Circuit configuration
    5.
    发明授权
    Circuit configuration 有权
    电路配置

    公开(公告)号:US08031035B2

    公开(公告)日:2011-10-04

    申请号:US12900208

    申请日:2010-10-07

    CPC classification number: H01P1/20345

    Abstract: A ceramic multilayer construction includes three resonators designed as parallel strip lines that are capacitatively or magnetically coupled to each other. All circuit components are implemented in the form of metallizations in multilayer construction. Capacitative couplings are implemented by coupling capacitors. The strip line resonators are shortened by shunt arms to ground having grounding capacitors arranged therein.

    Abstract translation: 陶瓷多层结构包括设计成彼此电容或磁耦合的平行条线的三个谐振器。 所有电路元件以多层结构中的金属化形式实现。 电容耦合由耦合电容实现。 带状线谐振器由分流臂缩短到地面,其中布置有接地电容器。

    Circuit Configuration
    6.
    发明申请
    Circuit Configuration 有权
    电路配置

    公开(公告)号:US20110074521A1

    公开(公告)日:2011-03-31

    申请号:US12900208

    申请日:2010-10-07

    CPC classification number: H01P1/20345

    Abstract: A ceramic multilayer construction includes three resonators designed as parallel strip lines that are capacitatively or magnetically coupled to each other. All circuit components are implemented in the form of metallizations in multilayer construction. Capacitative couplings are implemented by coupling capacitors. The strip line resonators are shortened by shunt arms to ground having grounding capacitors arranged therein.

    Abstract translation: 陶瓷多层结构包括设计成彼此电容或磁耦合的平行条线的三个谐振器。 所有电路元件以多层结构中的金属化形式实现。 电容耦合由耦合电容实现。 带状线谐振器由分流臂缩短到地面,其中布置有接地电容器。

Patent Agency Ranking