Forming a conductor circuit on a substrate
    2.
    发明申请
    Forming a conductor circuit on a substrate 审中-公开
    在基板上形成导体电路

    公开(公告)号:US20050260350A1

    公开(公告)日:2005-11-24

    申请号:US10466070

    申请日:2002-01-07

    摘要: Disclosed is a process for forming a conductor pattern on a face of a substrate, which is typically sorbing and porous, such as paper or cloth. The method comprises forming on the surface an exposed pattern of colloid particles, corresponding to the conductor pattern to be formed. The colloid particles suitable for use according to the invention are those that are capable of catalyzing electroless deposition of copper, silver, gold, and the like. After the exposed pattern of colloid particles is formed, precipitation of a metal substance on said face is caused, to form said conductor pattern.

    摘要翻译: 公开了一种在基材的表面上形成导体图案的方法,其通常是吸附和多孔的,例如纸或布。 该方法包括在表面上形成对应于要形成的导体图案的暴露的胶体颗粒图案。 适合根据本发明使用的胶体颗粒是能够催化铜,银,金等的无电沉积的胶体颗粒。 在形成胶体颗粒的暴露图案之后,引起金属物质在所述面上的沉淀,形成所述导体图案。