-
公开(公告)号：US09607754B2
公开(公告)日：2017-03-28
申请号：US14029684
申请日：2013-09-17
发明人： Yoon Hyuck Choi , Kwang Jae Oh , Ki Young Kim
CPC分类号： H01F27/2804 , G01R1/07378 , G01R31/26 , G01R31/2889 , H01F27/29 , H01F27/292
摘要： Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
-
公开(公告)号：US09974173B2
公开(公告)日：2018-05-15
申请号：US14887108
申请日：2015-10-19
发明人： Taek Jung Lee , Yong Suk Kim
IPC分类号： H05K1/09 , H05K3/40 , H05K3/46 , H01L23/498 , H01L21/48
CPC分类号： H05K1/092 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/30 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/562 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K3/4007 , H05K3/4038 , H05K3/4629 , H05K3/4644 , H05K2201/0338 , H01L2924/00
摘要： A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.
-
公开(公告)号：US10119994B2
公开(公告)日：2018-11-06
申请号：US14934803
申请日：2015-11-06
发明人： Yong Seok Choi , Doo Yun Chung , Dae Hyeong Lee
摘要： A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.
-
公开(公告)号：US09947457B2
公开(公告)日：2018-04-17
申请号：US15443653
申请日：2017-02-27
申请人： SEMCNS CO., LTD.
发明人： Yoon Hyuck Choi , Kwang Jae Oh , Ki Young Kim
CPC分类号： H01F27/2804 , G01R1/07378 , G01R31/26 , G01R31/2889 , H01F27/29 , H01F27/292
摘要： Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
-
公开(公告)号：US09681551B2
公开(公告)日：2017-06-13
申请号：US14260950
申请日：2014-04-24
发明人： Ji-Sung Na , Beom-Joon Cho , Jung-Goo Choi , Yun-Hwi Park , Kwang-Jae Oh , Ho-Sung Choo , Ji-Hwan Shin
IPC分类号： H01G4/005 , H01G4/30 , H01G4/008 , H01G4/228 , H01G4/20 , H05K1/18 , H01G4/12 , H01G4/232 , H05K1/03 , H05K3/46
CPC分类号： H05K1/185 , H01G4/0085 , H01G4/12 , H01G4/2325 , H01G4/30 , H05K1/0306 , H05K3/4697
摘要： The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.
-
-
-
-
搜索结果
5 条记录 (耗时 0.012 秒)
