公开(公告)号：US08537553B2

公开(公告)日：2013-09-17

申请号：US13071015

申请日：2011-03-24

申请人： Anwar Mohammed ,  Renzhe Zhao

发明人： Anwar Mohammed ,  Renzhe Zhao

IPC分类号： H05K7/20

CPC分类号： H01L23/373 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

摘要： In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.

摘要翻译： 根据本发明的实施例，一种器件包括具有导热芯层的电路板和设置在电路板上的芯片。 该装置还包括设置在芯片上的散热器。 沿着第一方向的散热器的热导率大于沿着第二方向的热导率。 第一方向垂直于第二方向。 散热器热耦合到导热芯层。

公开(公告)号：US20070029664A1

公开(公告)日：2007-02-08

申请号：US11198679

申请日：2005-08-05

申请人： Anwar Mohammed ,  Joseph Hornung

发明人： Anwar Mohammed ,  Joseph Hornung

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/047 ,  H01L21/50 ,  H01L23/10 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Flexible, adhesive materials are used to secure integrated circuit package components together. The die is secured to the heat sink, the ringframe to the heat sink and the leadframe to the ringframe, using epoxy materials that flex over the operational temperature range of the circuit package. The flexibility of the adhesives accommodates large differences in expansion and contraction of CTE-mismatched materials. The heat sink and ringframe materials are neither restricted to CTE-compatible materials nor to materials that are compatible with high-temperature attachment processes. Adhesive mounting of the die avoids the use of lead-based solders used in typical assembly processes.

摘要翻译： 使用灵活的粘合材料将集成电路封装组件固定在一起。 使用在电路封装的工作温度范围内弯曲的环氧树脂材料将模具固定到散热器，环形框架到散热器和引导框架到环形框架。 粘合剂的柔韧性适应于CTE不匹配材料的膨胀和收缩的较大差异。 散热器和环形框架材料既不限于与CTE兼容的材料，也不限于与高温附着工艺兼容的材料。 模具的粘合安装避免了在典型组装过程中使用的铅基焊料。

公开(公告)号：US06888167B2

公开(公告)日：2005-05-03

申请号：US10185252

申请日：2002-06-27

申请人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

发明人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

IPC分类号： H01L21/60 ,  H01L33/20 ,  H01L33/40 ,  H01L33/62 ,  H01L29/267

CPC分类号： H01L33/62 ,  H01L33/38 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.

摘要翻译： 通过在电极和底座中的至少一个上形成预定图案的导电芯片附着材料，并将其安装在基板上，并将底板上的电极和底板上的电极的底板配置在倒装芯片结构的底座上， 发光器件死到底座。 选择导电芯片附着材料的预定图案，以便当发光器件裸片安装到底座时，防止导电芯片附着材料接触具有相反导电类型的区域。 导电芯片附接材料的预定图案可以提供小于由电极区域限定的体积以及电极和底座之间的距离的管芯附着材料的体积。 还提供具有预定图案的导电芯片附着材料的发光器件裸片。 在碳化硅基板等基板上具有氮化镓系发光区域的发光元件也可以通过将氮化镓系发光区域的电极安装在利用B的基板的倒装芯片配置中 级环氧树脂。 还提供了具有B级可固化模具环氧树脂的发光器件模具。

公开(公告)号：US07259033B2

公开(公告)日：2007-08-21

申请号：US10920101

申请日：2004-08-17

申请人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

发明人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

IPC分类号： H01L21/00 ,  H01L21/50

CPC分类号： H01L33/62 ,  H01L33/38 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.

摘要翻译： 通过在电极和底座中的至少一个上形成预定图案的导电芯片附着材料，并将其安装在基板上，并将底板上的电极和底板上的电极的底板配置在倒装芯片结构的底座上， 发光器件死到底座。 选择导电芯片附着材料的预定图案，以便当发光器件裸片安装到底座时，防止导电芯片附着材料接触具有相反导电类型的区域。 导电芯片附接材料的预定图案可以提供小于由电极区域限定的体积以及电极和底座之间的距离的管芯附着材料的体积。 还提供具有预定图案的导电芯片附着材料的发光器件裸片。 在碳化硅基板等基板上具有氮化镓系发光区域的发光元件也可以通过将氮化镓系发光区域的电极安装在利用B的基板的倒装芯片配置中 级环氧树脂。 还提供了具有B级可固化模具环氧树脂的发光器件模具。

公开(公告)号：US06747298B2

公开(公告)日：2004-06-08

申请号：US10185350

申请日：2002-06-27

申请人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

发明人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

IPC分类号： H01L310328

CPC分类号： H01L33/40 ,  H01L24/32 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/00

摘要： Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.

摘要翻译： 提供具有不规则结构的倒装芯片安装的发光器件的接合。 具有成形基板的发光二极管通过向衬底施加力而以基板内的剪切力不超过衬底的故障阈值的方式与基座结合。 将发光二极管接合到基座可以通过向发光二极管的基板的表面施加力而提供，所述表面倾斜于发光二极管的运动方向，以将发光二极管热偶接合到基台。 还提供了用于将成形基板粘合到基座的套筒和用于将成形基板粘合到基座的系统。

公开(公告)号：US09269594B2

公开(公告)日：2016-02-23

申请号：US13343733

申请日：2012-01-05

申请人： Anwar Mohammed ,  Julius Chew ,  Donald Fowlkes

发明人： Anwar Mohammed ,  Julius Chew ,  Donald Fowlkes

IPC分类号： H01L21/48 ,  H01L21/50 ,  H01L23/14 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L21/50 ,  H01L23/142 ,  H01L23/3735 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/3511 ,  H01L2924/0105 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.

摘要翻译： 根据高功率封装的实施例，封装包括散热器，其包含足够的铜以具有至少350W / mK的导热系数，电连接到散热器上的环氧树脂和半导体芯片 使用熔点为280℃以上的导电材料在与引线框架相同的一侧上散热。

公开(公告)号：US20120206882A1

公开(公告)日：2012-08-16

申请号：US13071015

申请日：2011-03-24

申请人： Anwar Mohammed ,  Renzhe Zhao

发明人： Anwar Mohammed ,  Renzhe Zhao

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/373 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

摘要： In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.

摘要翻译： 根据本发明的实施例，一种器件包括具有导热芯层的电路板和设置在电路板上的芯片。 该装置还包括设置在芯片上的散热器。 沿着第一方向的散热器的热导率大于沿着第二方向的热导率。 第一方向垂直于第二方向。 散热器热耦合到导热芯层。

公开(公告)号：US07341175B2

公开(公告)日：2008-03-11

申请号：US10832971

申请日：2004-04-27

申请人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

发明人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

IPC分类号： B23K1/06

CPC分类号： H01L33/40 ,  H01L24/32 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/00

摘要： Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.

摘要翻译： 提供具有不规则结构的倒装芯片安装的发光器件的接合。 具有成形基板的发光二极管通过向衬底施加力而以基板内的剪切力不超过衬底的故障阈值的方式与基座结合。 将发光二极管接合到基座可以通过向发光二极管的基板的表面施加力而提供，所述表面倾斜于发光二极管的运动方向，以将发光二极管热偶接合到基台。 还提供了用于将成形基板粘合到基座的套筒和用于将成形基板粘合到基座的系统。

公开(公告)号：US07608860B2

公开(公告)日：2009-10-27

申请号：US11772419

申请日：2007-07-02

申请人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

发明人： David B. Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter S. Andrews ,  Gerald H. Negley

IPC分类号： H01L29/267

CPC分类号： H01L33/62 ,  H01L33/38 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.

摘要翻译： 通过在电极和底座中的至少一个上形成预定图案的导电芯片附着材料，并将其安装在基板上，并将底板上的电极和底板上的电极的底板配置在倒装芯片结构的底座上， 发光器件死到底座。 选择导电芯片附着材料的预定图案，以便当发光器件裸片安装到底座时，防止导电芯片附着材料接触具有相反导电类型的区域。 导电芯片附接材料的预定图案可以提供小于由电极区域限定的体积以及电极和底座之间的距离的管芯附着材料的体积。 还提供具有预定图案的导电芯片附着材料的发光器件裸片。 在碳化硅基板等基板上具有氮化镓系发光区域的发光元件也可以通过将氮化镓系发光区域的电极安装在利用B的基板的倒装芯片配置中 级环氧树脂。 还提供了具有B级可固化模具环氧树脂的发光器件模具。

公开(公告)号：US20070241360A1

公开(公告)日：2007-10-18

申请号：US11772419

申请日：2007-07-02

申请人： David Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter Andrews ,  Gerald Negley

发明人： David Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter Andrews ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/38 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.

摘要翻译： 通过在电极和底座中的至少一个上形成预定图案的导电芯片附着材料，并将其安装在基板上，并将底板上的电极和底板上的电极的底板配置在倒装芯片结构的底座上， 发光器件死到底座。 选择导电芯片附着材料的预定图案，以便当发光器件裸片安装到底座时，防止导电芯片附着材料接触具有相反导电类型的区域。 导电芯片附接材料的预定图案可以提供小于由电极区域限定的体积以及电极和底座之间的距离的管芯附着材料的体积。 还提供具有预定图案的导电芯片附着材料的发光器件裸片。 在碳化硅基板等基板上具有氮化镓系发光区域的发光元件也可以通过将氮化镓系发光区域的电极安装在利用B的基板的倒装芯片配置中 级环氧树脂。 还提供了具有B级可固化模具环氧树脂的发光器件模具。