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公开(公告)号：US07375374B2
公开(公告)日：2008-05-20
申请号：US11779493
申请日：2007-07-18
Applicant: Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
Inventor： Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
CPC classification number: H01L27/124 , G02F1/136259 , G02F2001/136263
Abstract: A thin film transistor array substrate and method for repairing the same are provided. Repairing lines are formed when the data lines on the thin film transistor array substrate are defined. Furthermore, the protruding portions and branches of common lines overlap with the repairing lines and the data lines respectively. The repairing method includes performing a laser welding operation to connect the common line with the data line, the repairing line or a scan line as well as removing a portion of the lines by laser. Thus, the thin film transistor array substrate and repairing method thereof can repair line defects and increase the manufacturing yield.
Abstract translation: 提供薄膜晶体管阵列基板及其修理方法。 当限定薄膜晶体管阵列基板上的数据线时，形成修补线。 此外，公共线的突出部分和分支分别与修复线和数据线重叠。 修复方法包括执行激光焊接操作以将公共线与数据线，修复线或扫描线连接，以及通过激光去除一部分线。 因此，薄膜晶体管阵列基板及其修复方法可以修复线路缺陷并提高制造成品率。
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公开(公告)号：US20070259455A1
公开(公告)日：2007-11-08
申请号：US11779493
申请日：2007-07-18
Applicant: Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
Inventor： Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
IPC: H01L21/00
CPC classification number: H01L27/124 , G02F1/136259 , G02F2001/136263
Abstract: A thin film transistor array substrate and method for repairing the same are provided. Repairing lines are formed when the data lines on the thin film transistor array substrate are defined. Furthermore, the protruding portions and branches of common lines overlap with the repairing lines and the data lines respectively. The repairing method includes performing a laser welding operation to connect the common line with the data line, the repairing line or a scan line as well as removing a portion of the lines by laser. Thus, the thin film transistor array substrate and repairing method thereof can repair line defects and increase the manufacturing yield.
Abstract translation: 提供薄膜晶体管阵列基板及其修理方法。 当限定薄膜晶体管阵列基板上的数据线时，形成修补线。 此外，公共线的突出部分和分支分别与修复线和数据线重叠。 修复方法包括执行激光焊接操作以将公共线与数据线，修复线或扫描线连接，以及通过激光去除一部分线。 因此，薄膜晶体管阵列基板及其修复方法可以修复线路缺陷并提高制造成品率。
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公开(公告)号：US20070119769A1
公开(公告)日：2007-05-31
申请号：US11286345
申请日：2005-11-25
Applicant: Chin-Sheng Chen
Inventor： Chin-Sheng Chen
IPC: B01D24/36
CPC classification number: C02F1/003 , C02F2201/006 , C02F2307/06
Abstract: A water filtration device is provided herein. The major characteristic of the present invention lies in the use of a fan at the bottom of the water filtration device which mainly contains a number of tubular members sleeved together to form passageways to guide the water to drive the fan's rotation. As the blades of the fan spin, the water is propelled upward to sustain the filtering particles to continue moving amidst the water, in contrast to the prior approach which has the water to flow downward in one direction to confine the filtering particles.
Abstract translation: 本文提供了一种水过滤装置。 本发明的主要特征在于，在水过滤装置的底部使用风扇，该风扇主要包括多个套管在一起的管状构件，以形成通道以引导水来驱动风扇的转动。 随着风扇的叶片旋转，与先前的方法相反，水在一个方向上向下流动以限制过滤颗粒，因此水被向上推动以维持过滤颗粒继续在水中移动。
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公开(公告)号：US20070045625A1
公开(公告)日：2007-03-01
申请号：US11214758
申请日：2005-08-29
Applicant: Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
Inventor： Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
IPC: H01L29/04
CPC classification number: H01L27/124 , G02F1/136259 , G02F2001/136263
Abstract: A thin film transistor array substrate and method for repairing the same are provided. Repairing lines are formed when the data lines on the thin film transistor array substrate are defined. Furthermore, the protruding portions and branches of common lines overlap with the repairing lines and the data lines respectively. The repairing method includes performing a laser welding operation to connect the common line with the data line, the repairing line or a scan line as well as removing a portion of the lines by laser. Thus, the thin film transistor array substrate and repairing method thereof can repair line defects and increase the manufacturing yield.
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公开(公告)号：US07841901B2
公开(公告)日：2010-11-30
申请号：US12750589
申请日：2010-03-30
Applicant: Hsin-Hsien Yu , Shun-Jung Chuang , Chin-Sheng Chen
Inventor： Hsin-Hsien Yu , Shun-Jung Chuang , Chin-Sheng Chen
IPC: H01R13/66
CPC classification number: H01R13/6658 , H01R12/721 , H01R13/6581
Abstract: An electrical connector assembly (100) with an integrated circuit module (4) comprises: an insulative housing (1) having a base portion (11) and a tongue portion (12) extending from the base portion (11); a number of contacts (2) assembled in a number of recesses (10) of the housing (1), each contact (2) having a contact portion (21) at the front end, a middle connecting portion (22), and a soldering tail (23) at the rear end; a shield case (3) enclosing the housing (1); and an integrated circuit module (4). The integrated circuit module (4) is soldered to the connecting portions of the contacts and therefore fastened by the electrical connector.
Abstract translation: 具有集成电路模块（4）的电连接器组件（100）包括：具有基部（11）和从基部（11）延伸的舌部（12）的绝缘壳体（1） 组装在所述壳体（1）的多个凹部（10）中的多个触头（2），每个触头（2）在前端具有接触部分（21），中间连接部分（22）和 后端焊尾（23）; 围绕壳体（1）的屏蔽壳（3）; 和集成电路模块（4）。 集成电路模块（4）被焊接到触点的连接部分，并且因此被电连接器紧固。
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Patent Agency Ranking
公开(公告)号：US06559044B1
公开(公告)日：2003-05-06
申请号：US10237799
申请日：2002-09-10
Applicant: Chun-Che Chen , Fang-Yu Yeh , Han-Chih Lin , Chin-Sheng Chen
Inventor： Chun-Che Chen , Fang-Yu Yeh , Han-Chih Lin , Chin-Sheng Chen
IPC: H01L214763
CPC classification number: H01L21/76897 , H01L21/76802
Abstract: A method for forming contacts in a semiconductor device including a plurality of active devices formed over a substrate that includes depositing a first layer of dielectric material over the substrate and plurality of active devices, forming a first opening in the first layer of dielectric material, depositing a second layer of dielectric material over the first layer of dielectric material and in the first opening, providing a mask over the second layer of dielectric material, wherein the mask material is distinguishable over silicon oxides, and forming a second opening and a third opening in the second layer of dielectric material, wherein the second opening is aligned with the first opening and exposes a first silicide of a first active device, and the third opening exposes one of diffused regions of a second active device.
Abstract translation: 一种用于在半导体器件中形成接触的方法，所述半导体器件包括形成在衬底上的多个有源器件，所述有源器件包括在所述衬底上沉积介电材料的第一层和多个有源器件，在所述第一介电材料层中形成第一开口， 在所述第一介电材料层上并且在所述第一开口中的第二介电材料层，在所述第二介电材料层上提供掩模，其中所述掩模材料可以在硅氧化物上区分，并形成第二开口和第三开口 所述第二介电材料层，其中所述第二开口与所述第一开口对准并且暴露第一有源器件的第一硅化物，并且所述第三开口暴露第二有源器件的扩散区域中的一个。
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公开(公告)号：US09572545B2
公开(公告)日：2017-02-21
申请号：US13466142
申请日：2012-05-08
Applicant: Yu-Jen Chen , Chia-Yuan Liu , Wen-Chung Chang , Chin-Sheng Chen
Inventor： Yu-Jen Chen , Chia-Yuan Liu , Wen-Chung Chang , Chin-Sheng Chen
CPC classification number: A61B8/085 , A61B8/4218 , A61B8/4263 , A61B8/523 , A61B8/5261 , A61B8/565 , A61B8/587 , A61N5/1037 , A61N5/1067 , A61N2005/1058 , G06T7/187 , G06T7/33 , G06T2207/10081 , G06T2207/10132 , G06T2207/20032 , G06T2207/20061 , G06T2207/30056
Abstract: The present invention provides a radiotherapy system that can monitor a target location in real time. The radiotherapy system includes a remote control system operable to actuate a real-time image capturing device to acquire images in real time for monitoring the target location. The system also includes an image registration system that can register the acquired image with an image previously captured for the treatment plan, whereby it can be determined whether the patient's tumor is in the beam's eye view of the treatment plan. By confirming that the tumor is in the range of the beam's eye view, the accuracy of the treatment can be improved, and the irradiated area can be reduced, which makes the radiation treatment safer.
Abstract translation: 本发明提供了可以实时监视目标位置的放射治疗系统。 放射治疗系统包括可操作以致动实时图像捕获装置以实时获取图像的遥控系统，用于监视目标位置。 该系统还包括一个图像配准系统，其可以用先前为治疗计划拍摄的图像来注册所获取的图像，从而可以确定患者的肿瘤是否处于治疗计划的眼睛视图中。 通过确认肿瘤在眼睛的视野范围内，可以提高治疗的准确性，并且可以减少照射面积，这使得放射治疗更安全。
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公开(公告)号：US20070290205A1
公开(公告)日：2007-12-20
申请号：US11423961
申请日：2006-06-14
Applicant: Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
Inventor： Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
IPC: H01L29/04
CPC classification number: H01L29/78606 , H01L29/41733 , H01L29/42384 , H01L29/78696
Abstract: A dual-channel thin film transistor is applied to a thin film transistor liquid crystal display. It includes a substrate, a gate electrode, a source, and a drain. The drain further includes two drain electrodes. The two drain electrodes form the dual-channel with the source. A channel layer is between the source, the drain and the gate electrode.
Abstract translation: 双通道薄膜晶体管被施加到薄膜晶体管液晶显示器。 它包括衬底，栅电极，源极和漏极。 漏极还包括两个漏电极。 两个漏电极与源极形成双通道。 沟道层位于源极，漏极和栅电极之间。
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公开(公告)号：US07265386B2
公开(公告)日：2007-09-04
申请号：US11214758
申请日：2005-08-29
Applicant: Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
Inventor： Chin-Sheng Chen , Chih-Hung Liu , Chien-Hsing Hung , Kun-Yuan Huang
CPC classification number: H01L27/124 , G02F1/136259 , G02F2001/136263
Abstract: A thin film transistor array substrate and method for repairing the same are provided. Repairing lines are formed when the data lines on the thin film transistor array substrate are defined. Furthermore, the protruding portions and branches of common lines overlap with the repairing lines and the data lines respectively. The repairing method includes performing a laser welding operation to connect the common line with the data line, the repairing line or a scan line as well as removing a portion of the lines by laser. Thus, the thin film transistor array substrate and repairing method thereof can repair line defects and increase the manufacturing yield.
Abstract translation: 提供薄膜晶体管阵列基板及其修理方法。 当限定薄膜晶体管阵列基板上的数据线时，形成修补线。 此外，公共线的突出部分和分支分别与修复线和数据线重叠。 修复方法包括执行激光焊接操作以将公共线与数据线，修复线或扫描线连接，以及通过激光去除一部分线。 因此，薄膜晶体管阵列基板及其修复方法可以修复线路缺陷并提高制造成品率。
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公开(公告)号：US20100248543A1
公开(公告)日：2010-09-30
申请号：US12750589
申请日：2010-03-30
Applicant: HSIN-HSIEN YU , SHUN-JUNG CHUANG , CHIN-SHENG CHEN
Inventor： HSIN-HSIEN YU , SHUN-JUNG CHUANG , CHIN-SHENG CHEN
IPC: H01R13/648
CPC classification number: H01R13/6658 , H01R12/721 , H01R13/6581
Abstract: An electrical connector assembly (100) with an integrated circuit module (4) comprises: an insulative housing (1) having a base portion (11) and a tongue portion (12) extending from the base portion (11); a number of contacts (2) assembled in a number of recesses (10) of the housing (1), each contact (2) having a contact portion (21) at the front end, a middle connecting portion (22), and a soldering tail (23) at the rear end; a shield case (3) enclosing the housing (1); and an integrated circuit module (4). The integrated circuit module (4) is soldered to the connecting portions of the contacts and therefore fastened by the electrical connector.
Abstract translation: 具有集成电路模块（4）的电连接器组件（100）包括：具有基部（11）和从基部（11）延伸的舌部（12）的绝缘壳体（1） 组装在所述壳体（1）的多个凹部（10）中的多个触头（2），每个触头（2）在前端具有接触部分（21），中间连接部分（22）和 后端焊尾（23）; 围绕壳体（1）的屏蔽壳（3）; 和集成电路模块（4）。 集成电路模块（4）被焊接到触点的连接部分，并且因此被电连接器紧固。
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