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1.发明申请Curable encapsulant composition, device including same, and associated method 失效可固化密封剂组合物，包括其的装置和相关方法公开(公告)号：US20060135705A1
公开(公告)日：2006-06-22
申请号：US11167843
申请日：2005-06-24
申请人： Michael Vallance , John Campbell , Kenneth Zarnoch , Prameela Susarla , Bryan Duffey , Gary Yeager , Michael O'Brien
发明人： Michael Vallance , John Campbell , Kenneth Zarnoch , Prameela Susarla , Bryan Duffey , Gary Yeager , Michael O'Brien
CPC分类号： C08F290/06 , C08F283/08 , C08F283/085 , C08F290/062 , C08G65/48 , C08G65/485 , C08K9/06 , C08L33/08 , C08L71/126 , C09D163/00 , H01L23/293 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , Y10T428/31504 , C08L2666/04 , H01L2924/00014
摘要： An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.
摘要翻译： 可以提供用于封装电子部件的密封剂和制造和/或使用密封剂的方法。 可以提供包括密封剂的电子设备。 可固化的密封剂组合物可以包括官能化聚合物和至少一种反应性单体组合物的混合物。 反应性单体组合物可以包括反应性单体组分，其可以是低温固体，并且可以反应性单体组合物中的量存在，基于反应性单体组合物的总重量大于约20重量％。 该混合物在约低温下可以是固体或无粘性的，或固体和无粘性的。
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公开(公告)号：US20060135704A1
公开(公告)日：2006-06-22
申请号：US11022904
申请日：2004-12-22
申请人： Michael Vallance , John Campbell , Kenneth Zarnoch , Prameela Susarla , Bryan Duffey , Gary Yeager , Michael O'Brien
发明人： Michael Vallance , John Campbell , Kenneth Zarnoch , Prameela Susarla , Bryan Duffey , Gary Yeager , Michael O'Brien
IPC分类号： C08F283/08 , C08F118/02
CPC分类号： C08F290/062 , C08F283/08 , C08F283/085 , C08F289/00 , C08F290/06 , C08F290/061 , C08F290/14 , C08F290/141 , C08F290/142 , C08L51/08 , C08L2666/02
摘要： A tack-free composition comprising a functionalized polymer having a having a glass transition temperature greater than about 24° C., a reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C., a reinforcing filler, and an initiator (curing agent) is provided. The tack-free composition is useful as a molding composition for encapsulation of electronic devices and electronic device components.
摘要翻译： 一种无粘性组合物，其包含玻璃化转变温度大于约24℃的官能化聚合物，反应性单体，所述反应性单体的熔点或软化点大于约24℃，增强填料， 并提供引发剂（固化剂）。 无粘性组合物可用作电子器件和电子器件部件的封装用成型组合物。
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公开(公告)号：US20060167142A9
公开(公告)日：2006-07-27
申请号：US10947265
申请日：2004-09-23
申请人： John Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager , Kenneth Zarnoch
发明人： John Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager , Kenneth Zarnoch
IPC分类号： C08K5/49
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485 , C08K5/5313 , C08L51/08 , C08L2201/02 , C08L71/126
摘要： A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
摘要翻译： 可固化组合物包括官能化聚（亚芳基醚）树脂，丙烯酰基单体和磷阻燃剂。 该组合物显示出韧性，阻燃性，耐热性和耐湿性等性能的改善的平衡。 例如，作为半导体产品的密封剂是有用的。
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公开(公告)号：US20050075427A1
公开(公告)日：2005-04-07
申请号：US10947265
申请日：2004-09-23
申请人： John Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager , Kenneth Zarnoch
发明人： John Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager , Kenneth Zarnoch
IPC分类号： C08F283/08 , C08F290/06 , C08G65/48 , C08K5/5313 , C08L51/08 , C08K5/49
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485 , C08K5/5313 , C08L51/08 , C08L2201/02 , C08L71/126
摘要： A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
摘要翻译： 可固化组合物包括官能化聚（亚芳基醚）树脂，丙烯酰基单体和磷阻燃剂。 该组合物显示出韧性，阻燃性，耐热性和耐湿性等性能的改善的平衡。 例如，作为半导体产品的密封剂是有用的。
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公开(公告)号：US20050075426A1
公开(公告)日：2005-04-07
申请号：US10678471
申请日：2003-10-03
申请人： John Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager , Kenneth Zarnoch
发明人： John Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager , Kenneth Zarnoch
IPC分类号： C08F283/08 , C08F290/06 , C08G65/48 , C08K5/5313 , C08L51/08 , C08K5/49
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485 , C08K5/5313 , C08L51/08 , C08L2201/02 , C08L71/126
摘要： A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
摘要翻译： 可固化组合物包括官能化聚（亚芳基醚）树脂，丙烯酰基单体和金属磷阻燃剂。 该组合物显示出韧性，阻燃性，耐热性和耐湿性等性能的改善的平衡。 例如，作为半导体产品的密封剂是有用的。
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公开(公告)号：US20080051522A1
公开(公告)日：2008-02-28
申请号：US11877817
申请日：2007-10-24
申请人： Joop Birsak , Herbert Chao , Bryan Duffey , Amy Freshour , Hugo Ingelbrecht , Qiwei Lu , Michael O'Brien , Prameela Susarla , Michael Vallance , Kenneth Zarnoch
发明人： Joop Birsak , Herbert Chao , Bryan Duffey , Amy Freshour , Hugo Ingelbrecht , Qiwei Lu , Michael O'Brien , Prameela Susarla , Michael Vallance , Kenneth Zarnoch
IPC分类号： C08F283/00
CPC分类号： C08G65/485 , C08F220/06 , C08F222/1006 , C08F283/06 , C08F283/08 , C08F290/061 , C08F290/062
摘要： A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要翻译： 可固化组合物包括烯属不饱和单体和具有两个可聚合基团的聚（亚芳基醚），特性粘度为约0.05至约0.30分升/克。 该组合物在模塑期间显示出高流动性和高后固化刚度和冲击强度的改进的组合。 该组合物特别适用于制造塑料封装的电子器件。
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公开(公告)号：US20060041086A1
公开(公告)日：2006-02-23
申请号：US10920744
申请日：2004-08-18
申请人： Joop Birsak , Herbert Chao , Bryan Duffey , Amy Freshour , Hugo Ingelbrecht , Qiwei Lu , Michael O'Brien , Prameela Susarla , Michael Vallance , Kenneth Zarnoch
发明人： Joop Birsak , Herbert Chao , Bryan Duffey , Amy Freshour , Hugo Ingelbrecht , Qiwei Lu , Michael O'Brien , Prameela Susarla , Michael Vallance , Kenneth Zarnoch
IPC分类号： C08F283/08 , C08L71/12
CPC分类号： C08G65/485 , C08F220/06 , C08F222/1006 , C08F283/06 , C08F283/08 , C08F290/061 , C08F290/062
摘要： A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要翻译： 可固化组合物包括烯属不饱和单体和具有两个可聚合基团的聚（亚芳基醚），特性粘度为约0.05至约0.30分升/克。 该组合物在模塑期间显示出高流动性和高后固化刚度和冲击强度的改进的组合。 该组合物特别适用于制造塑料封装的电子器件。
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公开(公告)号：US20050075463A1
公开(公告)日：2005-04-07
申请号：US10678459
申请日：2003-10-03
申请人： Kenneth Zarnoch , John Campbell , Glen Merfeld , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
发明人： Kenneth Zarnoch , John Campbell , Glen Merfeld , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
IPC分类号： C08F283/08 , C08F293/00 , C08F297/02 , C08G65/48 , C08L53/00 , C08L71/12
CPC分类号： C08G65/48 , C08F293/005 , C08F297/02 , C08F297/026 , C08G65/485 , C08L53/00
摘要： A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.
摘要翻译： 可固化组合物包括官能化的聚（亚芳基醚），烯属不饱和单体，每100重量份官能化聚（亚芳基醚）和烯属不饱和单体的总量为约0.2至约5重量份的固化引发剂，以及 官能化聚（亚芳基醚）和烯属不饱和单体总量相对于100重量份固化抑制剂为约0.005〜约1重量份。 固化引发剂与固化抑制剂的重量比为约1.2:1至约50:1。 该组合物在模制的早期阶段提供了改进的和可重复的流动，而不损害固化时间。 该组合物可用于制备塑料封装的电子器件。
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公开(公告)号：US20060287439A1
公开(公告)日：2006-12-21
申请号：US11467723
申请日：2006-08-28
申请人： Kenneth Zarnoch , John Campbell , Amy Freshour , Hua Guo , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
发明人： Kenneth Zarnoch , John Campbell , Amy Freshour , Hua Guo , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485
摘要： A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
摘要翻译： 在固化状态下显示减少的吸水性的热固性组合物包括通过未封端的聚（亚芳基醚）与酸酐封端剂的反应制备的烯属不饱和单体和封端的聚（亚芳基醚）。 封端的聚（亚芳基醚）是通过降低有助于固化的组合物吸水的极性杂质的浓度的方法分离和/或纯化的。
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公开(公告)号：US20050075462A1
公开(公告)日：2005-04-07
申请号：US10678243
申请日：2003-10-03
申请人： Kenneth Zarnoch , John Campbell , Amy Freshour , Hua Guo , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
发明人： Kenneth Zarnoch , John Campbell , Amy Freshour , Hua Guo , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
IPC分类号： C08F283/08 , C08F290/06 , C08G65/48
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485
摘要： A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
摘要翻译： 在固化状态下显示减少的吸水性的热固性组合物包括通过未封端的聚（亚芳基醚）与酸酐封端剂的反应制备的烯属不饱和单体和封端的聚（亚芳基醚）。 封端的聚（亚芳基醚）是通过降低有助于固化的组合物吸水的极性杂质的浓度的方法分离和/或纯化的。
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