Method for porosifying a material and semiconductor structure

    公开(公告)号:US11651954B2

    公开(公告)日:2023-05-16

    申请号:US16651055

    申请日:2017-09-27

    摘要: A method for porosifying a Ill-nitride material in a semiconductor structure is provided, the semiconductor structure comprising a sub-surface structure of a first Ill-nitride material, having a charge carrier density greater than 5×1017 cm−3, beneath a surface layer of a second Ill-nitride material, having a charge carrier density of between 1×1014 cm−3 and 1×1017 cm−3. The method comprises the steps of exposing the surface layer to an electrolyte, and applying a potential difference between the first Ill-nitride material and the electrolyte, so that the sub-surface structure is porosified by electrochemical etching, while the surface layer is not porosified. A semiconductor structure and uses thereof are further provided.

    METHOD FOR POROSIFYING A MATERIAL AND SEMICONDUCTOR STRUCTURE

    公开(公告)号:US20230096352A1

    公开(公告)日:2023-03-30

    申请号:US18060317

    申请日:2022-11-30

    IPC分类号: H01L21/02 C25F3/12 H01L33/00

    摘要: A method for porosifying a III-nitride material in a semiconductor structure is provided, the semiconductor structure comprising a sub-surface structure of a first III-nitride material, having a charge carrier density greater than 5×1017 cm−3, beneath a surface layer of a second III-nitride material, having a charge carrier density of between 1×1014 cm−3 and 1×1017 cm−3. The method comprises the steps of exposing the surface layer to an electrolyte, and applying a potential difference between the first III-nitride material and the electrolyte, so that the sub-surface structure is porosified by electrochemical etching, while the surface layer is not porosified. A semiconductor structure and uses thereof are further provided.

    METHOD FOR ELECTROCHEMICALLY ETCHING A SEMICONDUCTOR STRUCTURE

    公开(公告)号:US20210057601A1

    公开(公告)日:2021-02-25

    申请号:US16964706

    申请日:2019-01-25

    摘要: A method for etching a semiconductor structure (110) is provided, the semiconductor structure comprising a sub-surface quantum structure (30) of a first III-V semiconductor material,beneath a surface layer (31) of a second III-V semiconductor material having a charge carrier density of less than 5×1017 cm3. The sub-surface quantum structure may comprise, for example, a quantum well, or a quantum wire, or a quantum dot. The method comprises the steps of exposing the surface layer to an electrolyte (130), and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure (30) to form a plurality of nanostructures, while the surface layer (31) is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.

    Method for electrochemically etching a semiconductor structure

    公开(公告)号:US11631782B2

    公开(公告)日:2023-04-18

    申请号:US16964706

    申请日:2019-01-25

    摘要: A method for etching a semiconductor structure (110) is provided, the semiconductor structure comprising a sub-surface quantum structure (30) of a first III-V semiconductor material,beneath a surface layer (31) of a second III-V semiconductor material having a charge carrier density of less than 5×1017 cm−3. The sub-surface quantum structure may comprise, for example, a quantum well, or a quantum wire, or a quantum dot. The method comprises the steps of exposing the surface layer to an electrolyte (130), and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure (30) to form a plurality of nanostructures, while the surface layer (31) is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.

    PHOTONIC CRYSTAL-BASED SENSOR
    6.
    发明申请

    公开(公告)号:US20230080289A1

    公开(公告)日:2023-03-16

    申请号:US17682027

    申请日:2022-02-28

    IPC分类号: G02B6/122 G02B6/12

    摘要: A sensor for use in biosensing is disclosed. The sensor comprises a photonic crystal waveguide comprising a photonic crystal comprising holes in a layer of dielectric material and a waveguide in the photonic crystal. The sensor comprises at least one strip disposed on the photonic crystal waveguide, spaced apart along, and running across the photonic crystal waveguide so as to form respective strip cavities, each of the at least one strip including a respective layer of material for sensing presence of a respective analyte; and a slot running along the waveguide of the photonic crystal waveguide.

    METHOD FOR POROSIFYING A MATERIAL AND SEMICONDUCTOR STRUCTURE

    公开(公告)号:US20200227255A1

    公开(公告)日:2020-07-16

    申请号:US16651055

    申请日:2017-09-27

    IPC分类号: H01L21/02 H01L33/00 C25F3/12

    摘要: A method for porosifying a Ill-nitride material in a semiconductor structure is provided, the semiconductor structure comprising a sub-surface structure of a first Ill-nitride material, having a charge carrier density greater than 5×1017 cm−3, beneath a surface layer of a second Ill-nitride material, having a charge carrier density of between 1×1014 cm−3 and 1×1017 cm−3. The method comprises the steps of exposing the surface layer to an electrolyte, and applying a potential difference between the first Ill-nitride material and the electrolyte, so that the sub-surface structure is porosified by electrochemical etching, while the surface layer is not porosified. A semiconductor structure and uses thereof are further provided.