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1.发明授权Semiconductor package with contact support layer and method to produce the package 有权具有接触支撑层的半导体封装和生产封装的方法公开(公告)号：US07452747B2
公开(公告)日：2008-11-18
申请号：US11501913
申请日：2006-08-10
IPC分类号： H01L21/44
CPC分类号： H01L21/6835 , H01L21/563 , H01L21/6836 , H01L23/3157 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/94 , H01L2221/68327 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11822 , H01L2224/13099 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.
摘要翻译： 半导体封装包括：衬底，其包括多个导电迹线和其上表面上的上接触区域，以及在其底表面上的第二多个下导电迹线和外部接触区域以及附接到外部接触区域的外部导电构件。 半导体封装还包括半导体管芯，其包括具有多个管芯接触焊盘的有源表面，其通过导电构件电连接到衬底的接触区域。 半导体管芯的有源表面上的导电构件之间的支撑层至少覆盖导电构件的基部。 一种方法涉及半导体封装的制造。
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公开(公告)号：US20080006900A1
公开(公告)日：2008-01-10
申请号：US11738641
申请日：2007-04-23
IPC分类号： H01L31/036 , H01L21/00 , H01L23/48
CPC分类号： H01L23/3121 , H01L21/563 , H01L29/0657 , H01L2221/6834 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10157 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
摘要翻译： 半导体封装包括重新布线基板和半导体芯片。 半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。 半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。 半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。
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公开(公告)号：US06288335B1
公开(公告)日：2001-09-11
申请号：US09479023
申请日：2000-01-07
申请人： Charles-Wee-Ming Lee
发明人： Charles-Wee-Ming Lee
IPC分类号： H01L2328
CPC分类号： H01L23/24 , H01L2224/16 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A package for at least one semiconductor body. The package is characterized by being configured in two parts. A first part of the package contains a thin supporting frame which has a thickness of a few micrometers which completely surrounds the surface of the semiconductor body and is raised above a top surface of the semiconductor body at the edge of the semiconductor body. The second part of the package has a cover which is as flat as possible which covers the entire second surface and at least partially covers an upper rim of the supporting frame. A compound forming the supporting frame has a considerably greater viscosity than a compound forming the cover. The supporting frame is used as a flow stop for the covering compound during production of the package. Such so-called PBCSP packages allow packaged components to be produced which have an optimum chip/package ratio. Furthermore, such packaged components have the advantage that they are protected against external influences such as temperature, moisture, humidity and mechanical stress. In comparison with so-called flip chips or bar dies, PBCSP packages according to the invention have the advantage that they are easy to transport and to handle.
摘要翻译： 用于至少一个半导体主体的封装。 该包装的特征在于配置成两部分。 封装的第一部分包含薄的支撑框架，该支撑框架具有几微米的厚度，其完全围绕半导体主体的表面并且在半导体主体的边缘处在半导体本体的顶表面上方升高。 包装的第二部分具有覆盖整个第二表面并且至少部分地覆盖支撑框架的上边缘的尽可能平坦的盖。 形成支撑框架的复合物具有比形成盖子的化合物显着更大的粘度。 支撑框架用作包装生产期间的覆盖化合物的流动停止。 这种所谓的PBCSP封装允许制造具有最佳芯片/封装比率的封装元件。 此外，这种包装的组件具有的优点是可以防止外部影响，如温度，湿度，湿度和机械应力。 与所谓的倒装芯片或棒模相比，根据本发明的PBCSP封装具有易于运输和处理的优点。
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公开(公告)号：US06852567B1
公开(公告)日：2005-02-08
申请号：US09980222
申请日：1999-05-31
CPC分类号： H01L23/3142 , H01L24/29 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A method of assembling a semiconductor device package includes first attaching a semiconductor device to a die-pad area of a leadframe. Electrical connections are then between electrical contact areas on the semiconductor device and electrical connection areas on the leadframe to form a device/leadframe assembly. An adhesion enhancing coating is then deposited on the exposed surface of the device frame/leadframe assembly before encapsulating the coated device leadframe assembly in an electrically insulating material.
摘要翻译： 一种组装半导体器件封装的方法包括首先将半导体器件附接到引线框的管芯焊盘区域。 然后，电连接在半导体器件上的电接触区域和引线框架上的电连接区域之间，以形成器件/引线框架组件。 然后在将涂覆的装置引线框架组件封装在电绝缘材料中之前，将附着增强涂层沉积在装置框架/引线框组件的暴露表面上。
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公开(公告)号：US08003448B2
公开(公告)日：2011-08-23
申请号：US12868147
申请日：2010-08-25
CPC分类号： H01L23/3121 , H01L21/563 , H01L29/0657 , H01L2221/6834 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10157 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
摘要翻译： 半导体封装包括重新布线基板和半导体芯片。 半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。 半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。 半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。
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公开(公告)号：US20100314721A1
公开(公告)日：2010-12-16
申请号：US12868147
申请日：2010-08-25
CPC分类号： H01L23/3121 , H01L21/563 , H01L29/0657 , H01L2221/6834 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10157 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
摘要翻译： 半导体封装包括重新布线基板和半导体芯片。 半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。 半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。 半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。
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公开(公告)号：US07816235B2
公开(公告)日：2010-10-19
申请号：US11738641
申请日：2007-04-23
IPC分类号： H01L21/00 , H01L21/461 , H01L21/302
CPC分类号： H01L23/3121 , H01L21/563 , H01L29/0657 , H01L2221/6834 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10157 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
摘要翻译： 半导体封装包括重新布线基板和半导体芯片。 半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。 半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。 半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。
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