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    Structure and process for packaging RF MEMS and other devices
    1.
    发明申请
    Structure and process for packaging RF MEMS and other devices 审中-公开
    RF MEMS和其他器件封装的结构和工艺

    公开(公告)号：US20060211177A1

    公开(公告)日：2006-09-21

    申请号：US11436033

    申请日：2006-05-18

    申请人： Leonard Schaper ,  Ajay Malshe ,  Chad O'Neal

    发明人： Leonard Schaper ,  Ajay Malshe ,  Chad O'Neal

    IPC分类号： H01L21/00 ,  H01L21/4763

    CPC分类号： B81C1/00333 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2203/0118 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49827 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

    摘要翻译： 用于封装RF MEMS和其它器件的结构和工艺采用例如硅的衬底和例如具有腔的接收器件的玻璃帽。 MEMS或其他器件被支撑在衬底的上表面上，形成有金属填充的盲孔。 盖连接到基板，以便将指定的MEMS或其它装置封装在空腔中。 然后使衬底变薄，以便在衬底的下表面露出通孔的金属。 然后将诸如焊球的电连接元件施加到通孔的金属。 然后将得到的复合衬底分开以提供单独的封装器件。

    Structure and process for packaging rf mems and other devices
    2.
    发明申请
    Structure and process for packaging rf mems and other devices 失效
    用于包装rf mems和其他设备的结构和过程

    公开(公告)号：US20050006738A1

    公开(公告)日：2005-01-13

    申请号：US10494956

    申请日：2002-11-06

    申请人： Leonard Schaper ,  Ajay Malshe ,  Chad O'Neal

    发明人： Leonard Schaper ,  Ajay Malshe ,  Chad O'Neal

    IPC分类号： B81B7/00 ,  H01L21/44 ,  H01L21/50 ,  H01L23/02 ,  H01L23/12 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498

    CPC分类号： B81C1/00333 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2203/0118 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49827 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, or example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

    摘要翻译： 用于封装RF MEMS和其它器件的结构和工艺采用例如硅的衬底以及具有腔以接收器件的玻璃帽。 MEMS或其他器件被支撑在衬底的上表面上，形成有金属填充的盲孔。 盖连接到基板，以便将指定的MEMS或其他装置封装在空腔中。 然后使衬底变薄，以便在衬底的下表面露出通孔的金属。 然后将诸如焊球的电连接元件施加到通孔的金属。 然后将得到的复合衬底分开以提供单独的封装器件。

    Packaging and integration system for micro sensors in the marine environment
    3.
    发明授权
    Packaging and integration system for micro sensors in the marine environment 失效
    微型传感器在海洋环境中的包装和集成系统

    公开(公告)号：US07456551B2

    公开(公告)日：2008-11-25

    申请号：US11609445

    申请日：2006-12-12

    申请人： Shekhar Bhansali ,  Ajay Malshe ,  Shyam Aravamudhan

    发明人： Shekhar Bhansali ,  Ajay Malshe ,  Shyam Aravamudhan

    IPC分类号： H01L41/08

    CPC分类号： G01V1/38

    摘要： The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters over large time spans weeks, with higher accuracies and resolution and at significantly lower costs that the other sensors currently known in the art.

    摘要翻译： 根据本发明的综合的无人值守的微型系统用于部署用于在大时间段内连续监测海洋空间的物理或化学传感器。 微系统能够在较长时间跨度周测量海洋物理参数，具有更高的精度和分辨率，并且以本领域当前已知的其它传感器显着降低成本。

    Packaging and Integration System for Micro Sensors in the Marine Environment
    4.
    发明申请
    Packaging and Integration System for Micro Sensors in the Marine Environment 失效
    微型传感器在海洋环境中的包装和集成系统

    公开(公告)号：US20070194663A1

    公开(公告)日：2007-08-23

    申请号：US11609445

    申请日：2006-12-12

    申请人： Shekhar Bhansali ,  Ajay Malshe ,  Shyam Aravamudhan

    发明人： Shekhar Bhansali ,  Ajay Malshe ,  Shyam Aravamudhan

    IPC分类号： H01L41/00 ,  H01L21/30

    CPC分类号： G01V1/38

    摘要： The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters over large time spans weeks, with higher accuracies and resolution and at significantly lower costs that the other sensors currently known in the art.

    摘要翻译： 根据本发明的综合的无人值守的微型系统用于部署用于在大时间段内连续监测海洋空间的物理或化学传感器。 微系统能够在较长时间跨度周测量海洋物理参数，具有更高的精度和分辨率，并且以本领域当前已知的其它传感器显着降低成本。