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    Method for automated monitoring of a soldering process, soldering device with monitoring device
    1.
    发明公开
    Method for automated monitoring of a soldering process, soldering device with monitoring device 审中-公开

    公开(公告)号：US20240250488A1

    公开(公告)日：2024-07-25

    申请号：US18419916

    申请日：2024-01-23

    申请人： ERSA GmbH

    发明人： Timon Ahlgrimm

    IPC分类号： H01R43/02 ,  H05K13/08

    CPC分类号： H01R43/0242 ,  H05K13/0817

    摘要： A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (Px,y,z), and/or a first device acceleration (ax,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (Px,y,z), and/or a second device acceleration (ax,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (Px,y,z), and/or the device acceleration (ax,y,z).

    SOLDERING APPARATUS
    3.
    发明公开
    SOLDERING APPARATUS 审中-公开

    公开(公告)号：US20230147071A1

    公开(公告)日：2023-05-11

    申请号：US17983061

    申请日：2022-11-08

    申请人： ERSA GmbH

    发明人： Lothar Endreß ,  Benedict Fleischmann ,  Lukas Thanhäuser

    IPC分类号： B23K3/08 ,  B23K1/00 ,  H05K3/10

    CPC分类号： B23K3/085 ,  B23K1/0016 ,  H05K3/10 ,  B23K2101/42

    摘要： A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.

    TRANSPORT UNIT FOR TRANSPORTING PRINTED CIRCUIT BOARDS, AND SOLDERING SYSTEM
    4.
    发明申请
    TRANSPORT UNIT FOR TRANSPORTING PRINTED CIRCUIT BOARDS, AND SOLDERING SYSTEM 有权

    公开(公告)号：US20220362893A1

    公开(公告)日：2022-11-17

    申请号：US17771085

    申请日：2020-10-14

    申请人： ERSA GmbH

    发明人： Ruppert Elmar ,  Thomas Huhler ,  Benedict Fleischmann ,  Simon Hame

    IPC分类号： B23K37/04 ,  B23K1/00 ,  B23K3/08 ,  H05K13/00

    摘要： A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

    Soldering system
    7.
    发明授权
    Soldering system 有权

    公开(公告)号：US11014180B2

    公开(公告)日：2021-05-25

    申请号：US16166286

    申请日：2018-10-22

    申请人： ERSA GmbH

    发明人： Thomas Alletzhaeusser ,  Tim Alletzhaeusser

    IPC分类号： B23K3/00 ,  B23K3/02 ,  B23K3/04 ,  B23K3/06 ,  B23K3/08 ,  B23K3/03 ,  H04L29/08 ,  B23K3/047 ,  B23K31/12 ,  B23K37/02 ,  G05D23/22 ,  B23K101/42

    摘要： Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

    Soldering Device, Soldering System And Method
    8.
    发明申请
    Soldering Device, Soldering System And Method 审中-公开

    公开(公告)号：US20200156168A1

    公开(公告)日：2020-05-21

    申请号：US16630145

    申请日：2018-07-02

    申请人： ERSA GmbH

    发明人： Meinrad Eckert ,  Stefan Voelker

    IPC分类号： B23K1/018 ,  B23K1/08 ,  B08B1/04 ,  H05K3/26

    摘要： The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, comprising a brush device for removing solder pearls and/or solder balls from the lower face of a printed circuit board. The brush device has a brush which can be driven about a drive axis and which is designed to remove the solder pearls and/or solder balls, wherein a moving device is provided, said brush device being arranged on the moving device such that the brush device can be moved relative to the printed circuit board in the direction of an X, Y, and Z axis.

    Soldering apparatus
    9.
    发明授权
    Soldering apparatus 有权

    公开(公告)号：US12097575B2

    公开(公告)日：2024-09-24

    申请号：US17983061

    申请日：2022-11-08

    申请人： ERSA GmbH

    发明人： Lothar Endreß ,  Benedict Fleischmann ,  Lukas Thanhäuser

    IPC分类号： B23K3/00 ,  B23K1/00 ,  B23K3/08 ,  H05K3/10 ,  B23K101/42

    CPC分类号： B23K3/085 ,  B23K1/0016 ,  H05K3/10 ,  B23K2101/42 ,  H05K2203/1509 ,  H05K2203/1545

    摘要： A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.