公开(公告)号：US5665631A

公开(公告)日：1997-09-09

申请号：US563803

申请日：1995-11-28

申请人： Byoung-hun Lee ,  Chi-jung Kang ,  Kyung-wook Lee ,  Gi-ho Cha

发明人： Byoung-hun Lee ,  Chi-jung Kang ,  Kyung-wook Lee ,  Gi-ho Cha

IPC分类号： H01L21/304 ,  H01L21/02 ,  H01L21/18 ,  H01L21/20 ,  H01L27/12 ,  H01L21/76

CPC分类号： H01L21/76256 ,  Y10S438/938

摘要： A SOI substrate manufacturing method which corrects the warpage in the SOI substrate by varying the thickness of a semiconductor material layer additionally formed over the bonded combination of a semiconductor substrate and supporting substrate.

摘要翻译： 一种SOI衬底制造方法，其通过改变在半导体衬底和支撑衬底的接合组合上附加形成的半导体材料层的厚度来校正SOI衬底中的翘曲。

公开(公告)号：US5746883A

公开(公告)日：1998-05-05

申请号：US723239

申请日：1996-09-27

申请人： Gi-ho Cha ,  Chi-jung Kang ,  Byung-hun Lee ,  Kyung-wook Lee

发明人： Gi-ho Cha ,  Chi-jung Kang ,  Byung-hun Lee ,  Kyung-wook Lee

IPC分类号： H01L21/02 ,  H01L21/00 ,  B32B31/00

CPC分类号： H01L21/67132

摘要： An apparatus for bonding semiconductor wafers firmly bonds the wafers to each other and can always lay the bonded wafers on a desired bonding plate. The bonding plates have a plurality of grooves formed on their respective surfaces to reduce the bond force between the wafers and the bonding plates of the apparatus, and to prevent the wafers from sliding off the plates due to an air cushion. An interval controlling pin projects from the surface of one of the bonding plates to reduce breakage of the wafers by maintaining an interval between the bonding plates as they are are rotated towards each other. An elastic pad portion is installed on one the bonding plates for providing an elastic force for the wafers placed on the bonding plates so that the wafers bond to each other properly when the bonding plates are further rotated towards each other.

摘要翻译： 用于接合半导体晶片的装置将晶片彼此牢固地结合，并且可以总是将结合的晶片放置在期望的接合板上。 接合板在它们各自的表面上形成有多个槽，以减少晶片和设备的接合板之间的结合力，并且防止晶片由于气垫而从板上脱落。 间隔控制销从一个接合板的表面突出，以通过在接合板之间彼此相对旋转时保持间隔而减小晶片的断裂。 弹性垫部分安装在一个粘合板上，用于为粘合板上放置的晶片提供弹性力，使得当粘结板进一步相互转动时，晶片彼此粘合。

公开(公告)号：US20080230389A1

公开(公告)日：2008-09-25

申请号：US12053906

申请日：2008-03-24

申请人： Kon Ha ,  Yong Sang Kim ,  Chi Jung Kang ,  In Je Yi

发明人： Kon Ha ,  Yong Sang Kim ,  Chi Jung Kang ,  In Je Yi

IPC分类号： G01N27/00

CPC分类号： G01N27/44791 ,  B01L3/502707 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2400/0421 ,  G01N27/4473

摘要： An electrochemical detector integrated on a capillary electrophoresis chip according to the present invention includes: a first substrate having a microchannel; a second substrate adapted to mate with the first substrate and having at least one peripheral electrode for conducting electrophoresis of a sample injected along the microchannel of the first substrate, in which a separation channel is formed along the microchannel by bonding the first substrate with the second substrate; a first electrode, made of indium tin oxide (ITO), formed on the first substrate to be positioned over the separation channel; and a second electrode, made of indium tin oxide (ITO), formed on the second substrate to be positioned under the separation channel, and spaced apart from the first electrode at a predetermined interval, wherein the first electrode and the second electrode constitute a detector to measure electrical characteristics of the sample passing along the separation channel. According to the present invention, since the specific characteristics of a sample can be evaluated by measuring the electrical or genetic characteristics of the sample flowing along the microchannel formed in a chip using a detector, a chip for a micro-analysis system having a simple structure can be realized.

摘要翻译： 集成在根据本发明的毛细管电泳芯片上的电化学检测器包括：具有微通道的第一衬底; 第二衬底，其适于与第一衬底配合并且具有至少一个用于进行沿着第一衬底的微通道注入的样品的电泳的外围电极，其中通过将第一衬底与第二衬底接合而沿着微通道形成分离通道 基质; 形成在所述第一基板上以位于所述分离通道上方的由氧化铟锡（ITO）制成的第一电极; 以及形成在所述第二基板上的氧化铟锡（ITO）的第二电极，所述第二电极被定位在所述分离通道下方，并且以预定间隔与所述第一电极间隔开，其中所述第一电极和所述第二电极构成检测器 以测量通过分离通道的样品的电特性。 根据本发明，由于可以通过使用检测器测量沿着形成在芯片中的微通道流动的样品的电或遗传特性来评价样品的特性，所以具有简单结构的微分析系统用芯片 可以实现。