Abstract:
Methods and apparatuses for controlling a trajectory of a borehole being drilled into the earth are provided. The apparatus includes a drilling system including a drill tubular, a disintegrating device, and a steering system coupled to the drill tubular configured to steer the drilling system, the drilling system configured to drill the borehole by receiving control outputs from at least one control unit for controlling parameters of the drilling system, the at least one control unit configured to provide the control outputs to the steering system, the at least one control unit being configured to provide a depth-based control output.
Abstract:
Methods and apparatuses for controlling a trajectory of a borehole being drilled into the earth are provided. The apparatus includes a drilling system including a drill tubular, a disintegrating device, and a steering system coupled to the drill tubular configured to steer the drilling system, the drilling system configured to drill the borehole by receiving control outputs from at least one control unit for controlling parameters of the drilling system, the at least one control unit configured to provide the control outputs to the steering system, the at least one control unit being configured to provide depth-based control.
Abstract:
A control valve assembly includes a body including a mud flow passage having a mud flow inlet and a mud flow outlet, a magnetic plunger slidingly mounted within the body, and a solenoid mounted at the body about the magnetic plunger. The solenoid is selectively activated to shift the magnetic plunger between a first position covering the mud flow outlet and a second position exposing the mud flow outlet allowing a pulse of mud to flow through the mud flow passage.
Abstract:
A semiconductor device includes a semiconductor body having a first surface and a second surface, at least one electrode arranged in at least one trench extending from the first surface into the semiconductor body, and a semiconductor via extending in a vertical direction of the semiconductor body within the semiconductor body to the second surface. The semiconductor via is electrically insulated from the semiconductor body by a via insulation layer. The at least one electrode extends in a first lateral direction of the semiconductor body through the via insulation layer and is electrically connected to the semiconductor via.
Abstract:
A drilling assembly for use in drilling a wellbore is disclosed that in one embodiment includes a steering unit that includes a tilt device in a disintegrating device and an electro-mechanical actuation device having a force application member that applies axial force on the disintegrating device to tilt the disintegrating device about the tilt device along a selected direction. In one embodiment, the actuation device translates a rotary motion into an axial movement of the force application member to apply the axial force on the disintegrating device to tilt the disintegrating device about the tilt device.
Abstract:
Methods and apparatuses for controlling a trajectory of a borehole being drilled into the earth are provided. The apparatus includes a drilling system including a drill tubular, a disintegrating device, and a steering system coupled to the drill tubular configured to steer the drilling system, the drilling system configured to drill the borehole by receiving control outputs from at least one control unit for controlling parameters of the drilling system, the at least one control unit configured to provide the control outputs to the steering system, the at least one control unit being configured to provide depth-based control.
Abstract:
A shaving head for an electric dry shaver includes a base element for carrying at least three cutter units. Each unit provides an outer cutter and an inner cutter arranged to be moved in sliding contact relative to each other. At least one cutter unit includes a foil-type outer cutter. The shaving head further includes a first trimmer-type cutting unit that has a plurality of slots defined by a plurality of adjacent bar elements featuring cutting edges. The shaving head also includes a second trimmer-type cutting unit having an outer cutter that includes a plurality of teeth featuring cutting edges and spaced apart from each other so as to define a plurality of slits.
Abstract:
An apparatus for providing communications between a first device disposed at a tubular and a second device, the tubular having tubular sections and being configured to be disposed in a borehole penetrating the earth, the apparatus including: a first optical coupler configured to be coupled to a first tubular section and configured to be in optical communication with the first device using a first optical transmission medium disposed at the first tubular section; and a second optical coupler configured to be coupled to a second tubular section and configured to be in optical communication with the second device using a second optical transmission medium disposed at the second tubular section; wherein the first optical coupler is configured to be perimetrically disposed about the second optical coupler to be in communication with the second optical coupler to provide the communications between the first device and the second device.
Abstract:
An apparatus for measuring strain on a downhole component includes: at least one strain sensitive device disposed proximate to a surface of a component of a drilling assembly or disposed within a material forming the component; and a processor in operable communication with the at least one strain sensitive device, the processor configured to detect changes in the at least one strain sensitive device and detect at least one of erosion, crack formation and crack propagation in the component surface. An apparatus for measuring strain on a downhole component includes: at least one strain gauge deposited on a surface of a drive shaft or disposed within a material forming the drive shaft; and a processor in operable communication with the at least one strain gauge, the processor configured to detect changes in the at least one strain gauge and detect conditions affecting operation of the drive shaft.
Abstract:
According to an embodiment, a method of forming a semiconductor device includes: providing a wafer having a semiconductor substrate with a first side a second side opposite the first side, and a dielectric region arranged on the first side; mounting the wafer with the first side on a carrier system; etching a deep vertical trench from the second side through the semiconductor substrate to the dielectric region, thereby insulating a mesa region from the remaining semiconductor substrate; and filling the deep vertical trench with a dielectric material.