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公开(公告)号：US08653467B2
公开(公告)日：2014-02-18
申请号：US13526919
申请日：2012-06-19
IPC分类号： G01T1/24
CPC分类号： G01S13/89 , G01S2007/028 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2223/6655 , H01L2223/6677 , H01L2224/04105 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01Q1/2283 , H01Q21/0006
摘要： A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.
摘要翻译： 用于成像系统的接收器芯片包括多个接收器管芯，每个接收器管芯包括一个或多个接收器电路; 位于所述多个接收器管芯的顶部上的管芯互连层; 位于芯片互连层顶部的四分之一波长介电层; 以及位于所述四分之一波长介电层上的多个天线，所述多个天线中的每一个对应于相应的接收器电路，其中所述多个天线通过所述四分之一波长介电层连接到所述一个或多个接收器电路，并且所述管芯互连 使得芯片互连层的最上层与多个天线之间的距离由四分之一波长介电层的厚度确定。
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公开(公告)号：US20130334425A1
公开(公告)日：2013-12-19
申请号：US13526919
申请日：2012-06-19
IPC分类号： H01L27/146
CPC分类号： G01S13/89 , G01S2007/028 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2223/6655 , H01L2223/6677 , H01L2224/04105 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01Q1/2283 , H01Q21/0006
摘要： A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.
摘要翻译： 用于成像系统的接收器芯片包括多个接收器管芯，每个接收器管芯包括一个或多个接收器电路; 位于所述多个接收器管芯的顶部上的管芯互连层; 位于芯片互连层顶部的四分之一波长介电层; 以及位于所述四分之一波长介电层上的多个天线，所述多个天线中的每一个对应于相应的接收器电路，其中所述多个天线通过所述四分之一波长介电层连接到所述一个或多个接收器电路，并且所述管芯互连 使得芯片互连层的最上层与多个天线之间的距离由四分之一波长介电层的厚度确定。
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公开(公告)号：US08511823B2
公开(公告)日：2013-08-20
申请号：US13026854
申请日：2011-02-14
CPC分类号： A61B3/12 , H04N5/341 , H04N5/3454 , H04N5/3456 , H04N5/3696
摘要： According to certain embodiments, foveal array elements of a foveal region of a focal plane array are sampled at a faster sampling rate to yield foveal array data. Peripheral array elements of a peripheral region of the focal plane array are sampled at a slower sampling rate or sparser sampling density to yield peripheral array data. The foveal array data is processed to yield foveal image data for a foveal region of a display. The peripheral array data is processed to yield peripheral image data for a peripheral region of the display.
摘要翻译： 根据某些实施例，焦平面阵列的中心凹区域的中心凹阵列元件以更快的采样率被采样以产生中心凹阵列数据。 以较慢的采样率或较稀疏采样密度对焦平面阵列的外围区域的外围阵列元件进行采样，以产生外围阵列数据。 处理中心凹阵列数据以产生显示器的中心凹区域的中心凹图像数据。 外围阵列数据被处理以产生显示器的外围区域的外围图像数据。
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公开(公告)号：US20130021203A1
公开(公告)日：2013-01-24
申请号：US13189233
申请日：2011-07-22
IPC分类号： H01Q3/00
CPC分类号： H01Q19/09 , H01Q19/062 , H01Q21/061 , H01Q21/225
摘要： According one embodiment, a millimeter-wave radiation imaging array includes a plurality of antenna elements configured to receive millimeter-wave radiative input. Each lenslet of a plurality of lenslets are coupled to one of the plurality of antenna elements such that no air exists between each lenslet and the one of the plurality of antenna elements. Each lenslet has a spherical portion being operable to direct the radiative input towards the one of the plurality of antenna elements. An energy detector is coupled to the plurality of antenna elements opposite the plurality of lenslets and operable to measure the radiative input received by the plurality of antenna elements.
摘要翻译： 根据一个实施例，毫米波辐射成像阵列包括配置成接收毫米波辐射输入的多个天线元件。 多个小透镜的每个小透镜被耦合到多个天线元件中的一个，使得每个小透镜和多个天线元件中的一个之间不存在空气。 每个小透镜具有可操作以将辐射输入引导到多个天线元件中的一个的球形部分。 能量检测器耦合到与多个小透镜相对的多个天线元件，并可操作以测量由多个天线元件接收的辐射输入。
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公开(公告)号：US20120139072A1
公开(公告)日：2012-06-07
申请号：US13298955
申请日：2011-11-17
申请人： Stephen H. Black , Thomas A. Kocian
发明人： Stephen H. Black , Thomas A. Kocian
IPC分类号： H01L31/02 , H01L31/0232
CPC分类号： H01L27/14683 , H01L27/14618 , H01L27/14649 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a wafer level packaged focal plane array, in accordance with certain embodiments, includes forming a detector wafer, which may include forming detector arrays and read-out circuits. The method may also include forming a lid wafer. Forming the lid wafer may include polishing a surface of a magnetically confined Czochralski (MCZ) wafer, bonding a Czochralski wafer to the MCZ wafer, and forming pockets in the Czochralski wafer. Each pocked may expose a portion of the polished surface of the MCZ wafer. The method may further include bonding the lid wafer and the detector wafer together such that the each detector array and read-out circuit are sealed within a different pocket, thereby forming a plurality of wafer level packaged focal plane arrays. The method may additionally include separating at least one wafer level packaged focal plan array from the plurality of wafer level packaged focal plane arrays.
摘要翻译： 根据某些实施例的用于制造晶片级封装焦平面阵列的方法包括形成检测器晶片，其可以包括形成检测器阵列和读出电路。 该方法还可以包括形成盖子晶片。 形成盖晶片可以包括抛光限磁切克劳斯基（MCZ）晶片的表面，将切克劳斯基晶片结合到MCZ晶片，以及在切克劳斯基晶片中形成凹坑。 每一个可能会暴露MCZ晶片抛光表面的一部分。 该方法还可以包括将盖晶片和检测器晶片结合在一起，使得每个检测器阵列和读出电路被密封在不同的口袋内，由此形成多个晶片级封装的焦平面阵列。 该方法可以另外包括从多个晶片级封装焦平面阵列分离至少一个晶片级封装焦点平面图阵列。
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公开(公告)号：US5051747A
公开(公告)日：1991-09-24
申请号：US485433
申请日：1990-02-27
申请人： Mark W. Harshman , Stephen H. Black
发明人： Mark W. Harshman , Stephen H. Black
IPC分类号： H05K9/00
CPC分类号： H05K9/0018
摘要： A system for introducing N cables into an anechoic chamber, where N.gtoreq.1 comprising a channel having an electrically conductive interior, and an electrically conductive entrance in communication with the chamber such that the cables can extend from the channel into the chamber. The system is also comprised of a housing made of a conductive material disposed such that it forms an electrically conductive seal with the channel entrance. There is also a lossy material disposed inside and essentially filling the housing through which the cables extend. In a preferred embodiment, electricaly magnetic radiation having a frequency of up to 100 GHZ is essentially prevented from escaping the chamber. The present invention also pertains to an interface through which N cables, where N.gtoreq.1, are introduced into a first region having electromagnetic radiation with a frequency at least above 10 GHZ from a second region essentially isolated from the first region such that essentially no electromagnetic radiation between a frequency of 10 GHZ and 100 GHZ escapes from the first region to the second region through the interface.
摘要翻译： 一种用于将N个电缆引入到消声室中的系统，其中N 1 / = 1包括具有导电内部的通道，以及与所述室连通的导电入口，使得所述电缆可以从所述通道延伸到所述室中。 该系统还包括由导电材料制成的壳体，该壳体设置成与通道入口形成导电密封。 还有一种有损耗的材料设置在内部并且基本上填充电缆延伸通过的壳体。 在优选实施例中，基本上防止频率高达100GHZ的电磁辐射逸出室。 本发明还涉及一种接口，通过该接口，从基本上与第一区域分离的第二区域将N个电缆（其中N≥1）引入具有至少高于10GHZ的频率的电磁辐射的第一区域，使得基本上 10 GHZ和100 GHZ的频率之间的电磁辐射不会通过界面从第一区域逸出到第二区域。
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公开(公告)号：US08586926B2
公开(公告)日：2013-11-19
申请号：US13215430
申请日：2011-08-23
IPC分类号： G01J5/00
CPC分类号： H01Q21/061 , H01L27/14603 , H01Q1/248 , H01Q19/10 , H01Q21/20
摘要： According one embodiment, a non-heterodyne radiation imager includes a substrate having a ground plane layer. The radiation imager also includes a plurality of antenna elements operable to receive radiative input. Each support element of a plurality of support elements mechanically couples an antenna element of the plurality of antenna elements to the substrate. A plurality of energy detectors is operable to measure the radiative input received by the plurality of antenna elements.
摘要翻译： 根据一个实施例，非外差辐射成像器包括具有接地层的衬底。 辐射成像仪还包括可操作以接收辐射输入的多个天线元件。 多个支撑元件的每个支撑元件将多个天线元件的天线元件机械耦合到基板。 多个能量检测器可操作以测量由多个天线元件接收的辐射输入。
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公开(公告)号：US20130050015A1
公开(公告)日：2013-02-28
申请号：US13215430
申请日：2011-08-23
IPC分类号： G01S13/89
CPC分类号： H01Q21/061 , H01L27/14603 , H01Q1/248 , H01Q19/10 , H01Q21/20
摘要： According one embodiment, a non-heterodyne radiation imager includes a substrate having a ground plane layer. The radiation imager also includes a plurality of antenna elements operable to receive radiative input. Each support element of a plurality of support elements mechanically couples an antenna element of the plurality of antenna elements to the substrate. A plurality of energy detectors is operable to measure the radiative input received by the plurality of antenna elements.
摘要翻译： 根据一个实施例，非外差辐射成像器包括具有接地层的衬底。 辐射成像仪还包括可操作以接收辐射输入的多个天线元件。 多个支撑元件的每个支撑元件将多个天线元件的天线元件机械耦合到基板。 多个能量检测器可操作以测量由多个天线元件接收的辐射输入。
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9.发明授权System and method for viewing an area using an optical system positioned inside of a dewar 有权使用位于杜瓦瓶内部的光学系统观察区域的系统和方法公开(公告)号：US08294103B2
公开(公告)日：2012-10-23
申请号：US13280061
申请日：2011-10-24
IPC分类号： G01J5/04
CPC分类号： G01J5/061 , G01J5/08 , G01J5/0806 , G01J5/0843 , G02B7/028 , G02B23/2492
摘要： According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.
摘要翻译： 根据本发明的一个实施例，用于观察区域的系统包括位于杜瓦瓶内的杜瓦瓶和光学系统。 在一些实施方案中，杜瓦瓶允许通量检测器在低温温度下操作。 光学系统包括能够聚焦一个或多个光束的红外辐射系统。 如果需要，将光学系统包含在杜瓦瓶的低温空间内允许减小整个系统的长度和重量。
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公开(公告)号：US20120096813A1
公开(公告)日：2012-04-26
申请号：US13275635
申请日：2011-10-18
申请人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
发明人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
IPC分类号： B65B3/02
CPC分类号： H01L27/14618 , B81B7/0077 , G01J5/045 , H01L23/10 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L27/14683 , H01L2224/04026 , H01L2224/05073 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05187 , H01L2224/05563 , H01L2224/05582 , H01L2224/05644 , H01L2224/05669 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/29144 , H01L2224/32225 , H01L2224/83815 , H01L2224/94 , H01L2924/0002 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/04941 , H01L2924/05341 , H01L2924/014 , H01L2224/83 , H01L2924/0105
摘要： In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.
摘要翻译： 根据具体实施例，一种用于封装入射辐射检测器的方法包括在透明盖基板的第一表面上沉积不透明的阻焊材料，该第一表面被构造成覆盖至少一个检测器。 该方法还包括在盖基板中形成至少一个空腔。 该方法还包括在不透明的耐焊材料上形成至少一个密封环的第一部分。 每个气密密封环的第一部分围绕盖衬底中的相应空腔的周边。 该方法还包括将至少一个密封环的第一部分与至少一个密封环的第二部分对准。 该方法还包括用焊料将至少一个气密密封环的第一部分与至少一个密封环的第二部分接合。
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