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10 条记录 (耗时 0.016 秒)

    Composition having sealing and sound dampening properties and methods related thereto
    1.
    发明授权
    Composition having sealing and sound dampening properties and methods related thereto 有权
    具有密封和声音衰减特性的组合物及其相关方法

    公开(公告)号：US06841251B2

    公开(公告)日：2005-01-11

    申请号：US10772912

    申请日：2004-02-05

    申请人： Umesh C. Desai ,  Marvis E. Hartman ,  Anthony C. Palermo

    发明人： Umesh C. Desai ,  Marvis E. Hartman ,  Anthony C. Palermo

    IPC分类号： C08L63/00 ,  B32B26/38 ,  B32B26/36

    CPC分类号： C08L63/00 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31786 ,  C08L2666/18

    摘要： A composition having sealing and sound dampening properties is disclosed which comprises one or more polyepoxides comprising at least two epoxide groups per molecule; a thermoplastic polyester polymer; a curing agent adapted to react with the polyepoxides; inorganic particles having an oil absorption value of less than 70; and inorganic microparticles different from the previously mentioned inorganic particles, the inorganic microparticles having an average particle size prior to incorporation into the composition ranging from 0.5 to 200 microns. Multilayer composites, coated substrates, and methods for forming sound dampening coatings on a metallic substrate are also provided.

    摘要翻译： 公开了一种具有密封和防声性能的组合物，其包含每分子包含至少两个环氧基团的一种或多种聚环氧化物; 热塑性聚酯聚合物; 适于与多环氧化物反应的固化剂; 吸油值小于70的无机颗粒; 和与前述无机颗粒不同的无机微粒，所述无机微粒在掺入组合物中的平均粒径为0.5-200微米。 还提供了多层复合材料，涂覆基材以及在金属基材上形成阻尼涂层的方法。

    Chip resistant coatings and methods of application
    2.
    发明授权
    Chip resistant coatings and methods of application 失效
    耐芯片涂层和应用方法

    公开(公告)号：US5066733A

    公开(公告)日：1991-11-19

    申请号：US556681

    申请日：1990-07-23

    申请人： Jonathan T. Martz ,  Thomas W. Kelly ,  Rostyslaw Dowbenko ,  James A. Meier ,  Anthony C. Palermo

    发明人： Jonathan T. Martz ,  Thomas W. Kelly ,  Rostyslaw Dowbenko ,  James A. Meier ,  Anthony C. Palermo

    IPC分类号： B05D1/36 ,  C08F299/06 ,  C08G18/67

    CPC分类号： C08F299/065 ,  B05D7/542 ,  C08G18/671

    摘要： Disclosed is a liquid coating composition, useful for making a chip resistant coating, comprising a binder of: a first and a second urethane resin each containing terminal, reactive ethylenically unsaturated groups. Each urethane resin is prepared by reacting components comprising (A) an isocyanate-terminated prepolymer which is the product of reacting an organic polyisocyanate with an organic polyol with (B) an isocyanate reactive group-containing unsaturated monomer selected from hydroxyalkyl acrylates, hydroxyalkyl methacrylates and hydroxyalkyl acrylamides. The organic polyol for the first urethane resin has a hydroxyl functionality of 3 or more; the organic polyol for the second urethane resin has a hydroxyl functionality of less than three; and the average functionality of the polyols utilized for the first and second urethane resins is less than three.Also disclosed is a method of making a cured chip resistant, coating.

    摘要翻译： 公开了一种可用于制造耐芯片涂层的液体涂料组合物，其包含粘合剂，第一和第二聚氨酯树脂各自含有末端，反应性烯属不饱和基团。 每个聚氨酯树脂通过使包含（A）异氰酸酯封端的预聚物（其是有机多异氰酸酯与有机多元醇反应的产物）与（B）含异氰酸酯反应性基团的不饱和单体的选自丙烯酸羟烷基酯，甲基丙烯酸羟烷基酯和 羟烷基丙烯酰胺。 第一聚氨酯树脂的有机多元醇的羟基官能度为3以上; 第二聚氨酯树脂的有机多元醇的羟基官能度小于3; 并且用于第一和第二聚氨酯树脂的多元醇的平均官能度小于3。 还公开了一种制造耐固化芯片的涂层的方法。

    Composition having sealing and sound dampening properties and methods related thereto
    6.
    发明授权
    Composition having sealing and sound dampening properties and methods related thereto 有权
    具有密封和声音衰减特性的组合物及其相关方法

    公开(公告)号：US06749939B2

    公开(公告)日：2004-06-15

    申请号：US10078598

    申请日：2002-02-19

    申请人： Umesh C. Desai ,  Marvis E. Hartman ,  Anthony C. Palermo

    发明人： Umesh C. Desai ,  Marvis E. Hartman ,  Anthony C. Palermo

    IPC分类号： B32B2738

    CPC分类号： C08L63/00 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/18

    摘要： A composition having sealing and sound dampening properties is disclosed which comprises one or more polyepoxides comprising at least two epoxide groups per molecule; a thermoplastic polyester polymer; a curing agent adapted to react with the polyepoxides; inorganic particles having an oil absorption value of less than 70; and inorganic microparticles different from the previously mentioned inorganic particles, the inorganic microparticles having an average particle size prior to incorporation into the composition ranging from 0.5 to 200 microns. Multilayer composites, coated substrates, and methods for forming sound dampening coatings on a metallic substrate are also provided.

    摘要翻译： 公开了一种具有密封和防声性能的组合物，其包含每分子包含至少两个环氧基团的一种或多种聚环氧化物; 热塑性聚酯聚合物; 适于与多环氧化物反应的固化剂; 吸油值小于70的无机颗粒; 和与上述无机颗粒不同的无机微粒，无机微粒在掺入组合物中的平均粒径为0.5-200微米。 还提供了多层复合材料，涂覆基材以及在金属基材上形成阻尼涂层的方法。

    Compositions thickened through urethane reaction
    9.
    发明授权
    Compositions thickened through urethane reaction 失效
    组合物通过氨基甲酸酯反应增稠

    公开(公告)号：US4683266A

    公开(公告)日：1987-07-28

    申请号：US796031

    申请日：1985-11-07

    申请人： Anthony C. Palermo ,  Roger M. Christenson ,  Glenn L. Mazza

    发明人： Anthony C. Palermo ,  Roger M. Christenson ,  Glenn L. Mazza

    IPC分类号： C08F279/02 ,  C08G18/63 ,  C08G18/69 ,  C08F8/00 ,  C08L75/00

    CPC分类号： C08G18/696 ,  C08F279/02 ,  C08G18/635 ,  C08G18/69 ,  C08G18/692

    摘要： A thickened composition which is cured by free-radical initiated polymerization is composed of a compound containing at least two ethylenically unsaturated double bonds per molecule; an active hydrogen-containing homopolymer or copolymer of a diene having a number average molecular weight of from 500 to 15,000; the active hydrogens being derived from hydroxyl, amino, or mercapto groups; and an organic polyisocyanate present in an amount sufficient to thicken said composition without gelation.

    摘要翻译： 通过自由基引发聚合固化的增稠组合物由每分子含有至少两个烯属不饱和双键的化合物组成; 数均分子量为500〜15000的二烯的活性含氢均聚物或共聚物; 活性氢源自羟基，氨基或巯基; 和有机多异氰酸酯的存在量足以增稠所述组合物而没有凝胶化。

    Composition of epoxy polymer, thermoplastic polymer, rubber particles and curing agent
    10.
    发明授权
    Composition of epoxy polymer, thermoplastic polymer, rubber particles and curing agent 失效
    环氧聚合物，热塑性聚合物，橡胶颗粒和固化剂的组成

    公开(公告)号：US06521706B1

    公开(公告)日：2003-02-18

    申请号：US09226903

    申请日：1999-01-08

    申请人： Umesh C. Desai ,  Anthony C. Palermo

    发明人： Umesh C. Desai ,  Anthony C. Palermo

    IPC分类号： C08L6300

    CPC分类号： C09D119/003 ,  C09D163/00 ,  C08L2666/02 ,  C08L2666/08

    摘要： The present invention provides curable coating compositions including: (a) about 55 to about 99 weight percent of an epoxy-functional polymer containing at least two epoxide groups per molecule; (b) about 1 to about 45 weight percent of a thermoplastic polymer effective to reduce shrinkage of the curable composition upon curing and which is substantially insoluble in the epoxy-functional polymer; (c) about 1 to about 70 weight percent of ground vulcanized rubber particles having an average particle size ranging from about 1 to about 300 microns; (d) a curing agent adapted to cure the epoxy-functional polymer; and, optionally, vinyl chloride polymer.

    摘要翻译： 本发明提供可固化涂料组合物，其包括：（a）约55至约99重量％的每分子含有至少两个环氧基团的环氧官能聚合物; （b）约1至约45重量％的热塑性聚合物，其有效减少固化后可固化组合物的收缩，并且基本上不溶于环氧官能聚合物; （c）约1至约70重量％的平均粒度为约1至约300微米的硫化橡胶颗粒; （d）适于固化环氧官能聚合物的固化剂; 和任选的氯乙烯聚合物。