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    Molding composition and method, and molded article
    8.
    发明授权
    Molding composition and method, and molded article 失效
    成型组合物和成型品

    公开(公告)号：US07378455B2

    公开(公告)日：2008-05-27

    申请号：US11172308

    申请日：2005-06-30

    申请人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    发明人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    IPC分类号： C08F2/50 ,  B29C41/00 ,  B29C39/00

    CPC分类号： C08G59/68 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

    摘要翻译： 用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12） 全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

    Molding composition and method, and molded article
    9.
    发明申请
    Molding composition and method, and molded article 失效
    成型组合物和成型品

    公开(公告)号：US20070004819A1

    公开(公告)日：2007-01-04

    申请号：US11172308

    申请日：2005-06-30

    申请人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    发明人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    IPC分类号： C08F2/46 ,  C08L63/00 ,  C08L71/02

    CPC分类号： C08G59/68 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

    摘要翻译： 用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12） 全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

    MIMO antenna calibration device, integrated circuit and method for compensating phase mismatch
    10.
    发明授权
    MIMO antenna calibration device, integrated circuit and method for compensating phase mismatch 有权

    公开(公告)号：US09628256B2

    公开(公告)日：2017-04-18

    申请号：US13885221

    申请日：2011-11-15

    申请人： Conor O'Keeffe ,  Michael O'Brien

    发明人： Conor O'Keeffe ,  Michael O'Brien

    IPC分类号： H04B17/00 ,  H04L7/00 ,  H01Q3/26 ,  H04B7/10 ,  H04B17/12 ,  H04B17/21

    CPC分类号： H04L7/0016 ,  H01Q3/267 ,  H04B7/10 ,  H04B17/12 ,  H04B17/21

    摘要： A multiple input multiple output (MIMO) calibration device (360) for calibrating a phase relationship between at least two signals present on at least two radio frequency (RF) paths coupling a wireless communication unit and the MIMO calibration device (360) is described. The MIMO calibration device (360) is operably coupleable via at least two RF paths between a wireless communication unit and an antenna arrangement (219). The calibration device (360) comprises a processing module (490) configured to: process a coupled amount of at least one first signal from a first path operably coupleable to a first polarization of the antenna arrangement (219) to determine at least one pilot signal from said at least one first signal; process a coupled amount of at least one second signal from a second path operably coupleable to at least one second polarization feed of antenna arrangement (219), different to the first polarization, to determine the at least one pilot signal from said at least one second signal; and determine a first phase relationship of the same pilot signal between the at least two RF paths.