公开(公告)号：US20080166122A1

公开(公告)日：2008-07-10

申请号：US11621074

申请日：2007-01-08

申请人： Ching-Wen Hsiao

发明人： Ching-Wen Hsiao

IPC分类号： H04J14/00

CPC分类号： H04J14/0295 ,  H04B10/032 ,  H04J14/0282

摘要： An optical network backup channel switching control device is proposed, which is designed for use in conjunction with an optical network for providing a backup channel switching control function, and which is characterized by the capability of generating a main-channel monitoring beam and a backup-channel monitoring beam both on the local side and the remote side, where the main-channel monitoring beam is detected on the opposite side to determine whether the main channel is in good condition, and if a failure occurs to the main channel, the backup-channel monitoring beam is detected to determine whether the backup channel is in good condition. If the backup channel is in good condition, a switching action is then performed to switch the connection to the backup channel. This feature allows the optical network to have a higher level of reliability in operation.

摘要翻译： 提出了一种光网络备用信道切换控制装置，其被设计用于与光网络一起用于提供备用信道切换控制功能，其特征在于能够生成主信道监控波束和备用信道， 通道监控光束在本地和远端，主通道监控光束在相对侧检测，以确定主通道是否处于良好状态，如果主通道出现故障， 检测通道监控波束，以确定备用通道是否处于良好状态。 如果备份通道处于良好状态，则执行切换操作，将连接切换到备用通道。 该功能允许光网络在操作中具有更高的可靠性。

公开(公告)号：US07294920B2

公开(公告)日：2007-11-13

申请号：US11186840

申请日：2005-07-22

申请人： Shou-Lung Chen ,  Ching-Wen Hsiao ,  Yu-Hua Chen ,  Jeng-Dar Ko ,  Chih-Ming Tzeng ,  Jyh-Rong Lin ,  Shan-Pu Yu

发明人： Shou-Lung Chen ,  Ching-Wen Hsiao ,  Yu-Hua Chen ,  Jeng-Dar Ko ,  Chih-Ming Tzeng ,  Jyh-Rong Lin ,  Shan-Pu Yu

IPC分类号： H01L23/04

CPC分类号： H01L23/5384 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/82

摘要： This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.

摘要翻译： 本发明涉及一种晶片级芯片封装方法，包括以下步骤：提供晶片; 将至少一个第一芯片附接到晶片; 在晶片上形成第一绝缘层; 形成穿过所述第一绝缘层的多个第一导电通孔，其中所述第一导电通孔的部分与所述第一芯片电连接; 在所述第一绝缘层的表面上形成导电图案层，其中所述导电图案层与所述第一导电通孔电连接; 形成穿过晶片的多个通孔; 在通孔中填充第二绝缘层; 以及在所述第二绝缘层中形成多个第二导电通孔，其中所述第二导电通孔与所述第一导电通孔电连接。

公开(公告)号：US20060157864A1

公开(公告)日：2006-07-20

申请号：US11269613

申请日：2005-11-09

申请人： Shou-Lung Chen ,  Ching-Wen Hsiao ,  Yu-Hua Chen ,  Jeng-Dar Ko ,  Jyh-Rong Lin

发明人： Shou-Lung Chen ,  Ching-Wen Hsiao ,  Yu-Hua Chen ,  Jeng-Dar Ko ,  Jyh-Rong Lin

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L24/97 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2224/82

摘要： The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.