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    Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof
    1.
    发明申请
    Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof 审中-公开
    用于测试半导体器件和垂直探针的探针卡

    公开(公告)号：US20120043987A1

    公开(公告)日：2012-02-23

    申请号：US12861183

    申请日：2010-08-23

    申请人： Choon Leong Lou ,  Chih Kun Chen

    发明人： Choon Leong Lou ,  Chih Kun Chen

    IPC分类号： G01R31/00

    CPC分类号： G01R1/06716

    摘要： A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact.

    摘要翻译： 用于测试半导体器件的垂直探针包括以基本线性的方式堆叠在底部触点上的底部触点和顶部触点。 在本发明的一个实施例中，底部触点包括多个以峰顶方式堆叠在另一个顶部上的第一波形弹簧，底部触点具有被配置为接触被测器件的底部开口和波形弹簧 被配置为提供垂直位移，用于消除当垂直探针接触被测器件时产生的应力，其中顶部触点的宽度大于底部触点的宽度。

    PROBE CARD FOR TESTING HIGH-FREQUENCY SIGNALS
    2.
    发明申请
    PROBE CARD FOR TESTING HIGH-FREQUENCY SIGNALS 有权
    用于测试高频信号的探头卡

    公开(公告)号：US20110279139A1

    公开(公告)日：2011-11-17

    申请号：US13105321

    申请日：2011-05-11

    申请人： CHOON LEONG LOU ,  CHIH KUN CHEN

    发明人： CHOON LEONG LOU ,  CHIH KUN CHEN

    IPC分类号： G01R31/00

    CPC分类号： G01R1/06772 ,  G01R1/06727 ,  G01R1/07342

    摘要： A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.

    摘要翻译： 探针卡包括电路板，柔性基板和多个探针。 柔性基板包括多个排列的导电条。 多个导电带电连接到印刷电路板。 多个探针固定在印刷电路板上，每个探针的端部连接到一个对应的导电条上。

    Wafer cleaning apparatus with multiple wash-heads
    3.
    发明授权
    Wafer cleaning apparatus with multiple wash-heads 有权
    具有多个洗头的晶圆清洗设备

    公开(公告)号：US07252099B2

    公开(公告)日：2007-08-07

    申请号：US10655224

    申请日：2003-09-05

    申请人： Chih-Kun Chen ,  Yao-Hsiung Kung

    发明人： Chih-Kun Chen ,  Yao-Hsiung Kung

    IPC分类号： B08B3/00

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

    摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

    摘要翻译： 在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。 晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。 旋转模块也包括在晶片清洁装置中。 旋转模块的顶侧与驱动装置连接。 此外，旋转模块包括多个洗头和至少一个喷嘴。 这里的洗头的底部与晶片的表面接触。 通过使用驱动装置，可以完全驱动旋转模块。 此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。 流体从喷嘴和助剂喷射通过流体管清洁晶片。 单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

    Wafer carrier
    5.
    发明授权
    Wafer carrier 有权
    晶圆载体

    公开(公告)号：US06671576B1

    公开(公告)日：2003-12-30

    申请号：US10391717

    申请日：2003-03-19

    申请人： Chih-Kun Chen

    发明人： Chih-Kun Chen

    IPC分类号： G06F700

    CPC分类号： H01L21/67259 ,  H01L21/681 ,  Y10S414/137 ,  Y10S414/141

    摘要： A wafer carrier device capable of detecting positioning precision of a supporting plate thereof. In the present invention, a supporting plate connected to a mechanical arm has three reflectors and a positioning window. A detection device has a vertical signal generator to output a vertical alignment signal to a vertical signal receiver, and three level detectors to each output a second signal to the corresponding reflector respectively and receive a corresponding reflected level detection signal from the corresponding reflector. A determining unit determines whether the supporting plate is aligned with the vertical signal receiver according to the vertical alignment signal. The determining unit outputs a position rectification signal when the supporting plate is not aligned with the vertical signal receiver. A driver moves the supporting plate by mechanical arm to align the vertical signal receiver according to the position rectification signal.

    摘要翻译： 一种能够检测其支撑板的定位精度的晶片载体装置。 在本发明中，连接到机械臂的支撑板具有三个反射器和定位窗。 检测装置具有垂直信号发生器，用于向垂直信号接收器输出垂直对准信号，并且三个电平检测器分别向对应的反射器输出第二信号，并从相应的反射器接收相应的反射电平检测信号。 确定单元根据垂直对准信号确定支撑板是否与垂直信号接收器对准。 当支撑板不与垂直信号接收器对准时，确定单元输出位置整流信号。 驱动器通过机械臂移动支撑板，以根据位置整流信号对准垂直信号接收器。

    Wafer cleaning apparatus with multiple wash-heads
    7.
    发明申请
    Wafer cleaning apparatus with multiple wash-heads 有权
    具有多个洗头的晶圆清洗设备

    公开(公告)号：US20050051200A1

    公开(公告)日：2005-03-10

    申请号：US10655224

    申请日：2003-09-05

    申请人： Chih-Kun Chen ,  Yao-Hsiung Kung

    发明人： Chih-Kun Chen ,  Yao-Hsiung Kung

    IPC分类号： B08B3/02 ,  H01L21/00

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

    摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

    摘要翻译： 在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。 晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。 旋转模块也包括在晶片清洁装置中。 旋转模块的顶侧与驱动装置连接。 此外，旋转模块包括多个洗头和至少一个喷嘴。 这里的洗头的底部与晶片的表面接触。 通过使用驱动装置，可以完全驱动旋转模块。 此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。 流体从喷嘴和助剂喷射通过流体管清洁晶片。 单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

    Method of measuring pore depth on the surface of a polishing pad
    9.
    发明授权
    Method of measuring pore depth on the surface of a polishing pad 有权

    公开(公告)号：US06745631B2

    公开(公告)日：2004-06-08

    申请号：US10435440

    申请日：2003-05-09

    申请人： Chih-Kun Chen ,  Chung-Min Lin

    发明人： Chih-Kun Chen ,  Chung-Min Lin

    IPC分类号： G01N2918

    CPC分类号： B24B37/26 ,  B24B49/00 ,  B24D13/147 ,  G01N29/07 ,  G01N2291/2638

    摘要： A method of measuring pore depth on the surface of a polishing pad during processing. In the present invention, a planar ultrasound sensing device is disposed a predetermined distance above the surface of a polishing pad. The planar ultrasound sensing device sends out a plurality of ultrasound signals to the surface and the pores therein, and receives a plurality of reflected signals from the pad surface and constituent pores. The difference between pore depth and the surface is determined to establish first depth difference data according to the time delay in the reflected signals. The polishing pad is rotated to obtain second to Nth depth difference data. A relational image relative to the surface and the pores of the polishing pad is obtained according to the first to Nth depth difference data.

    Probe card for testing high-frequency signals
    10.
    发明授权
    Probe card for testing high-frequency signals 有权
    用于测试高频信号的探针卡

    公开(公告)号：US08692570B2

    公开(公告)日：2014-04-08

    申请号：US13105321

    申请日：2011-05-11

    申请人： Choon Leong Lou ,  Chih Kun Chen

    发明人： Choon Leong Lou ,  Chih Kun Chen

    IPC分类号： G01R31/00

    CPC分类号： G01R1/06772 ,  G01R1/06727 ,  G01R1/07342

    摘要： A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.

    摘要翻译： 探针卡包括电路板，柔性基板和多个探针。 柔性基板包括多个排列的导电条。 多个导电带电连接到印刷电路板。 多个探针固定在印刷电路板上，每个探针的端部连接到一个对应的导电条上。