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公开(公告)号：US07324715B2
公开(公告)日：2008-01-29
申请号：US10317750
申请日：2002-12-12
申请人： Tecktiong Tan , Binghua Pan , Jeffrey H. Burns , Arun K. Chaudhuri , John R. Troxell , Su Liang Chan
发明人： Tecktiong Tan , Binghua Pan , Jeffrey H. Burns , Arun K. Chaudhuri , John R. Troxell , Su Liang Chan
IPC分类号： G02B6/12
CPC分类号： G02B6/4232
摘要： An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
摘要翻译： 光学信息处理电路组件包括光学透射衬底和固定到衬底的弹性可压缩电路构件，并且限定穿过其中的开口，其中围绕开口设置有多个引线。 集成成像电路限定相应数量的焊盘，其中焊盘与引线对准并电接触引线。 光学透射介质可以设置在衬底之间并与衬底和集成成像电路接触，以允许从衬底到成像电路的光透射。 在一个实施例中，弹性凸块设置在集成成像电路和弹性可压缩电路部件之间以形成它们之间的电连接。 或者，焊料凸块可以代替弹性凸块。 附加的电路部件可以类似地安装到弹性可压缩电路部件上以完成组装。
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2.发明授权Enhancement of underfill physical properties by the addition of thermotropic cellulose 有权通过添加热致纤维素增强底层填充物理性能公开(公告)号：US07119449B2
公开(公告)日：2006-10-10
申请号：US10730608
申请日：2003-12-08
IPC分类号： H01L23/29
CPC分类号： C09K19/544 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on a substrate circuit board, and a composite material underfilling, overmolding or encapsulating the electronic device, wherein the composite material includes a thermoset matrix phase and a discontinuous liquid crystal polymer phase dispersed throughout the thermoset matrix phase.
摘要翻译： 具有改善的耐冲击性和改善的耐热循环性的电气部件，而不牺牲高温性能，并且不需要非常规和昂贵的制造技术包括安装在基板电路板上的电气装置，以及填充，包覆成型或封装 电子器件，其中复合材料包括分散在整个热固性基体相中的热固性基质相和不连续的液晶聚合物相。
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公开(公告)号：US06943058B2
公开(公告)日：2005-09-13
申请号：US10391231
申请日：2003-03-18
CPC分类号： H01L24/29 , C08K5/54 , H01L21/563 , H01L23/293 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/131 , H01L2224/16225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A no-flow underfill material and process suitable for underfilling a bumped circuit component. The underfill material initially comprises a dielectric polymer material in which is dispersed a precursor capable of reacting to form an inorganic filler. The underfill process generally entails dispensing the underfill material over terminals on a substrate, and then placing the component on the substrate so that the underfill material is penetrated by the bumps on the component and the bumps contact the terminals on the substrate. The bumps are then reflowed to form solid electrical interconnects that are encapsulated by the resulting underfill layer. The precursor may be reacted to form the inorganic filler either during or after reflow.
摘要翻译： 无流动的底部填充材料和适用于底部填充凸起电路部件的工艺。 底部填充材料最初包括介电聚合物材料，其中分散有能够反应形成无机填料的前体。 底部填充过程通常需要在基底上的端子上分配底部填充材料，然后将部件放置在基板上，使得底部填充材料被部件上的凸块穿透，并且凸块接触基板上的端子。 然后将凸块回流以形成由所得底部填充层封装的固体电互连。 在回流期间或之后，可以将前体反应以形成无机填料。
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4.发明授权公开(公告)号：US06802446B2
公开(公告)日：2004-10-12
申请号：US10060812
申请日：2002-02-01
IPC分类号： B23K3100
CPC分类号： H05K3/321 , C08L63/00 , C09J9/02 , C09J163/00 , H01B1/22 , H05K3/3489 , H05K2201/0218 , H05K2203/0425
摘要： A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.
摘要翻译： 导电粘合剂材料，其特征在于分散在材料的聚合物基质中的导电颗粒之间的冶金结合。 聚合物基质在加热时具有助熔能力，以减少颗粒表面上的金属氧化物。 至少颗粒的外表面由可熔材料形成，使得充分加热导电粘合剂材料将减少颗粒上的金属氧化物，并且至少部分地熔化可熔金属，使得颗粒彼此冶金结合， 与由粘合剂材料接触的金属表面。
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5.发明授权公开(公告)号：US06660560B2
公开(公告)日：2003-12-09
申请号：US09949556
申请日：2001-09-10
IPC分类号： H01L2144
CPC分类号： H01L21/563 , B32B3/10 , H01L24/29 , H01L2224/13111 , H01L2224/2908 , H01L2224/29083 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/325 , H01L2224/73203 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , Y10T428/24322 , Y10T428/24331 , H01L2924/01014 , H01L2924/01007 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/0665 , H01L2924/00012
摘要： A no-flow underfill material and process for underfilling a flip chip component. The underfill material comprises at least three polymer layers. A first of the layers overlies terminals of a substrate to which the component is to be mounted. The first and second layers are substantially free of fillers, while the third layer contains a filler material to reduce its CTE. The underfill process entails placing the component so that solder terminals thereof penetrate the first, second and third layers and contact the terminals on the substrate. Because only the third layer contains filler material, penetration of the underfill material by the solder terminals is substantially unimpeded. The solder terminals are then reflowed, during which the filler material migrates into the unfilled first layer and the first, second and third layers consolidate and cure to form a single underfill layer.
摘要翻译： 一种无流动的底部填充材料和用于底部填充倒装芯片部件的工艺。 底部填充材料包括至少三个聚合物层。 层中的第一层覆盖要安装部件的基板的端子。 第一层和第二层基本上不含填料，而第三层含有填料以减少其CTE。 底部填充过程需要放置组件，使得其焊接端子穿透第一层，第二层和第三层并与衬底上的端子接触。 因为只有第三层含有填充材料，所以底部填充材料被焊接端子的穿透基本上是不受阻碍的。 然后焊接端子回流，在此期间填料材料迁移到未填充的第一层中，并且第一，第二和第三层固结并固化以形成单个底部填充层。
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6.发明授权公开(公告)号：US07754824B2
公开(公告)日：2010-07-13
申请号：US12267157
申请日：2008-11-07
IPC分类号： C08L63/00
CPC分类号： C08L101/005 , C08L63/00 , C08L67/04 , C08L2666/14
摘要： The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.
摘要翻译： 本发明涉及由树枝状或超支化聚合物和环脂肪族环氧树脂形成的刚性和透明的热固性组合物。 组合物可以用于涂层，例如电子器件包装，粘合剂，线涂和表面处理。
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公开(公告)号：US06916684B2
公开(公告)日：2005-07-12
申请号：US10391101
申请日：2003-03-18
CPC分类号： H01L21/563 , H01L24/27 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2924/00014 , H01L2924/12042 , Y10T428/14 , Y10T428/1476 , H01L2924/00 , H01L2224/0401
摘要： A process for underfilling a bumped die surface using a lamination step and compound film such that solder bumps on the die are exposed during lamination. The compound film comprises a first layer containing an underfill material and a second layer on the first layer. The underfill material and the second layer comprise polymer materials that differ from each other. The compound film is laminated to the die, preferably at the wafer level, so that the underfill material is forced between the solder bumps and fills spaces between the bumps but does not cover the bumps. In contrast, the second layer covers the solder bumps, but is then selectively removed to re-expose the solder bumps and the underfill material therebetween.
摘要翻译： 使用层压步骤和复合膜对冲击模具表面进行底部填充的方法，使得在层压期间裸片上的焊料凸块暴露。 复合膜包括含有底部填充材料的第一层和第一层上的第二层。 底部填充材料和第二层包括彼此不同的聚合物材料。 复合膜优选地在晶片级层压到管芯上，使得底部填充材料被迫在焊料凸块之间并填充凸块之间的空间，但不覆盖凸块。 相比之下，第二层覆盖焊料凸块，然后被选择性地去除以重新暴露焊料凸块和底部填充材料之间。
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公开(公告)号：US06822018B2
公开(公告)日：2004-11-23
申请号：US10075978
申请日：2002-02-15
申请人： Arun K. Chaudhuri , Bruce A. Myers
发明人： Arun K. Chaudhuri , Bruce A. Myers
IPC分类号： C08K904
CPC分类号： C08K3/08
摘要： An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.
摘要翻译： 一种具有改进的导热性的电绝缘聚合物基材料，以便适合用作用于从电子设备安装和传导热量的粘合剂。 基于聚合物的材料包括分散在基质材料中的金属颗粒。 金属颗粒被介电涂层包封，使得它们彼此电绝缘。 为了进一步提高聚合物基材料的导热性，基于聚合物的材料还可以包含分散在基体材料和/或电介质涂层中的介电粒子。 该材料也适用于各种电子应用的灌封化合物或封装材料。
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公开(公告)号：US4741925A
公开(公告)日：1988-05-03
申请号：US95985
申请日：1987-09-14
CPC分类号： C23C16/345 , C23C16/46
摘要： A silicon nitride coating is deposited on the inside surface of a crucible by pyrolysis. Reactive gases are fed through a tube into the crucible. The crucible is rotated during deposition and the crucible walls are maintained at a temperature of at least about 1250.degree. C.
摘要翻译： 氮化硅涂层通过热解沉积在坩埚的内表面上。 反应性气体通过管进料到坩埚中。 坩埚在沉积期间旋转，坩埚壁保持在至少约1250℃的温度。
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公开(公告)号：US4937414A
公开(公告)日：1990-06-26
申请号：US242996
申请日：1988-09-12
IPC分类号： B23H7/10
CPC分类号： B23H7/10
摘要： A wire guide for EDM machining apparatus comprises a vacuum hot pressed titanium diboride block having a groove on a curved side of the block for positioning EDM wire. The block has a mounting hole therethrough lined with an electrically insulating sleeve.
摘要翻译： 电火花加工加工设备的导线器包括：真空热压二硼化钛块，其具有用于定位EDM线的块的弯曲侧上的凹槽。 该块具有穿过其中的电绝缘套筒的安装孔。
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