公开(公告)号：US5920115A

公开(公告)日：1999-07-06

申请号：US962396

申请日：1997-10-31

申请人： Makoto Kimura ,  Shinji Tojo ,  Takahiro Fujioka ,  Akihiko Narisawa ,  Yoshiyuki Tanigawa ,  Shinya Kanamitsu ,  Koji Akimoto ,  Hiroyuki Mouri

发明人： Makoto Kimura ,  Shinji Tojo ,  Takahiro Fujioka ,  Akihiko Narisawa ,  Yoshiyuki Tanigawa ,  Shinya Kanamitsu ,  Koji Akimoto ,  Hiroyuki Mouri

IPC分类号： H01L23/50 ,  G02F1/13 ,  G09G3/20 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/495 ,  H01L23/52 ,  G09G3/36 ,  H01L23/28 ,  H01L23/48

CPC分类号： H01L24/50 ,  G09G3/20 ,  H01L23/49572 ,  G02F1/13452 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082

摘要： To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

摘要翻译： 为了提供在半导体芯片的主平面的整个边缘上设置薄树脂膜的半导体器件，在薄树脂膜上设置引线，引线与半导体芯片的输入和输出电极焊盘电连接 ，电接头用密封树脂覆盖并密封。

公开(公告)号：US06784554B2

公开(公告)日：2004-08-31

申请号：US10321567

申请日：2002-12-18

申请人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Masayoshi Shinoda ,  Akihiko Narisawa ,  Asao Nishimura ,  Toshiaki Morita ,  Kazuya Takahashi ,  Kazutoshi Itou

发明人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Masayoshi Shinoda ,  Akihiko Narisawa ,  Asao Nishimura ,  Toshiaki Morita ,  Kazuya Takahashi ,  Kazutoshi Itou

IPC分类号： H01L2348

CPC分类号： H01L24/16 ,  H01L24/02 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/244 ,  H05K3/4602 ,  H01L2924/00

摘要： In a semiconductor device in which an LSI chip comprising electrodes with a 100 &mgr;m pitch or less and 50 or more pins is mounted directly on an organic substrate, a mounting structure and a manufacturing method thereof are provided excellent in the solder resistant reflow property, temperature cycle reliability and high temperature/high humidity reliability of the semiconductor device. Electrode Au bumps of the chip and an Au film at the uppermost surface of connection terminals of the substrate are directly flip-chip bonded by Au/Au metal bonding and the elongation of the bonded portion of the Au bump is 2 &mgr;m or more. The method of obtaining the bonded structure involves a process of supersonically bonding both of the bonding surfaces within 10 min after sputter cleaning, under the bonding conditions selected from room temperature on the side of the substrate, room temperature to 150° C. on the side of the chip, a bonding load of ½S×100 MPa to S×180 MPa (S: contact area between bump and chip), a loading mode increasing during bonding, and supersonic application time of 50 to 500 ms.

摘要翻译： 在其中包括具有100mum间距的电极和50个或更多个引脚的电极的LSI芯片直接安装在有机基板上的半导体器件中，提供了优良的耐焊接回流性能，温度 半导体器件的循环可靠性和高温/高湿度可靠性。 电极在基板的连接端子的最上表面处的芯片的Au凸块和Au膜通过Au / Au金属接合直接倒装芯片接合，并且Au凸块的接合部分的伸长率为2μm以上。 获得接合结构的方法包括在溅射清洗后10分钟内在选自室温一侧的接合条件下在室温至室温至150℃之间的接合条件下将两个接合表面进行超声波接合的方法 芯片的接合负载为1/2S×100MPa至Sx180MPa（S：凸点与芯片之间的接触面积），接合期间的负载模式增加，超音速施加时间为50〜500ms。

公开(公告)号：US5767571A

公开(公告)日：1998-06-16

申请号：US662968

申请日：1996-06-13

申请人： Makoto Kimura ,  Shinji Tojo ,  Takahiro Fujioka ,  Akihiko Narisawa ,  Yoshiyuki Tanigawa ,  Shinya Kanamitsu ,  Koji Akimoto ,  Hiroyuki Mouri

发明人： Makoto Kimura ,  Shinji Tojo ,  Takahiro Fujioka ,  Akihiko Narisawa ,  Yoshiyuki Tanigawa ,  Shinya Kanamitsu ,  Koji Akimoto ,  Hiroyuki Mouri

IPC分类号： H01L23/50 ,  G02F1/13 ,  G09G3/20 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/495 ,  H01L23/52 ,  G09G3/36 ,  H01L23/28 ,  H01L23/48

CPC分类号： H01L24/50 ,  G09G3/20 ,  H01L23/49572 ,  G02F1/13452 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082

摘要： To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

摘要翻译： 为了提供在半导体芯片的主平面的整个边缘上设置薄树脂膜的半导体器件，在薄树脂膜上设置引线，引线与半导体的输入和输出电极焊盘电连接 芯片，电接头用密封树脂覆盖和密封。