Abstract:
The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
Abstract:
Described is a ladder safety device for use with non supported ladders and methods of using such a device. The device has a cross bar and hooks extending from it. The hooks will engage the rails or a rung of the ladder and hold the cross bar tightly against the ladder rails. Legs extend in the opposite direction with feet that will sit on the structure which is commonly a roof, but could also be any structure in which a ladder extends beyond a support line.
Abstract:
A method to exterminate insects, urban environments, utilizing heat to kill the insects. Optimization of application of heat is shown. The intended environment hidden voids in urban structures.
Abstract:
A method to exterminate insects, for example termites, in situ, whose situs is embodied within an urban structure. Gases that undergo no phase changes in the temperature range between ambient and lethal temperatures are directed on the structure to heat the structure itself to a temperature that is lethal to the insects, and maintaining that temperature long enough to kill the insects.
Abstract:
The present invention provides a device for wearing by an animal. The device is a vest that includes a back, front and chest portion, and a first and second connection systems disposed on the back, front and chest portions, wherein the back front and chest portions are removably connected via the first and second connection systems. The device further includes a ballistic panel, wherein at least one of the back, front and chest portions includes an internal cavity and the ballistic panel is removably disposed in the internal cavity. Each of the back, front and chest portions are separately and selectively replaceable with a replacement portion.
Abstract:
An electronic-ink based RFID tag for attachment to a consumer item and displaying graphical indicia indicating whether or not the item has been read and its integrated RFID module has been activated or deactivated. In response to privacy concerns of consumers, the present invention provides new way of and means for allowing a consumer to readily determine the state of an RFID tag on a consumer item (i.e. activated or deactivated) through the use of a visual indicator integrated with the electronic-ink based RFID tag. The RFID tag has an addressable display label employing a layer of electronic ink, for displaying a first visual indicator when its RFID module has been activated to indicate that the unique identifier associated consumer item has not yet be read, and a second visual indicator when the RFID module has been deactivated to indicate that the unique identifier associated the consumer item has been read.
Abstract:
The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
Abstract:
A thin film transistor array fabricated on a polyimide substrate forms a backplane for an electronic display. The thin film transistor array incorporates gate electrodes, a gate insulating layer, semiconducting channel layers deposited on top of the gate insulating layer, a source electrode, a drain electrode and a contact layer beneath each of the source and drain electrodes and in contact with at least the channel layer. An insulating encapsulation layer is positioned on the channel layer. The layers are deposited onto the polyimide substrate using PECVD and etched using photolithography to form the backplane.