Abstract:
Significant amounts of micromasking residue have been observed at the interface between a Ti-containing ARC layer and a PE-TEOS hardmask after the hardmask has been etched and prior to the use of the etched hardmask for transferring a pattern to an underlying metal layer (e.g., aluminum). The micromasking residue can interfere with proper etching of the underlying metal layer such as by creating undesirable short circuits between metal interconnect lines. Methods are disclosed for removing and/or preventing the formation of the micromasking residue. A removing method includes the use of a relatively low average-mass physical bombardment agent in combination with a small-diameter, chemically-reactive agent for dislodging micromasking nodules by weakening their base anchors and breaking them away without causing excessive damage to underlying layers. In one embodiment, the base anchors are rich in titanium content while the micromasking nodule bodies contain titanium oxide. Chlorine is included in a residue removing plasma for volatizing the titanium of the base anchors while argon is further included in the residue removing plasma for physically bombarding the upper, oxide bodies of the micromasking nodules. A method for preventing or reducing the amount of formed, micromasking residue includes interposing an oxygen-poor interfacial layer between the metal-containing ARC layer and the oxygen-containing hardmask.
Abstract:
In a memory cell (110) having multiple floating gates (160), the select gate (140) is formed before the floating gates. In some embodiments, the memory cell also has control gates (170) formed after the select gate. Substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions protrude above the substrate. Then select gate lines (140) are formed. Then a floating gate layer (160) is deposited. The floating gate layer is etched until the substrate isolation regions are exposed. A dielectric (164) is formed over the floating gate layer, and a control gate layer (170) is deposited. The control gate layer protrudes upward over each select gate line. These the control gates and the floating gates are defined independently of photolithographic alignment. In another aspect, a nonvolatile memory cell has at least two conductive floating gates (160). A dielectric layer (164) overlying the floating gate has a continuous feature that overlies the floating gate and also overlays a sidewall of the select gate (140). Each control gate (160) overlies the continuous feature of the dielectric layer and also overlies the floating gate. In another aspect, substrate isolation regions (220) are formed in a semiconductor substrate. Select gate lines cross over the substrate isolation regions. Each select gate line has a planar top surface, but its bottom surface goes up and down over the substrate isolation regions. Other features are also provided.
Abstract:
A memory cell (110) has a select gate (140) and at least two floating gates (160). A gate dielectric (150) for the floating gates (160) is formed by thermal oxidation simultaneously with as a dielectric on a surface of the select gate (140). The dielectric thickness on the select gate is controlled by the dopant concentration in the select gate. Other features are also provided.
Abstract:
In a nonvolatile memory array in which each cell (110) has two floating gates (160), for any two consecutive memory cells, one source/drain region (174) of one of the cells and one source/drain region of the other one of the cells are provided by a contiguous region of the appropriate conductivity type (e.g. N type) formed in a semiconductor substrate (120). Each such contiguous region provides source/drain regions to only two of the memory cells in that column. The bitlines (180) overlie the semiconductor substrate in which the source/drain regions are formed. The bitlines are connected to the source/drain regions.
Abstract:
The present invention is directed to nanoporous metal membranes and methods of making nanoporous metal membranes from metal leaf. At least a portion of the metal leaf is freely supported by a de-alloying medium for a time effective to de-alloy the metal leaf. After the porous membrane is formed, the membrane may be re-adhered to a substrate and removed from the de-alloying medium. The de-alloying process may be thermally and electrically influenced.
Abstract:
The invention is an improved fuel cell system suited for application in a vehicle. Specifically, the invention provides an improved system to remove CO emissions that has a rapid dynamic response (about 1 second) and can operate over a wide range of temperatures (between 0 and 800 degrees Celsius). The fuel cell system comprises hydrogen fuel, a CO removal system based upon non-Faradaic electrochemical modification of catalyst activity (electrochemical promotion), and a fuel cell stack. The CO removal system comprises a catalyst/working electrode, an electrolyte, a counter electrode, and a power source. The CO removal system's intrinsic catalytic rate is greater than an intrinsic electrocatalytic rate. The catalyst can be Pt, Rh, Au, Cu/ZnO, Cu/CuO, ABO3(perovskite), zeolite, and Pd. The power source can be a battery, potentiostat, or galvanostat.
Abstract:
A device for confining an optical beam in an optical switch. In one embodiment, the disclosed optical switch includes an optical switching device disposed between an optical input port and an optical output port in a semiconductor substrate layer disposed between a plurality of optical confinement layers such that an optical beam is confined to remain within the layers. In one embodiment, a plurality of semiconductor substrate layers are included in the optical switch. Each of the semiconductor substrate layers is disposed between optical confinement layers such that optical beams passing through the semiconductor substrate layers are confined to remain within the semiconductor substrate layers until exiting through respective optical output ports. In one embodiment, integrated circuitry such as driver circuitry, controller circuitry, logic circuitry, coder-decoder circuitry, microprocessor circuitry or the like is included in at least one of the semiconductor substrate layers.
Abstract:
The invention relates to an optical clocking signal distribution article that comprises a substrate that has a front surface and a back surface that are parallel planar. A dielectric layer is disposed upon the front surface, and a recess in the substrate exposes a portion of the dielectric layer when viewed from the back surface. A first light reflecting structure is disposed in the dielectric layer. The first reflecting structure is disposed within the exposed portion of the dielectric layer. At least one light receiver is disposed upon the front surface. Also disclosed is a method of forming an optical distribution structure. The method comprises forming a recess through a substrate to expose a dielectric layer. The method further comprises forming a waveguide in the dielectric layer, wherein the waveguide has a length, a first end, and a second end, and wherein the recess is disposed over the first end of the waveguide. The method also comprises forming a first light reflecting structure at the first end of the waveguide.
Abstract:
A battery state of charge (SOC) detector for rapid charging and method each provide an efficient means for formatting, charging, and recharging batteries of various types and ratings. The detector determines the SOC of a battery to be charged and then selects an optimal charging signal profile based on the SOC determination. During the charging process, the detector can continuously monitor battery SOC in order to select appropriate waveforms for the charging signal. The charging signal is a pulse width and amplitude modulated current, voltage or power waveform with the amplitude and pulse width of each charging pulse being selected based upon the detected battery SOC. Predetermined battery parameters, such as equivalent circuit capacitance and resistance, electrochemical overcharge, maximum battery temperature, and maximum battery internal pressure, among others, also can be compared with monitored values during the battery charging process to control the charging signal in order to avoid battery damage. The charging process is continued until detected battery SOC reaches 100% or until charging logic indicates that the charging process should be stopped.
Abstract:
There is disclosed an electrical device and a method in which a battery is warmed up when operating from a sub-zero temperature. The electrical device may include a battery; an electrical storage element; and a battery management system including a controller in electrical communication with the battery and the electrical storage element. The controller can be configured to execute a program stored in the controller to shuttle energy between the battery and the electrical storage element until a power capability threshold of the battery has been reached, Shuttling the energy raises a temperature of the battery to meet power demand.