Abstract:
A method for fabricating an active device array substrate is provided. A first patterned semiconductor layer, a gate insulator, a first patterned conductive layer and a first dielectric layer is sequentially formed on a substrate. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. A second patterned conductive layer and a second patterned semiconductor layer disposed thereon are simultaneously formed on the first dielectric layer. The second conductive layer includes contact conductors and a bottom electrode. The second patterned semiconductor layer includes an active layer. A second dielectric layer having second contact holes is formed on the first dielectric layer, wherein a portion of the second contact holes exposes the active layer. A third patterned conductive layer electrically connected to the active layer through a portion of the second contact holes is formed on the second dielectric layer.
Abstract:
A transflective LCD panel includes a substrate, a first polycrystalline silicon pattern disposed in a reflection region, a second polycrystalline silicon pattern disposed in a peripheral region, an insulating layer disposed on the first and second polycrystalline silicon pattern and the substrate, a gate electrode disposed on the insulating layer in the reflection region, a storage capacitor line disposed on the insulating layer in the peripheral region, a first inter-layer dielectric disposed on the insulating layer, the gate electrode and the storage capacitor line, a reflection electrode disposed on the first inter-layer dielectric, a second inter-layer dielectric disposed on the first inter-layer dielectric and the reflection electrode, and a transmission electrode disposed on the second inter-layer dielectric and electrically connected to the reflection electrode through an opening of the second inter-layer dielectric. The second polycrystalline silicon pattern, the storage capacitor line, and the insulating layer disposed therebetween form a storage capacitor.
Abstract:
A computer managing method includes the following steps. Firstly, a blade server system with M blade server units, which includes a number of server blades and a modular management blade (MMB), is provided, wherein the M MMBs are connected with each other via network paths and M is a natural number greater than 1. Then a master MMB among the M MMBs are selected in response to first user operation event. Next, the network parameter data of the master MMB are set in response to second user operation event. Then network topology of the master MMB and the rest of M−1 MMBs are obtained via the master MMB. After that, the rest of M−1 MMBs are driven for utilizing a network protocol service so that the M−1 MMBs are able to receive network parameter data from the master MMB and carry out parameter setting accordingly.
Abstract:
A method of forming a transflective LCD panel is provided. The transflective LCD includes a substrate, a first polycrystalline silicon pattern disposed in a reflection region, a second polycrystalline silicon pattern disposed in a peripheral region, an insulating layer disposed on the first and second polycrystalline silicon pattern and the substrate, a gate electrode disposed in the reflection region, a common electrode disposed in the peripheral region, a first inter-layer dielectric disposed on the insulating layer, the gate electrode and the common electrode, a reflection electrode disposed on the first inter-layer dielectric, a second inter-layer dielectric disposed on the first inter-layer dielectric and the reflection electrode, and a transmission electrode disposed on the second inter-layer dielectric and electrically connected to the reflection electrode through an opening of the second inter-layer dielectric. The second polycrystalline silicon pattern, the common electrode, and the insulating layer disposed therebetween form a storage capacitor.
Abstract:
A semiconductor structure of a display device and the method for fabricating the same are provided. The semiconductor structure is formed on a substrate having a TFT region and a pixel capacitor region thereon. A TFT, including a gate electrode, a source electrode, a drain electrode, a channel layer, and a gate insulating layer, is formed on the TFT region of the substrate. A pixel capacitor is formed on the pixel capacitor region, wherein the pixel capacitor comprises a bottom electrode formed on a bottom dielectric layer, an interlayer dielectric layer formed on the bottom electrode, a top electrode formed on the interlayer dielectric layer, a contact plug passing through the interlayer dielectric layer and electrically connected to the top and bottom electrodes, a capacitor dielectric layer formed on the top electrode, a transparent electrode formed on the capacitor dielectric layer and electrically connected to the drain electrode.
Abstract:
A method for fabricating an active device array substrate is provided. A first patterned semiconductor layer, a gate insulator, a first patterned conductive layer and a first dielectric layer is sequentially formed on a substrate. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. A second patterned conductive layer and a second patterned semiconductor layer disposed thereon are simultaneously formed on the first dielectric layer. The second conductive layer includes contact conductors and a bottom electrode. The second patterned semiconductor layer includes an active layer. A second dielectric layer having second contact holes is formed on the first dielectric layer, wherein a portion of the second contact holes exposes the active layer. A third patterned conductive layer electrically connected to the active layer through a portion of the second contact holes is formed on the second dielectric layer.
Abstract:
In a method for removing bubbles from adhesive layer of semiconductor chip package, one or more semiconductor chips are attached to or stacked on a base plate using an adhesive material. The base plate is selected from a substrate, a lead frame, and other carrier for carrying the semiconductor chips thereon. Before the adhesive material starts curing or becomes fully cured, the base plate with the semiconductor chips is placed in a processing tank which is preset to heat at a predetermined heating rising rate to a predetermined temperature and to apply a predetermined pressure for a predetermined period of time, so that bubbles presented in the adhesive material, at an interface between the adhesive material and the base, and at an interface between the adhesive material and the semiconductor chip are expelled from the adhesive material under the temperature and pressure in the processing tank.
Abstract:
A method for fabricating an array substrate for a liquid crystal display (LCD) is provided. A semiconductor layer and a transparent lower electrode formed on a substrate is provided and covered by a first dielectric layer serving as a gate dielectric layer and a capacitor dielectric layer. A gate electrode and an upper electrode comprising a transparent electrode portion and a metal electrode portion are formed on the first dielectric layer and covered by a second dielectric layer. A source/drain electrode, a planarization layer, and a pixel electrode are sequentially formed on the second dielectric layer, in which the source/drain electrode is electrically connected to the semiconductor layer through the first and second dielectric layers and the pixel electrode is electrically connected to the source/drain electrode through the planarization layer. An array substrate for an LCD is also disclosed.
Abstract:
A modularized power supply switch control structure aims to control a main power system of a power supply. The main power system includes at least one high voltage output unit at a high voltage output end and one low voltage output unit at a rear low voltage output end. A control unit is connected to the high voltage output unit and the low voltage output unit to control start/stop time series of the high voltage output unit and the low voltage output unit so that the high voltage output unit and the low voltage output unit can be started asynchronously. Thus the power supply can output a start voltage at the start instant to meet load requirement. A plurality of power output modules deliver output asynchronously. Hence output current or voltage surge at the start instant can be improved.
Abstract:
A piston assembly for a food extruder having a food reservoir with a chamber and an inner surface, a piston rod and a piston dish. The piston rod slidably extends into the chamber of the food reservoir. The piston dish is attached loosely to the piston rod and has a lower segment, an upper segment, an annular groove and a sealing ring. The lower segment has an outer surface with an inclined bottom edge. The upper segment is hollow and is formed with the lower segment. The annular groove is formed in the outer surface of the lower segment adjacent to the upper segment. The sealing ring is mounted in the annular groove and slidably presses against the inner surface of the food reservoir to form an airtight seal.