Abstract:
Microbolometer circuitry and methods are disclosed to allow an individual microbolometer or groups of microbolometers, such as a microbolometer focal plane array, to operate over a wide temperature range. Temperature compensation is provided, such as through circuitry and/or calibration methods, to reduce non-uniform behavior over the desired operating temperatures. For example, the relative mismatch in the temperature coefficient of resistance of an active microbolometer and a reference microbolometer is compensated by employing a variable resistor in series with the active microbolometer. The variable resistor can be calibrated over the desired temperature range to minimize the affect of the relative mismatch. Various other circuit implementations, calibration methods, and processing of the microbolometer circuit output can be employed to provide further compensation.
Abstract:
A night vision system for a vehicle includes a pulsed light source for illuminating a region proximate the vehicle and a secondary trigger light source operating at a predetermined pulse timing and second wavelength. A light sensor detects light at the second wavelength. The trigger light pulses are used to indicate the pulse timing of each respective vehicle's primary NIR light source. Upon detecting another vehicle's trigger light source, the controller adjusts the pulse phase of the first light source to be exactly out-of-phase with that of the oncoming vehicle since the pulsed timing of the oncoming vehicle's NIR light source is known upon detection of the opposing vehicle's trigger light source. Each vehicle can then adjust its primary light source to be out-of-phase with the other vehicle and, hence, non-interfering.
Abstract:
The invention provides a passive two-stage multiwavelength approach for measuring temperature, emissivity and stray-light levels. The first stage comprises the steps of, (1) acquiring spectral intensity measurements over a predetermined spectral width of a thermal radiation source radiating at a true effective spectral emissivity and with a true source temperature, (2) forming a composite function that relates said spectral intensity measurements to the true effective spectral emissivity and the true source temperature, (3) providing emissivity estimating means for approximately determining how the true effective emissivity affects the color temperature of the thermal radiation source, (4) substituting an estimated effective spectral emissivity for the true effective spectral emissivity within the composite function such that the estimated emissivity approximately accounts for the effects of the true effective emissivity on the color temperature, (5) substituting a source temperature projection for the true source temperature within the composite function, and (6) utilizing the composite function to provide a best-fit correlation between the spectral intensity measurements, the estimated emissivity, and the projected source temperature such that when the projected source temperature equals the true source temperature the composite function attains an extremum, thereby obtaining an approximation of said source temperature. The second stage comprises the steps of (1) utilizing spectral acquisition means to acquire and measure a set of multiple spectral intensity distributions of a thermal radiation source radiating at multiple source temperatures at an effective spectral emissivity, wherein each of the spectral intensity distributions is associated with a particular source temperature, and (2) forming a first function of at least two of the measured spectral intensity distributions and of a set of temperature variables that represent the temperatures of the spectral intensity distributions used, such that the first function attains an extremum when the temperature variables equal the corresponding source temperatures, thereby calculating the source temperatures.
Abstract:
A pyrometer for use in measuring temperatures in a furnace, has a lens-tube for supporting an optical head in a port of the furnace for viewing an interior of the furnace along a line of sight. The optical head converts infrared radiation to electrical signals. A photometer circuit connected to the optical head processes the electrical signals and a scaling circuit connected to the photometer circuit scales the electrical signals. An output circuit connected to the scaling circuit receives the scaled electrical signals and produces output signals for display or control of the furnace. A power supply connected to the scaling circuit powers the photometer, scaling and output circuits. Calibration in the scaling circuit scales the electrical signals to be most sensitive to a wavelength of middle infrared radiation to which at least one gas component in the furnace is semi-transparent, for measuring the temperature of the at least one gas component.
Abstract:
An improved detector assembly 10 having decreased sensitivity both to Narcissism and to stray light ghosting is disclosed herein. The improved detector assembly 10 of the present invention includes a housing 70 having an input aperture 142 in communication with a chamber within said housing. A detector 130 for sensing electromagnetic energy passing through the input aperture 142 within a first field of view is mounted within the chamber. Also mounted within the chamber is a detector mirror 100 for reflecting energy passing through the input aperture 142 within a second field of view outside of the first field of view. The improved assembly 10 of the present invention further includes a second mirror 110 mounted within the chamber for reflecting energy reflected by the first mirror 100 through the input aperture 142.
Abstract:
An infrared detecting capacitor formed of a ferroelectric film has its capacitor portion supported by first and second interconnecting lines to be held on an Si substrate located on both sides of a trench. A lower electrode is coupled with the first interconnecting line while an upper electrode is coupled with the second interconnecting line. The capacitor portion is a rectangle in shape in plan view without small triangular sections opposite to each other in the diagonal direction.
Abstract:
An optoelectronic measuring device for monitoring combustion processes in the combustion chamber of an internal combustion engine during operation includes optical sensors assigned to the combustion chamber and connected to an evaluation unit, the sensor ends on the side of the combustion chamber being essentially positioned in a plane and the sensors being aligned so that the individual viewing angles of the sensors will uniformly cover at least one predefined measuring sector of the combustion chamber. A simple way of localizing the origin of engine knocking in the combustion chamber is ensured by positioning the optical sensors in an essentially cylindrical component projecting into the combustion chamber with the sensor ends positioned essentially radially along the wall of the component.
Abstract:
A focal plane array (FPA) of infrared (IR) radiation detectors (20), such as an array of microbolometers, includes an active area (20A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) (12) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements (30A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors (30B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.
Abstract:
An infrared detector employing infrared element control circuit wherein the effect of external light on the sensitivity of the infrared element itself is reduced by approximately 80% by the use of a biased feedback loop.
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer (104) on a silicon wafer (102). The accommodating buffer layer (104) is a layer of monocrystalline material spaced apart from the silicon wafer (102) by an amorphous interface layer (108) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Utilizing this technique permits the fabrication of thin film pyroelectric devices (150) on a monocrystalline silicon substrate.