摘要:
Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the network to logic elements on the integrated circuit. The network may be evenly distributed across the base layer of the integrated circuit. Even distribution of the network may reduce skew of the test signals. Buffers are also placed along the structured network. The buffers may be placed to ensure a deterministic test signals distribution. Unused buffers in the base layer may be tied off to reduce current leakage.
摘要:
Clock distribution circuitry for a structured ASIC device includes a deterministic portion and configurable portions. The deterministic portion employs a predetermined arrangement of conductor segments and buffers for distributing a clock signal to a plurality of predetermined locations on the device. From each predetermined location, an associated configurable portion of the clock distribution circuitry distributes the clock signal to any clock utilization circuitry needing that clock signal in a predetermined area of the structured ASIC that is served from that predetermined location.
摘要:
Systems including an input/output (I/O) stack and methods for fabricating such systems are described. In one implementation, the methods include stacking an I/O die including I/O elements and excluding a logic element. Also in one implementation, the methods further include stacking an integrated circuit die with respect to the I/O die. The integrated circuit includes logic elements and excludes an I/O element. The separation of the I/O die from the integrated circuit die provides various benefits, such as independent development of each of the dies and more space for the I/O elements on an I/O substrate of the I/O die compared to that in a conventional die. The increase in space allows new process generation of the integrated circuit die in which an increasing number of logic elements are fitted within the same surface area of a substrate of the integrated circuit die.
摘要:
An integrated circuit device with a single via layer, in which the via layer includes selectable via sites and/or jumpers. The selectable via sites and/or placement of jumpers may be used to configure and interconnect components and circuitry between distinct layers of multilayer circuits. In some implementations, selectively enabling via sites by filling via openings and/or using jumpers may implement a data strobe generation circuit with a first via configuration and/or a data buffer circuit with a second configuration.
摘要:
An integrated circuit (IC) is provided where the IC includes a first die, a second die stacked above the first die, and a plurality of die-to-die interconnects coupling the first die to the second die, where the plurality of die-to-die interconnects includes at least one redundancy die-to-die interconnect. In one implementation, the plurality of die-to-die interconnects includes a plurality of pre-designated die-to-die interconnects, where if a pre-designated die-to-die interconnect of the plurality of pre-designated die-to-die interconnects is defective, then signals intended for transmission via the pre-designated die-to-die interconnect are instead transmitted via the at least one redundancy die-to-die interconnect.
摘要:
A mask set is described. In one implementation, the mask set includes: a first layer mask including a plurality of first tiles of a first tile size; and a second layer mask including a plurality of second tiles of a second tile size, where the second tile size is different from the first tile size. Also, a method of fabricating a plurality of integrated circuits (ICs) is described. In one implementation, the method includes: using a first layer mask having a first tile size to fabricate a first layer of a first IC of the plurality of ICs and a first layer of a second IC of the plurality of ICs; and using a second layer mask having a second tile size to fabricate a second layer of the first IC, where the second tile size is different from the first tile size.
摘要:
Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the network to logic elements on the integrated circuit. The network may be evenly distributed across the base layer of the integrated circuit. Even distribution of the network may reduce skew of the test signals. Buffers are also placed along the structured network. The buffers may be placed to ensure a deterministic test signals distribution. Unused buffers in the base layer may be tied off to reduce current leakage.
摘要:
A structured ASIC device includes highly flexible clock signal routing to peripheral IO circuitry of the device. A plurality of peripheral IO circuits are divided into subpluralities of adjacent ones of those circuits. Each subplurality has associated clock signal routing that is mask-programmable to supply any of a plurality of clock signals to any of the IO circuits in the subplurality. Core circuitry of the structured ASIC includes clock signal distribution circuitry, and that distribution circuitry can supply (via buffers associated with each subplurality) the same plurality of clock signals to the routing circuitry associated with all of the subpluralities.
摘要:
Clock distribution circuitry for a structured ASIC device includes a deterministic portion and configurable portions. The deterministic portion employs a predetermined arrangement of conductor segments and buffers for distributing a clock signal to a plurality of predetermined locations on the device. From each predetermined location, an associated configurable portion of the clock distribution circuitry distributes the clock signal to any clock utilization circuitry needing that clock signal in a predetermined area of the structured ASIC that is served from that predetermined location.
摘要:
Systems including an input/output (I/O) stack and methods for fabricating such systems are described. In one implementation, the methods include stacking an I/O die including I/O elements and excluding a logic element. Also in one implementation, the methods further include stacking an integrated circuit die with respect to the I/O die. The integrated circuit includes logic elements and excludes an I/O element. The separation of the I/O die from the integrated circuit die provides various benefits, such as independent development of each of the dies and more space for the I/O elements on an I/O substrate of the I/O die compared to that in a conventional die. The increase in space allows new process generation of the integrated circuit die in which an increasing number of logic elements are fitted within the same surface area of a substrate of the integrated circuit die.