公开(公告)号：US08164023B2

公开(公告)日：2012-04-24

申请号：US12251391

申请日：2008-10-14

申请人： Tung-Ming Hsu ,  Chien-Min Chen ,  Ming-Fu Hsu

发明人： Tung-Ming Hsu ,  Chien-Min Chen ,  Ming-Fu Hsu

IPC分类号： B23K26/00

CPC分类号： B23K26/24

摘要： An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to the positioning portions, positioning the metallic sheets on the worktable of the positioning device with the first positioning protrusions of the metallic sheets engaging with the positioning portions of the positioning device, welding the metallic sheets together to form a semi-manufactured frame, and pressing the semi-manufactured frame to form a backlight module frame.

摘要翻译： 用于制造背光模块框架的示例性方法包括：提供协作地限定框架形状的多个金属片，以及定位装置，其包括工作台和限定在所述工作台的角部处的多个定位部，其中每个金属片包括第一定位 与定位部对应的突起，将金属片定位在定位装置的工作台上，金属片的第一定位突起与定位装置的定位部分接合，将金属片焊接在一起形成半制成的框架， 并且按压半制成的框架以形成背光模块框架。

公开(公告)号：US20120021541A1

公开(公告)日：2012-01-26

申请号：US13245884

申请日：2011-09-27

申请人： SHEN BO LIN ,  PIN CHUAN CHEN ,  CHAO HSIUNG CHANG ,  CHIEN MIN CHEN

发明人： SHEN BO LIN ,  PIN CHUAN CHEN ,  CHAO HSIUNG CHANG ,  CHIEN MIN CHEN

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L23/3121 ,  H01L23/3735 ,  H01L24/48 ,  H01L33/64 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4061 ,  H05K2201/0347 ,  H05K2201/0355 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of fabricating a light emitting device initially forms a copper clad ceramic board of the light emitting device using hot-pressing technique at high temperature and photolithography process. Next, a circuit of the light emitting device is formed using die bonding and wire bonding/flipchip processes. Finally, the light emitting device is sealed using transfer molding or injection molding process.

摘要翻译： 一种制造发光器件的方法最初在高温和光刻工艺中使用热压技术形成发光器件的铜包层陶瓷板。 接下来，使用芯片接合和引线接合/倒装芯片工艺形成发光器件的电路。 最后，使用传递模塑或注射成型工艺密封发光器件。

公开(公告)号：US20110095316A1

公开(公告)日：2011-04-28

申请号：US12888399

申请日：2010-09-22

申请人： CHIEN-MIN CHEN ,  KO-WEI CHIEN ,  HUNG-CHIN LIN

发明人： CHIEN-MIN CHEN ,  KO-WEI CHIEN ,  HUNG-CHIN LIN

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

摘要翻译： LED封装结构包括LED管芯，引线框架和连接到引线框架的壳体。 LED管芯位于引线框架的表面上。 壳体包括围绕LED管芯的内表面。 内表面具有连接到引线框架的表面的底边缘，底边缘和顶边之间的上边缘和腰线。 底部边缘围绕小于由腰围包围的区域的区域。 由腰围包围的区域小于由顶部边缘包围的区域。 内表面在腰线和底边之间具有弯曲表面。

公开(公告)号：US07731189B2

公开(公告)日：2010-06-08

申请号：US12013140

申请日：2008-01-11

申请人： Ping-Hung Kuo ,  Ke-Wei Chen ,  Cheng-Ming Liao ,  Chien-Min Chen

发明人： Ping-Hung Kuo ,  Ke-Wei Chen ,  Cheng-Ming Liao ,  Chien-Min Chen

IPC分类号： B65H5/02

CPC分类号： B65H5/36 ,  B65H2404/144 ,  B65H2404/1451 ,  B65H2404/6111 ,  B65H2801/06 ,  B65H2801/39

摘要： A paper guide adjusting mechanism of an office machine includes a main body, a plurality of elastic elements, a transmission member, a plurality of fixing elements and a pressing plate. The main body includes a plurality of confining elements, which have respective recess structures. The transmission member includes a roller axle and a plurality of rollers, wherein the roller axle is partially received in the recess structures and the rollers are sheathed around the roller axle. The fixing elements are disposed in respective recess structures of the confining elements, wherein each fixing element has a base and the base has a first surface sustained against a corresponding elastic element and a second surface sustained against the roller axle. The pressing plate is sustained against the elastic elements.

摘要翻译： 办公机器的纸张引导调节机构包括主体，多个弹性元件，传动部件，多个固定元件和按压板。 主体包括多个限制元件，它们具有各自的凹部结构。 传动构件包括辊轴和多个辊，其中辊轴部分地容纳在凹部结构中，并且辊围绕辊轴被包覆。 固定元件设置在限制元件的相应凹部结构中，其中每个固定元件具有基部，并且基部具有抵抗相应的弹性元件的第一表面和抵靠辊轴的第二表面。 按压板抵靠弹性元件。

公开(公告)号：US20070103889A1

公开(公告)日：2007-05-10

申请号：US11407841

申请日：2006-04-20

申请人： Tung-Ming Hsu ,  Wen-Feng Cheng ,  Chien-Min Chen ,  Ming-Fu Hsu

发明人： Tung-Ming Hsu ,  Wen-Feng Cheng ,  Chien-Min Chen ,  Ming-Fu Hsu

IPC分类号： G09F13/04

CPC分类号： G02F1/133608 ,  G02F1/133604 ,  G02F1/133611 ,  G02F2001/133628

摘要： A direct type backlight module (200) includes a substrate (231), a diffusion sheet (24) disposed above the substrate, a plurality of spacers (21) and a plurality of light sources (22). The spacers are disposed between the substrate and the diffusion sheet. Each spacer includes a bottom surface (211) contacting with the substrate. A groove (2114) is defined in the bottom surface, and a light incident surface (2112) is defined on inner surface of the groove. A pair of wings is disposed on two sides of the bottom surface for supporting the diffusion sheet. Each wing includes an outer side surface and an inner side surface, and a transflective film is formed on the inner side surfaces of the wing. The light sources are respectively disposed in the grooves.

摘要翻译： 直接型背光模块（200）包括基板（231），设置在基板上方的漫射片（24），多个间隔物（21）和多个光源（22）。 间隔物设置在基板和扩散片之间。 每个间隔物包括与基底接触的底表面（211）。 凹槽（2114）被限定在底表面中，并且光入射表面（2112）被限定在凹槽的内表面上。 一对翼部设置在底面的两侧，用于支撑漫射片。 每个翼包括外侧表面和内侧表面，并且半透反射膜形成在翼的内侧表面上。 光源分别设置在凹槽中。

公开(公告)号：US20060246166A1

公开(公告)日：2006-11-02

申请号：US11413894

申请日：2006-04-28

申请人： Tung-Ming Hsu ,  Chin-Lung Wang ,  Chien-Min Chen ,  Yi-Sheng Feng ,  Jue-Hui Tian ,  Xia-Mei Zeng

发明人： Tung-Ming Hsu ,  Chin-Lung Wang ,  Chien-Min Chen ,  Yi-Sheng Feng ,  Jue-Hui Tian ,  Xia-Mei Zeng

IPC分类号： B29C45/78

CPC分类号： B29C33/02 ,  B29C35/16 ,  B29C45/73 ,  B29C45/78 ,  B29C2035/1616

摘要： An injection molding system (10) generally includes a molding device (100), a mold controller (200), and a negative pressure apparatus (300). The molding device defines a molding cavity (160) and a plurality of cooling channels (110) therein and has a plurality of heating elements (120). The heating elements are used for heating the molding cavity to a determined temperature. A cooling medium is supplied in the cooling channels to cool the molding cavity. The negative pressure apparatus is used for keeping the cooling channels in a negative pressure state, thereby improving the fluidity of the cooling medium during heat removal and avoiding leaving a portion of the cooling medium in the cooling channels during heating. Accordingly, the negative pressure apparatus can effectively decrease the heating and cooling terms/lengths. A method for using this system to manufacture a product made from a thermoplastic material is also provided.

摘要翻译： 注射成型系统（10）通常包括模制装置（100），模具控制器（200）和负压装置（300）。 模制装置在其中限定模制腔（160）和多个冷却通道（110），并具有多个加热元件（120）。 加热元件用于将模制腔加热至确定的温度。 在冷却通道中供应冷却介质以冷却模腔。 负压装置用于将冷却通道保持在负压状态，从而提高散热过程中的冷却介质的流动性，并避免在加热期间将冷却介质的一部分留在冷却通道中。 因此，负压装置可以有效地降低加热和冷却的条件/长度。 还提供了一种使用该系统来制造由热塑性材料制成的产品的方法。

公开(公告)号：US20110156085A1

公开(公告)日：2011-06-30

申请号：US12903116

申请日：2010-10-12

申请人： HUNG-CHIN LIN ,  KUO-FU PENG ,  CHIEN-MIN CHEN ,  KO-WEI CHIEN

发明人： HUNG-CHIN LIN ,  KUO-FU PENG ,  CHIEN-MIN CHEN ,  KO-WEI CHIEN

IPC分类号： H01L33/52 ,  H01L23/495

CPC分类号： H01L33/64 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

摘要翻译： 半导体封装包括至少四个引线框架，每个引线框架具有延伸部分和连接部分，散热板具有顶表面和底表面，至少一个半导体芯片位于散热板的顶表面上。 至少一根导线将芯片电连接到引线框架。 封装覆盖引线框架，散热板，半导体芯片和导线，同时散热板的底表面和引线框架的延伸部分露出。

公开(公告)号：US07896765B2

公开(公告)日：2011-03-01

申请号：US12024282

申请日：2008-02-01

申请人： Ping-Hung Kuo ,  Cheng-Ming Liao ,  Ke-Wei Chen ,  Yu-Pang Chen ,  Chien-Min Chen ,  Hsiu-Hui Chiu

发明人： Ping-Hung Kuo ,  Cheng-Ming Liao ,  Ke-Wei Chen ,  Yu-Pang Chen ,  Chien-Min Chen ,  Hsiu-Hui Chiu

IPC分类号： F16H7/08

CPC分类号： F16H7/1281 ,  F16H2007/0808 ,  F16H2007/0874

摘要： The present invention relates to a belt tension adjustment mechanism for use with a device including a main body and a belt pulley set. The belt pulley set includes a belt. The belt tension adjustment mechanism includes a slab, at least two tension pulleys and a fixing element. A tight tension force and a slack tension force are exerted on the opposite sides of the belt to define a tight side and a slack side of the belt when the belt pulley set runs. A counterforce is generated from the tight side of the belt to exert on the tension pulley contacting with the tight side, the slab is moved in response to the counterforce. The slack side of the belt is suppressed by the tension pulley contacting with the slack side such that the slack tension force is adjustable.

摘要翻译： 本发明涉及一种用于包括主体和皮带轮组的装置的皮带张力调节机构。 皮带轮组包括皮带。 带张力调节机构包括板坯，至少两个张力带轮和固定元件。 当皮带轮组运行时，紧张力和松弛张力施加在带的相对侧上以限定带的紧侧和松弛侧。 从皮带的紧密侧产生反作用力，以在与紧密侧接触的张紧轮上施加反作用力，响应于反作用力而移动板。 通过与松弛侧接触的张紧轮来抑制带的松弛侧，使得松弛张力可调。

公开(公告)号：US07677743B2

公开(公告)日：2010-03-16

申请号：US11617620

申请日：2006-12-28

申请人： Tung-Ming Hsu ,  Chien-Min Chen ,  Ming-Fu Hsu

发明人： Tung-Ming Hsu ,  Chien-Min Chen ,  Ming-Fu Hsu

IPC分类号： G01D11/28

CPC分类号： B29D11/00663

摘要： An exemplary process for making a light guide includes the steps of: providing a transparent base sheet; punching the base sheet to form an array of first apertures therein; coating a melted resin material in the first apertures and making the melted resin material fill up the first apertures; solidifying the melted resin material to form a plurality of resin blocks; punching the base sheet to form an array of second apertures in the resin blocks, the second apertures configured for illuminating the keys via at least one light source; and trimming the base sheet with the second apertures to form a light guide. A light guide made by the process is also provided.

摘要翻译： 制造光导的示例性方法包括以下步骤：提供透明基片; 冲压基片以形成其中的第一孔阵列; 在第一孔中涂覆熔融的树脂材料，并使熔融的树脂材料填满第一孔; 使熔融的树脂材料固化，形成多个树脂块; 冲压所述基片以在所述树脂块中形成第二孔阵列，所述第二孔经配置以经由至少一个光源照射所述键; 并用第二孔修剪基片以形成光导。 还提供了由该方法制成的光导。

公开(公告)号：US20090118044A1

公开(公告)日：2009-05-07

申请号：US12024282

申请日：2008-02-01

申请人： Ping-Hung Kuo ,  Cheng-Ming Liao ,  Ke-Wei Chen ,  Yu-Pang Chen ,  Chien-Min Chen ,  Hsiu-Hui Chiu

发明人： Ping-Hung Kuo ,  Cheng-Ming Liao ,  Ke-Wei Chen ,  Yu-Pang Chen ,  Chien-Min Chen ,  Hsiu-Hui Chiu

IPC分类号： F16H7/08

CPC分类号： F16H7/1281 ,  F16H2007/0808 ,  F16H2007/0874

摘要： The present invention relates to a belt tension adjustment mechanism for use with a device including a main body and a belt pulley set. The belt pulley set includes a belt. The belt tension adjustment mechanism includes a slab, at least two tension pulleys and a fixing element. A tight tension force and a slack tension force are exerted on the opposite sides of the belt to define a tight side and a slack side of the belt when the belt pulley set runs. A counterforce is generated from the tight side of the belt to exert on the tension pulley contacting with the tight side, the slab is moved in response to the counterforce. The slack side of the belt is suppressed by the tension pulley contacting with the slack side such that the slack tension force is adjustable.

摘要翻译： 本发明涉及一种用于包括主体和皮带轮组的装置的皮带张力调节机构。 皮带轮组包括皮带。 带张力调节机构包括板坯，至少两个张力带轮和固定元件。 当皮带轮组运行时，紧张力和松弛张力施加在带的相对侧上以限定带的紧侧和松弛侧。 从皮带的紧密侧产生反作用力，以在与紧密侧接触的张紧轮上施加反作用力，响应于反作用力而移动板。 通过与松弛侧接触的张紧轮来抑制带的松弛侧，使得松弛张力可调。