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8 条记录 (耗时 0.017 秒)

    Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer
    1.
    发明授权
    Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer 有权

    公开(公告)号：US08497161B2

    公开(公告)日：2013-07-30

    申请号：US12383447

    申请日：2009-03-24

    申请人： Chiu Chung Yang

    发明人： Chiu Chung Yang

    IPC分类号： H01L21/00

    CPC分类号： H01L33/0095 ,  H01L33/44

    摘要： A method is disclosed to divide a wafer into chips. In the method, a substrate is provided. The substrate is made of an isolating material. An epitaxial laminate is provided on the substrate. At least one slit is made through the epitaxial laminate completely to form at least two chips connected to each other by the substrate only so that each of the chips includes a portion of the substrate and a portion of the epitaxial laminate. Positive and negative electrodes are formed in each of the chips. An upper protective film is provided to cover an upper side of each of the chips except the electrodes. A peripheral protective film is provided into the slit to cover the periphery of the portion of the epitaxial laminate of each of the chips. Finally, the chips are separated from each other.

    Flip chip LED die and array thereof
    2.
    发明授权
    Flip chip LED die and array thereof 有权
    倒装芯片LED芯片及其阵列

    公开(公告)号：US08368114B2

    公开(公告)日：2013-02-05

    申请号：US12943020

    申请日：2010-11-10

    申请人： Chiu-Chung Yang

    发明人： Chiu-Chung Yang

    IPC分类号： H01L29/24

    CPC分类号： H01L33/44 ,  H01L33/22

    摘要： A flip chip LED die is provided and includes a first type doped layer, a second type doped layer, a first electrode layer, a second electrode layer and an insulation layer. The second type doped layer is disposed under the first type doped layer. The first electrode layer is disposed under the first type doped layer without contacting the second type doped layer. The first electrode layer has an exposed area for directly coating an electrically conductive adhesive thereon. The second metal/electrode layer is disposed under the second type doped layer, and also has an exposed area for directly coating the electrically conductive adhesive thereon. The insulation layer is disposed between the first electrode layer and the second electrode layer for electrically insulating and supporting the first electrode layer and the second electrode layer.

    摘要翻译： 提供了倒装芯片LED管芯，其包括第一掺杂层，第二掺杂层，第一电极层，第二电极层和绝缘层。 第二类型掺杂层设置在第一类型掺杂层下方。 第一电极层设置在第一类型掺杂层下方，而不与第二类型掺杂层接触。 第一电极层具有用于在其上直接涂覆导电粘合剂的暴露区域。 第二金属/电极层设置在第二类型掺杂层下方，并且还具有用于在其上直接涂覆导电粘合剂的暴露区域。 绝缘层设置在第一电极层和第二电极层之间，用于电绝缘和支撑第一电极层和第二电极层。

    Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer
    3.
    发明申请
    Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer 有权
    在从晶片切割LED芯片之前提供周边保护膜的方法

    公开(公告)号：US20090186448A1

    公开(公告)日：2009-07-23

    申请号：US12383447

    申请日：2009-03-24

    申请人： Chiu Chung Yang

    发明人： Chiu Chung Yang

    IPC分类号： H01L21/78

    CPC分类号： H01L33/0095 ,  H01L33/44

    摘要： A method is disclosed to divide a wafer into chips. In the method, a substrate is provided. The substrate is made of an isolating material. An epitaxial laminate is provided on the substrate. At least one slit is made through the epitaxial laminate completely to form at least two chips connected to each other by the substrate only so that each of the chips includes a portion of the substrate and a portion of the epitaxial laminate. Positive and negative electrodes are formed in each of the chips. An upper protective film is provided to cover an upper side of each of the chips except the electrodes. A peripheral protective film is provided into the slit to cover the periphery of the portion of the epitaxial laminate of each of the chips. Finally, the chips are separated from each other.

    摘要翻译： 公开了将晶片分成芯片的方法。 在该方法中，提供基板。 衬底由隔离材料制成。 在基板上设置外延层叠体。 通过外延层压体完全制成至少一个狭缝，以形成至少两个芯片，该芯片仅由衬底相互连接，使得每个芯片包括衬底的一部分和外延层叠体的一部分。 在每个芯片中形成正极和负极。 提供上保护膜以覆盖除了电极之外的每个芯片的上侧。 在狭缝中设置周边保护膜以覆盖每个芯片的外延层叠体的一部分的周边。 最后，芯片彼此分开。

    Method for subdividing wafer into LEDs
    4.
    发明申请
    Method for subdividing wafer into LEDs 审中-公开
    将晶圆细分为LED的方法

    公开(公告)号：US20080132036A1

    公开(公告)日：2008-06-05

    申请号：US11633608

    申请日：2006-12-04

    申请人： Chiu Chung Yang

    发明人： Chiu Chung Yang

    IPC分类号： H01L21/00

    CPC分类号： H01L33/44 ,  H01L33/0095 ,  H01L33/38 ,  H01L2933/0016

    摘要： A method for forming chips on a wafer includes forming one or more spaces in a substrate to form and to space two or more chips from each other, forming a positive electrode and a negative electrode in each of the chips, cutting one or more cut-off portions through the substrate and communicating with the space of the substrate. A protective layer is applied onto the outer peripheral portion of the substrate and the chips and includes a covering portion engaged into the cut-off portion of the substrate for allowing the substrate and the chips to be completely shielded and protected by the protective layer without further sealing or packaging operations.

    摘要翻译： 一种在晶片上形成芯片的方法包括在基板中形成一个或多个空间以形成和分离两个或更多个芯片，在每个芯片中形成正极和负极，切割一个或多个切割片， 通过基板并与衬底的空间连通。 保护层被施加到基板的外周部分和芯片上，并且包括接合到基板的截止部分中的覆盖部分，用于允许基板和芯片被保护层完全屏蔽和保护，而无需进一步 密封或包装操作。

    White-light LED Device and Illuminating Method of the same
    5.
    发明申请
    White-light LED Device and Illuminating Method of the same 审中-公开
    白光LED装置及其照明方法

    公开(公告)号：US20100296280A1

    公开(公告)日：2010-11-25

    申请号：US12782664

    申请日：2010-05-18

    申请人： Chiu-Chung YANG ,  Chien-Sheng HUANG ,  Kai-Jen YANG ,  Su-Hon LIN ,  Ming-Hwa SHEU

    发明人： Chiu-Chung YANG ,  Chien-Sheng HUANG ,  Kai-Jen YANG ,  Su-Hon LIN ,  Ming-Hwa SHEU

    IPC分类号： F21V9/00 ,  H01L33/44

    CPC分类号： H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： A white-light LED device is disclosed. The white-light LED device includes a base, at least one purple light source and at least one yellow light source. The purple light source and the yellow light source are disposed on the base, and they are adjacent to each other such that the illuminations are mixed to produce white light. An illumination method is also disclosed. The illumination method includes the following steps: At least one purple light source and at least one yellow light source are disposed on a base. The illuminations of the yellow light source and the purple light source are mixed to produce white light.

    摘要翻译： 公开了一种白光LED装置。 白光LED装置包括底座，至少一个紫色光源和至少一个黄色光源。 紫色光源和黄色光源设置在基座上，并且它们彼此相邻，使得照明被混合以产生白光。 还公开了照明方法。 照明方法包括以下步骤：至少一个紫色光源和至少一个黄色光源设置在基座上。 黄色光源和紫色光源的照明被混合以产生白光。

    FLIP CHIP LED DIE AND ARRAY THEREOF
    8.
    发明申请
    FLIP CHIP LED DIE AND ARRAY THEREOF 有权
    FLIP CHIP LED DIE及其阵列

    公开(公告)号：US20110049538A1

    公开(公告)日：2011-03-03

    申请号：US12943020

    申请日：2010-11-10

    申请人： Chiu-Chung YANG

    发明人： Chiu-Chung YANG

    IPC分类号： H01L33/46 ,  H01L33/36

    CPC分类号： H01L33/44 ,  H01L33/22

    摘要： A flip chip LED die is provided and includes a first type doped layer, a second type doped layer, a first electrode layer, a second electrode layer and an insulation layer. The second type doped layer is disposed under the first type doped layer. The first electrode layer is disposed under the first type doped layer without contacting the second type doped layer. The first electrode layer has an exposed area for directly coating an electrically conductive adhesive thereon. The second metal/electrode layer is disposed under the second type doped layer, and also has an exposed area for directly coating the electrically conductive adhesive thereon. The insulation layer is disposed between the first electrode layer and the second electrode layer for electrically insulating and supporting the first electrode layer and the second electrode layer.

    摘要翻译： 提供了倒装芯片LED管芯，其包括第一掺杂层，第二掺杂层，第一电极层，第二电极层和绝缘层。 第二类型掺杂层设置在第一类型掺杂层下方。 第一电极层设置在第一类型掺杂层下方，而不与第二类型掺杂层接触。 第一电极层具有用于在其上直接涂覆导电粘合剂的暴露区域。 第二金属/电极层设置在第二类型掺杂层下方，并且还具有用于在其上直接涂覆导电粘合剂的暴露区域。 绝缘层设置在第一电极层和第二电极层之间，用于电绝缘和支撑第一电极层和第二电极层。