公开(公告)号：US08168378B2

公开(公告)日：2012-05-01

申请号：US12852855

申请日：2010-08-09

申请人： Takahisa Otsuka ,  Tsuyoshi Shibata

发明人： Takahisa Otsuka ,  Tsuyoshi Shibata

IPC分类号： G03F7/00 ,  G03F7/26 ,  G03F7/40

CPC分类号： H01L21/6715 ,  H01L21/67207 ,  H01L21/68742

摘要： In the present invention, a plurality of heat treatment plates are provided side by side in a linear form on a base of a heat treatment apparatus in a coating and developing treatment system. In the heat treatment apparatus, three transfer member groups are provided which transfer a substrate in zones between adjacent heat treatment plates. At the time when performing a pre-baking treatment in the heat treatment apparatus, the substrate is transferred in order to the heat treatment plates at the same temperature, whereby the heat treatment is dividedly performed on the heat treatment plates. According to the present invention, substrates are subjected to heat treatment along the same route, so that the thermal histories are made uniform among the substrates.

摘要翻译： 在本发明中，在涂布显影处理系统的热处理装置的基座上并列设置多个热处理板。 在热处理装置中，设置三个传送部件组，其在相邻的热处理板之间的区域中传送基板。 在热处理装置中进行预烘烤处理时，在相同的温度下将基板转印到热处理板上，由此热处理在热处理板上分开进行。 根据本发明，沿着相同的路线对基板进行热处理，从而使基板之间的热历程均匀。

公开(公告)号：US20120010414A1

公开(公告)日：2012-01-12

申请号：US13257258

申请日：2010-03-19

申请人： Akito Yasuhara ,  Shuji Yamamoto ,  Hiroshi Ohta ,  Yoshihisa Shirasaki ,  Kazunari Sakagami ,  Masato Hayashi ,  Tsuyoshi Shibata ,  Youichi Shimazaki ,  Yuko Araki ,  Kumi Abe ,  Xiang-Min Sun

发明人： Akito Yasuhara ,  Shuji Yamamoto ,  Hiroshi Ohta ,  Yoshihisa Shirasaki ,  Kazunari Sakagami ,  Masato Hayashi ,  Tsuyoshi Shibata ,  Youichi Shimazaki ,  Yuko Araki ,  Kumi Abe ,  Xiang-Min Sun

IPC分类号： C07D471/04 ,  C07D405/12 ,  C07D409/12 ,  C07D405/14

CPC分类号： C07D471/04 ,  C07D405/12 ,  C07D405/14 ,  C07D409/12

摘要： The present invention aims to provide novel compounds of formula [I] or pharmaceutically acceptable salts thereof that are based on a glycine uptake inhibiting action and which are useful in the prevention or treatment of such diseases as schizophrenia, Alzheimer's disease, cognitive dysfunction, dementia, anxiety disorders (generalized anxiety disorder, panic disorder, obsessive-compulsory disorder, social anxiety disorder, posttraumatic stress disorder, specific phobia, acute stress disorder, etc.), depression, drug addiction, spasm, tremor, and sleep disorder:

摘要翻译： 本发明旨在提供基于甘氨酸摄取抑制作用的新颖的式[I]化合物或其药学上可接受的盐，其可用于预防或治疗精神分裂症，阿尔茨海默病，认知功能障碍，痴呆， 焦虑症（广泛性焦虑障碍，恐慌症，强迫症，社会焦虑症，创伤后应激障碍，特定恐惧症，急性应激障碍等），抑郁症，药物成瘾，痉挛，震颤和睡眠障碍：

公开(公告)号：US20110242513A1

公开(公告)日：2011-10-06

申请号：US13159055

申请日：2011-06-13

申请人： Kunie OGATA ,  Masahide Tadokoro ,  Tsuyoshi Shibata ,  Shinichi Shinozuka

发明人： Kunie OGATA ,  Masahide Tadokoro ,  Tsuyoshi Shibata ,  Shinichi Shinozuka

IPC分类号： G03B27/42

CPC分类号： G03F7/38 ,  H01L21/67225 ,  H01L21/67248

摘要： A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.

摘要翻译： 基于先前获得的抗蚀剂图案的尺寸和热处理温度之间的关系，基于热处理后的抗蚀剂图案的第二维度，基于基板上的抗蚀剂图案的第一尺寸的测量来校正热处理的处理温度 在校正后的处理温度下进行处理，将第二维度的基板内的分布分类成由近似曲面和非线性成分表示的线性分量，根据线性分量来校正曝光处理的处理条件 从先前获得的抗蚀剂图案的尺寸和曝光处理的处理条件之间的关系以及在温度校正步骤中校正的处理温度下的热处理和在曝光条件校正步骤中校正的处理条件下的曝光处理进行到 形成一个预先 确定模式。

公开(公告)号：US20110094105A1

公开(公告)日：2011-04-28

申请号：US12908551

申请日：2010-10-20

申请人： Tetsuma TATSUMI ,  Masayuki Taniguchi ,  Tsuyoshi Shibata ,  Yoshiharu Hayashi

发明人： Tetsuma TATSUMI ,  Masayuki Taniguchi ,  Tsuyoshi Shibata ,  Yoshiharu Hayashi

IPC分类号： B21D51/24

CPC分类号： F23L7/007 ,  F23C9/003 ,  F23C2202/30 ,  F23L2900/07001 ,  Y02E20/322 ,  Y02E20/344 ,  Y10T29/49352 ,  Y10T29/49387 ,  Y10T29/49716

摘要： A method for retrofitting a pulverized coal boiler in an air combustion boiler system is disclosed, which has a plurality of burners over a plurality of stages along the vertical direction on a wall surface of a furnace of the pulverized coal boiler and an after-air port for introducing air for two-stage combustion located above the burners to retrofit into a two-stage combustion pulverized coal boiler in an oxyfuel combustion boiler system.

摘要翻译： 公开了一种在空气燃烧锅炉系统中改造粉煤锅炉的方法，该方法在粉煤锅炉的炉壁的表面上沿着垂直方向在多个级上具有多个燃烧器，以及后空气口 用于引入位于燃烧器上方的用于两级燃烧的空气，以改造为在氧燃烧锅炉系统中的两级燃烧粉煤锅炉。

公开(公告)号：US20110086514A1

公开(公告)日：2011-04-14

申请号：US12973111

申请日：2010-12-20

申请人： Takahisa OTSUKA ,  Tsuyoshi Shibata

发明人： Takahisa OTSUKA ,  Tsuyoshi Shibata

IPC分类号： H01L21/31

CPC分类号： H01L21/67742 ,  G03F7/168 ,  G03F7/26 ,  G03F7/40 ,  H01L21/31058 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67748

摘要： A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film. Then, the substrate, with distribution of the predetermined component thus adjusted, is subjected to a heat process at a temperature not lower than the lower limit of temperature.

摘要翻译： 基板处理方法被布置成在其上形成有涂膜的基板上进行热处理以烘烤和固化涂膜。 首先，将其上形成有涂膜的基板保持在低于用于烘烤和固化涂膜的温度下限的预备温度，以调节涂膜中预定组分的分布。 然后，将如此调整的预定部件的分布的基板在不低于温度下限的温度下进行加热处理。

公开(公告)号：US07816276B2

公开(公告)日：2010-10-19

申请号：US11627540

申请日：2007-01-26

申请人： Takahisa Otsuka ,  Tsuyoshi Shibata

发明人： Takahisa Otsuka ,  Tsuyoshi Shibata

IPC分类号： H01L21/00 ,  H01L21/31 ,  G03B27/32 ,  G03F7/26

CPC分类号： H01L21/6715 ,  H01L21/67207 ,  H01L21/68742

摘要： In the present invention, a plurality of heat treatment plates are provided side by side in a linear form on a base of a heat treatment apparatus in a coating and developing treatment system. In the heat treatment apparatus, three transfer member groups are provided which transfer a substrate in zones between adjacent heat treatment plates. At the time when performing a pre-baking treatment in the heat treatment apparatus, the substrate is transferred in order to the heat treatment plates at the same temperature, whereby the heat treatment is dividedly performed on the heat treatment plates. According to the present invention, substrates are subjected to heat treatment along the same route, so that the thermal histories are made uniform among the substrates.

摘要翻译： 在本发明中，在涂布显影处理系统的热处理装置的基座上并列设置多个热处理板。 在热处理装置中，设置三个传送部件组，其在相邻的热处理板之间的区域中传送基板。 在热处理装置中进行预烘烤处理时，在相同的温度下将基板转印到热处理板上，由此热处理在热处理板上分开进行。 根据本发明，沿着相同的路线对基板进行热处理，从而使基板之间的热历程均匀。

公开(公告)号：US07796237B2

公开(公告)日：2010-09-14

申请号：US12341179

申请日：2008-12-22

申请人： Shinichi Ito ,  Tsuyoshi Shibata

发明人： Shinichi Ito ,  Tsuyoshi Shibata

IPC分类号： G03B27/52 ,  G03B27/42 ,  G03B27/32 ,  G03D5/00

CPC分类号： G03F7/70991 ,  G03F7/70341 ,  G03F7/70858 ,  G03F7/70916 ,  G03F7/70925

摘要： A lithography apparatus includes a resist processing apparatus to perform a process of applying a resist on a substrate, a process of heating a resist film on the substrate, and a process of developing the resist film on the substrate, an immersion exposure apparatus including a projection optical system which projects an image of a pattern on a photomask onto the resist film and configured to perform exposure through liquid located on an optical path between the projection optical system and resist film, a transporting apparatus connected to the resist processing and immersion exposure apparatuses to perform transportation of the substrate between the resist processing and immersion exposure apparatuses, and a temperature/humidity control apparatus configured to control at least one of temperature and humidity in at least one of the resist processing and transporting apparatuses based on temperature and humidity or the in humidity the immersion exposure apparatus.

摘要翻译： 光刻设备包括：抗蚀剂处理设备，用于执行在基板上施加抗蚀剂的工艺;加热基板上的抗蚀剂膜的工艺;以及在基板上显影抗蚀剂膜的工艺;浸渍曝光设备，包括：投影 光学系统，其将光掩模上的图案的图像投影到抗蚀剂膜上，并且被配置为通过位于投影光学系统和抗蚀剂膜之间的光路上的液体进行曝光，连接到抗蚀剂处理和浸没曝光装置的传送装置 在抗蚀剂处理和浸没曝光装置之间执行基板的传送，以及温度/湿度控制装置，其被配置为基于温度和湿度控制至少一个抗蚀剂处理和输送装置中的温度和湿度， 湿度浸渍曝光设备。

公开(公告)号：US20100212555A1

公开(公告)日：2010-08-26

申请号：US12708268

申请日：2010-02-18

申请人： Akihiro YAMADA ,  Tsuyoshi Shibata ,  Yoshiharu Hayashi

发明人： Akihiro YAMADA ,  Tsuyoshi Shibata ,  Yoshiharu Hayashi

IPC分类号： F23N1/02 ,  F23J15/00 ,  F23B80/02

CPC分类号： F23C9/003 ,  F01K13/02 ,  F23C9/08 ,  F23C2202/00 ,  F23C2202/50 ,  F23L7/007 ,  F23L2900/07001 ,  F23N2027/02 ,  F23N2037/04 ,  F23N2041/10 ,  Y02C10/06 ,  Y02E20/322 ,  Y02E20/344

摘要： An oxyfuel combustion boiler plant having a first boiler and a second boiler for injecting gas including oxygen in higher concentration than that in the air, gas including carbon dioxide in higher concentration than that in the air, and fuel from a burner and generating steam by combustion gas in a furnace, respectively, comprising: an exhaust gas supply pipe for supplying exhaust gas discharged from the first boiler to a burner of the second boiler, and a gas flow rate control apparatus for controlling a flow rate of exhaust gas flowing through the exhaust gas supply pipe.

摘要翻译： 一种具有第一锅炉和第二锅炉的含氧燃烧锅炉设备，其包括比空气中浓度高的气体，包括比空气中浓度高的二氧化碳的气体和来自燃烧器的燃料，以及通过燃烧产生蒸汽的气体 分别包括：用于将从第一锅炉排出的排气供给到第二锅炉的燃烧器的排气供给管，以及用于控制流过排气的废气的流量的气体流量控制装置 供气管。

公开(公告)号：US20100033526A1

公开(公告)日：2010-02-11

申请号：US12535233

申请日：2009-08-04

申请人： Masaru Toda ,  Tsuyoshi Shibata

发明人： Masaru Toda ,  Tsuyoshi Shibata

IPC分类号： B41J29/38

CPC分类号： B41J2/2132

摘要： A multipass printing is performed by setting the print permission ratios, predetermined for the nozzles in adjoining first and second blocks, in a way that satisfies the following conditions (i) and (ii). (i) The print permission ratio in the boundary section between the first and second blocks represents a value between the print permission ratio in the non-boundary section of the first block and that of the second block. (ii) The print permission ratios in the non-boundary sections of the first and second blocks are each set substantively constant. This arrangement allows the print permission ratio to be adjusted among nozzle blocks, thus satisfying the condition that the print permission ratio in a boundary between adjoining nozzles blocks does not change sharply and that the print permission ratio is substantively constant in each of the nozzle blocks. It is possible to suppress “interband variations”, “seam lines” and “intraband variations” coincidentally.

摘要翻译： 通过以满足以下条件（i）和（ii）的方式设定对邻接的第一和第二块中的喷嘴预定的打印许可比来执行多页打印。 （i）第一块和第二块之间的边界部分中的打印许可比率表示第一块的非边界部分中的打印许可比与第二块的非边界部分之间的值。 （ii）第一和第二块的非边界部分中的打印许可比率各自设定为实质上不变的。 这样可以在喷嘴块之间调整打印许可比例，从而满足相邻喷嘴块之间的边界的打印许可比率不急剧变化，并且在每个喷嘴块中打印允许比例基本上恒定的条件。 可以巧合地抑制“带间变化”，“缝线”和“内部变化”。

公开(公告)号：US20090246710A1

公开(公告)日：2009-10-01

申请号：US12457108

申请日：2009-06-01

申请人： Kenji Kawano ,  Tsuyoshi Shibata ,  Kei Hayasaki

发明人： Kenji Kawano ,  Tsuyoshi Shibata ,  Kei Hayasaki

IPC分类号： G03F7/20

CPC分类号： G03F7/38 ,  G03F7/2004 ,  G03F7/2006 ,  G03F7/2008 ,  G03F7/3021 ,  G03F7/70425 ,  G03F7/70558 ,  G03F7/70783

摘要： A pattern forming method is disclosed, which comprises forming a photo resist film on a substrate, irradiating the photo resist film with an energy ray to form a desired latent image pattern, placing the substrate on a spacer provided on a hot plate, heating the photo resist film by using the hot plate, and developing the photo resist film to form a photo resist pattern, wherein an amount of irradiation of the energy ray is set such that the amount of irradiation of the energy ray in an exposure region in which a distance between a back surface of the substrate and an upper surface of the hot plate is long is larger than the amount of irradiation of the energy ray in an exposure region in which a distance between the back surface of the substrate and the upper surface of the hot plate is short.