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    Integrated optical imaging systems including an interior space between opposing substrates and associated methods
    5.
    发明授权
    Integrated optical imaging systems including an interior space between opposing substrates and associated methods 有权
    集成光学成像系统，包括相对基板之间的内部空间和相关方法

    公开(公告)号：US08153957B2

    公开(公告)日：2012-04-10

    申请号：US11928060

    申请日：2007-10-30

    申请人： Michael R. Feldman ,  Brian Harden ,  Alan D. Kathman ,  W. Hudson Welch

    发明人： Michael R. Feldman ,  Brian Harden ,  Alan D. Kathman ,  W. Hudson Welch

    IPC分类号： H01J40/14

    CPC分类号： H01L27/14632 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L31/02327 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.

    摘要翻译： 集成光学成像系统包括具有第一和第二相对表面的第一衬底，具有第三和第四相对表面的第二衬底，在第二衬底的第三表面的基本上平面部分与第二表面的基本上平面部分之间的间隔物 所述第一基板中的至少两个，所述隔离物，所述第一基板和所述第二基板中的至少两个密封所述第二基板的第三表面和所述第一基板的第二表面之间的内部空间，以及具有n个表面的光学成像系统， n大于或等于2，光学成像系统的n个表面中的至少两个表面在第一，第二，第三和第四表面中的相应的一个上。

    INTEGRATED OPTICAL SYSTEMS AND ASSOCIATED METHODS
    6.
    发明申请
    INTEGRATED OPTICAL SYSTEMS AND ASSOCIATED METHODS 有权
    综合光系统及相关方法

    公开(公告)号：US20080111058A1

    公开(公告)日：2008-05-15

    申请号：US11928060

    申请日：2007-10-30

    申请人： MICHAEL R. FELDMAN ,  Brian Harden ,  Alan D. Kathman ,  W. Hudson Welch

    发明人： MICHAEL R. FELDMAN ,  Brian Harden ,  Alan D. Kathman ,  W. Hudson Welch

    IPC分类号： H01L27/144 ,  H01L21/98

    CPC分类号： H01L27/14632 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L31/02327 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.

    摘要翻译： 集成光学成像系统包括具有第一和第二相对表面的第一衬底，具有第三和第四相对表面的第二衬底，在第二衬底的第三表面的基本上平面部分与第二表面的基本上平面部分之间的间隔物 所述第一基板中的至少两个，所述隔离物，所述第一基板和所述第二基板中的至少两个密封所述第二基板的第三表面和所述第一基板的第二表面之间的内部空间，以及具有n个表面的光学成像系统， n大于或等于2，光学成像系统的n个表面中的至少两个表面在第一，第二，第三和第四表面中的相应的一个上。

    Wafer level integration of multiple optical elements
    10.
    发明申请
    Wafer level integration of multiple optical elements 审中-公开
    晶圆级集成多个光学元件

    公开(公告)号：US20070110361A1

    公开(公告)日：2007-05-17

    申请号：US11647397

    申请日：2006-12-29

    申请人： Brian Harden ,  Alan Kathman ,  Michael Feldman

    发明人： Brian Harden ,  Alan Kathman ,  Michael Feldman

    IPC分类号： G02B6/12 ,  G02B6/30 ,  B29D31/00 ,  B29D11/00

    CPC分类号： B29D11/00278 ,  G02B6/4214 ,  Y10T156/1052

    摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

    摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元本身。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。