公开(公告)号：USD908929S1

公开(公告)日：2021-01-26

申请号：US29628363

申请日：2017-12-04

申请人： CREE HONG KONG LIMITED

设计人： Charles Chak Hau Pang ,  Victor Yue Kwong Lau ,  Tiancai Su

公开(公告)号：US10900653B2

公开(公告)日：2021-01-26

申请号：US14070098

申请日：2013-11-01

申请人： CREE HONG KONG LIMITED

发明人： Antony Van De Ven ,  Wai Kwan Chan ,  Chin Wah Ho

IPC分类号： F21V29/507 ,  F21S8/00 ,  F21K9/20 ,  F21V15/015 ,  F21V29/70 ,  F21S8/02 ,  F21V29/77 ,  F21V29/76 ,  F21Y113/00 ,  F21W131/109 ,  F21V29/75 ,  F21Y115/10 ,  F21Y103/10

摘要： Solid state light engines are disclosed that emit a bright, non-symmetrical emission pattern, with a relatively high luminous flux and from a relatively small area. The light engines can be used in many different types and sizes of light sources, with some embodiments providing a light quantity, quality and distribution similar to conventional J-type Halogen light sources. The light engines are arranged with integral power supplies and heat management features that allow for the engines to provide high emission intensities while generating significantly less heat at the light source. This can result in significantly higher efficiency and greater life space. In some embodiments, the light can perform similarly to a halogen J-type Lamp 80 mm light tube, while generating similar or greater amounts of light. The light engines according to the present invention provide the capability to be used in low profile light fixtures.

公开(公告)号：US20150124437A1

公开(公告)日：2015-05-07

申请号：US14070098

申请日：2013-11-01

申请人： CREE HONG KONG LIMITED

发明人： ANTONY VAN DE VEN ,  WAI KWAN CHAN ,  CHIN WAH HO

IPC分类号： F21L13/00 ,  F21V23/06 ,  F21K99/00 ,  F21V29/00

CPC分类号： F21V29/507 ,  F21K9/20 ,  F21S8/024 ,  F21S8/033 ,  F21V15/015 ,  F21V29/70 ,  F21V29/75 ,  F21V29/763 ,  F21V29/767 ,  F21V29/77 ,  F21W2131/109 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10

摘要： Solid state light engines are disclosed that emit a bright, non-symmetrical emission pattern, with a relatively high luminous flux and from a relatively small area. The light engines can be used in many different types and sizes of light sources, with some embodiments providing a light quantity, quality and distribution similar to conventional J-type Halogen light sources. The light engines are arranged with integral power supplies and heat management features that allow for the engines to provide high emission intensities while generating significantly less heat at the light source. This can result in significantly higher efficiency and greater life space. In some embodiments, the light can perform similarly to a halogen J-type Lamp 80 mm light tube, while generating similar or greater amounts of light. The light engines according to the present invention provide the capability to be used in low profile light fixtures.

摘要翻译： 公开了固态光引擎，其发射具有相对高的光通量和相对小的区域的明亮的，非对称的发射图案。 光引擎可以用于许多不同类型和大小的光源，一些实施例提供类似于常规J型卤素光源的光量，质量和分布。 光引擎布置有集成的电源和热管理特征，其允许发动机提供高发射强度，同时在光源处产生明显较少的热量。 这可以显着提高效率和更大的使用寿命。 在一些实施例中，光可以类似于卤素J型灯80mm光管执行，同时产生相似或更大量的光。 根据本发明的光引擎提供了用于低调灯具的能力。

公开(公告)号：USD671661S1

公开(公告)日：2012-11-27

申请号：US29412854

申请日：2012-02-08

申请人： Chi-Wing Leung

设计人： Chi-Wing Leung

公开(公告)号：USD656906S1

公开(公告)日：2012-04-03

申请号：US29380636

申请日：2010-12-08

申请人： Chi-Wing Leung

设计人： Chi-Wing Leung

公开(公告)号：USD633631S1

公开(公告)日：2011-03-01

申请号：US29293900

申请日：2007-12-14

申请人： Yuh-Ren Shieh ,  Chi-Wing Leung

设计人： Yuh-Ren Shieh ,  Chi-Wing Leung

公开(公告)号：US20100155748A1

公开(公告)日：2010-06-24

申请号：US12321059

申请日：2009-01-14

申请人： Chi Keung Alex Chan ,  Yue Kwong Victor Lau ,  Xuan Wang

发明人： Chi Keung Alex Chan ,  Yue Kwong Victor Lau ,  Xuan Wang

IPC分类号： H01L33/00 ,  H01L23/495

CPC分类号： H01L33/62 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly. In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.

摘要翻译： 公开了一种用于增加色彩保真度和散热性，改善电流控制，增加封装组件的刚性的多元件发射器封装。 在一个实施例中，所述包装包括表面安装装置，提供具有从第一主表面延伸到所述壳体内部的空腔的壳体。 引线框架至少部分地被壳体包围，引线框架包括承载发光器件（LED）的线性阵列的多个导电部件。 与携带LED的部件分开的导电部件具有连接焊盘，其中LED例如通过引线键合电耦合到连接焊盘。 该引线框布置允许相应的电信号可以被施加到每个LED。 发射器封装可以是基本上防水的，并且发射器封装的阵列可以用在诸如室内和/或室外LED屏的LED显示器中。

公开(公告)号：US20100052126A1

公开(公告)日：2010-03-04

申请号：US12614989

申请日：2009-11-09

申请人： XIE JIAN HUI ,  CHENG SIU CHEONG

发明人： XIE JIAN HUI ,  CHENG SIU CHEONG

IPC分类号： H01L23/495

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

摘要： Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.

摘要翻译： 一些实施例提供了表面贴装器件，其包括包括芯片载体部分的第一电极，靠近芯片载体部分设置的第二电极以及包围第一和第二电极的一部分的壳体。 第一电极可以从芯片载体部分延伸到壳体的周边，并且第二电极可以远离芯片载体部分延伸并且突出到壳体外部。 在从芯片载体部分延伸出来之后，第一电极分成多个引线，该引线由孔径分开，该突起在突出到壳体外部之前连接到具有第一宽度的单个第一接合引线部分，并将第一宽度保持在壳体外部。 第二电极可以在突出外壳之前达到第二宽度，并将第二宽度保持在外壳外部。

公开(公告)号：US07635915B2

公开(公告)日：2009-12-22

申请号：US11380402

申请日：2006-04-26

申请人： Jian Hui Xie ,  Siu Cheong Cheng

发明人： Jian Hui Xie ,  Siu Cheong Cheng

IPC分类号： H01L23/48

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

摘要： Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.

摘要翻译： 一些实施例提供了表面贴装器件，其包括包括芯片载体部分的第一电极，靠近芯片载体部分设置的第二电极以及包围第一和第二电极的一部分的壳体。 第一电极可以从芯片载体部分延伸到壳体的周边，并且第二电极可以远离芯片载体部分延伸并且突出到壳体外部。 在从芯片载体部分延伸出来之后，第一电极分成多个引线，该引线由孔径分开，该突起在突出到壳体外部之前连接到具有第一宽度的单个第一接合引线部分，并将第一宽度保持在壳体外部。 第二电极可以在突出外壳之前达到第二宽度，并将第二宽度保持在外壳外部。

公开(公告)号：US20090283781A1

公开(公告)日：2009-11-19

申请号：US12152766

申请日：2008-05-16

申请人： Alex Chan ,  Xuan Wang

发明人： Alex Chan ,  Xuan Wang

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L24/48 ,  H01L24/73 ,  H01L33/486 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In one embodiment, a surface-mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises (1) an electrically conductive LED chip carrier part having a surface carrying a linear array of LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the LEDs being electrically and thermally coupled to the chip carrying surface of the chip carrier part; and (2) electrically conductive connection parts separate from the chip carrier part, each of the connection parts having a connection pad, the second terminal of each of the LEDs being electrically coupled to the connection pad of a corresponding one of the connection parts with a single wire bond. The linear array of LEDs extends in a first direction, and each of the chip carrier part and connection parts has a lead. The leads may be disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction. An array of the surface-mount devices may be used in an LED display such as an indoor LED screen.

摘要翻译： 在一个实施例中，表面安装装置包括具有相对的第一和第二主表面，侧表面和端表面的壳体。 由壳体部分地包围的引线框架包括（1）导电LED芯片载体部件，其具有表面，该表面承载LED的线性阵列，其适于被激励以组合产生基本上全范围的颜色，每个LED具有第一电端子 和第二电端子，每个LED的第一端子电和热耦合到芯片承载部件的芯片承载表面; 和（2）与芯片载体部分分离的导电连接部分，每个连接部分具有连接焊盘，每个LED的第二端子电连接到相应的一个连接部分的连接焊盘，其中， 单线键 LED的线性阵列沿第一方向延伸，并且每个芯片载体部分和连接部分都具有引线。 引线可以彼此平行地设置并且在第二方向上延伸穿过壳体的端面，第二方向与第一方向正交。 表面安装器件的阵列可以用在诸如室内LED屏的LED显示器中。