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公开(公告)号:US06492194B1
公开(公告)日:2002-12-10
申请号:US09688358
申请日:2000-10-12
IPC分类号: H01L2156
CPC分类号: H01L21/561 , H01L21/56 , H01L23/3135 , H01L23/3164 , H01L23/552 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/15151 , H01L2924/181 , H01L2924/3025 , H03H3/08 , H01L2224/81 , H01L2224/05599 , H01L2924/00012
摘要: A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.
摘要翻译: 一种用于包装电子部件的方法,包括将至少一个电子部件在其主动面侧安装到基部,所述基部包括外表面上的电触点和与外表面相对的表面上的连接焊盘,并且包括 连接电触头和连接垫的第一系列通孔和用于抽吸的第二系列孔。 在与电子部件的主动面相对的面上沉积可变形膜。 可变形膜通过第二系列孔从与基座的外表面相对的面吸出,以便包覆电子部件。 该方法还可以包括在可变形膜的顶部上的矿物沉积物以提供组件的气密密封和导电沉积以提供屏蔽。 这种应用可能会发现特定应用于表面波滤波器。
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2.
公开(公告)号:US06556105B1
公开(公告)日:2003-04-29
申请号:US09890280
申请日:2001-08-10
IPC分类号: H03H964
CPC分类号: H03H9/0585 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/07811 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要: The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.
摘要翻译: 本发明涉及一种通过导电材料连接到基底的表面波器件,该导电材料在垂直于表面波器件和基底的平面的方向上是各向异性的。 这种各向异性导电材料提供了表面波器件的机械效能和封装。 它以局部沉积在基底的平面中,以便提供表面声波可以传播的空腔的存在。
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