal line formed in the metal line region; a diffusion barrier layer that is formed on the glass substrate and covers the metal line; and an optical scanner structure combined with the glass substrate.

    摘要翻译: 提供了一种光学扫描仪的金属线结构及其制造方法。 光学扫描器的金属线结构包括:具有蚀刻到预定深度的金属线区域的玻璃基板; 形成在金属线区域中的金属线; 扩散阻挡层,其形成在所述玻璃基板上并覆盖所述金属线; 以及与玻璃基板结合的光学扫描器结构。

    Non-volatile memory device and method of fabricating the same
    87.
    发明申请
    Non-volatile memory device and method of fabricating the same 审中-公开
    非易失性存储器件及其制造方法

    公开(公告)号:US20090273054A1

    公开(公告)日:2009-11-05

    申请号:US12382106

    申请日:2009-03-09

    IPC分类号: H01L29/68

    摘要: A non-volatile memory device and methods of fabricating the device according to example embodiments involve a stacked layer structure. The non-volatile memory device may include at least one first horizontal electrode including a first sidewall and a second sidewall; at least one second horizontal electrode including a third sidewall and a fourth sidewall; wherein the third sidewall may be disposed to face the first sidewall; at least one vertical electrode may be interposed between the first sidewall and the third sidewall, in such a way as to cross or intersect each of the at least one first and second horizontal electrodes, and; at least one data storage layer that may be capable of locally storing a change of electrical resistance may be interposed where the at least one first horizontal electrode and the at least one vertical electrode cross or intersect and where the at least one horizontal electrode and the at least one vertical electrodes cross or intersect.

    摘要翻译: 根据示例实施例的非易失性存储器件和制造器件的方法涉及堆叠层结构。 非易失性存储器件可以包括至少一个包括第一侧壁和第二侧壁的第一水平电极; 至少一个第二水平电极,包括第三侧壁和第四侧壁; 其中所述第三侧壁可以被设置为面对所述第一侧壁; 至少一个垂直电极可以插入在第一侧壁和第三侧壁之间,以便使得至少一个第一和第二水平电极中的每一个交叉或相交, 可以插入至少一个能够局部存储电阻变化的数据存储层,其中至少一个第一水平电极和至少一个垂直电极交叉或相交,并且其中至少一个水平电极和at 至少一个垂直电极交叉或相交。

    Method of manufacturing nano scale semiconductor device using nano particles
    88.
    发明授权
    Method of manufacturing nano scale semiconductor device using nano particles 有权
    使用纳米颗粒制造纳米级半导体器件的方法

    公开(公告)号:US07192873B1

    公开(公告)日:2007-03-20

    申请号:US11240473

    申请日:2005-10-03

    IPC分类号: H01L21/311

    摘要: Provided is a method of manufacturing a nano scale semiconductor device, such as a nano scale P-N junction device or a CMOS using nano particles without using a mask or a fine pattern. The method includes dispersing uniformly a plurality of nano particles on a semiconductor substrate, forming an insulating layer covering the nano particles on the semiconductor substrate, partly removing the upper surfaces of the nano particles and the insulating layer, selectively removing the nano particles from the insulating layer, and partly forming doped semiconductor layers in the semiconductor substrate by partly doping the semiconductor substrate through spaces formed by removing the nano particles.

    摘要翻译: 提供了一种使用纳米级P-N结器件或使用纳米颗粒的CMOS而不使用掩模或精细图案的纳米级半导体器件的制造方法。 该方法包括在半导体衬底上均匀分散多个纳米颗粒,形成覆盖半导体衬底上的纳米颗粒的绝缘层,部分去除纳米颗粒和绝缘层的上表面,从绝缘体中选择性地除去纳米颗粒 层,并且通过部分地通过去除纳米颗粒形成的空间将半导体衬底部分地掺杂在半导体衬底中部分地形成掺杂半导体层。

    3D CMOS image sensors, sensor systems including the same
    90.
    发明授权
    3D CMOS image sensors, sensor systems including the same 有权
    3D CMOS图像传感器,传感器系统包括相同

    公开(公告)号:US09035309B2

    公开(公告)日:2015-05-19

    申请号:US12984972

    申请日:2011-01-05

    IPC分类号: H01L27/146

    CPC分类号: H01L27/14629 H01L27/14687

    摘要: A three-dimensional (3D) CMOS image sensor (CIS) that sufficiently absorbs incident infrared-rays (IRs) and includes an infrared-ray (IR) receiving unit formed in a thin epitaxial film, thereby being easily manufactured using a conventional CIS process, a sensor system including the 3D CIS, and a method of manufacturing the 3D CIS, the 3D CIS including an IR receiving part absorbing IRs incident thereto by repetitive reflection to produce electron-hole pairs (EHPs); and an electrode part formed on the IR receiving part and collecting electrons produced by applying a predetermined voltage thereto.

    摘要翻译: 一种三维(3D)CMOS图像传感器(CIS),其足以吸收入射的红外线(IR)并且包括形成在薄的外延膜中的红外线(IR)接收单元,由此容易地使用传统的CIS工艺 包括3D CIS的传感器系统和制造3D CIS的方法,3D CIS包括通过重复反射吸收入射到其中的IR的IR接收部分以产生电子 - 空穴对(EHP); 以及形成在IR接收部上并且收集通过施加预定电压而产生的电子的电极部分。