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1.发明授权Electric device, stack of electric devices, and method of manufacturing a stack of electric devices 有权电气设备，电气设备的堆叠以及电气设备的堆叠的制造方法公开(公告)号：US07834462B2
公开(公告)日：2010-11-16
申请号：US11856652
申请日：2007-09-17
Applicant: Stephan Dobritz , Christoph Polaczyk , Roland Irsigler
Inventor： Stephan Dobritz , Christoph Polaczyk , Roland Irsigler
CPC classification number: H05K3/3436 , H01L23/3128 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2225/06541 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H05K1/112 , H05K2201/09509 , H05K2201/09572 , H05K2201/096 , H05K2203/0455 , Y02P70/613 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.
Abstract translation: 根据本发明的一个实施例，电气设备包括：顶表面和底表面; 从所述顶表面穿过所述装置延伸到所述底表面的接触孔; 导电密封元件，其在底表面处或附近密封接触孔; 导电连接，其连接到导电密封元件并且延伸穿过接触孔到达顶表面; 以及设置在导电性密封元件的底面上的焊料。
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2.发明申请Electric Device, Stack of Electric Devices, and Method of Manufacturing a Stack of Electric Devices 有权电气设备，电气设备的堆叠以及制造电子设备的堆叠的方法公开(公告)号：US20090072374A1
公开(公告)日：2009-03-19
申请号：US11856652
申请日：2007-09-17
Applicant: Stephan Dobritz , Christoph Polaczyk , Roland Irsigler
Inventor： Stephan Dobritz , Christoph Polaczyk , Roland Irsigler
CPC classification number: H05K3/3436 , H01L23/3128 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2225/06541 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H05K1/112 , H05K2201/09509 , H05K2201/09572 , H05K2201/096 , H05K2203/0455 , Y02P70/613 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.
Abstract translation: 根据本发明的一个实施例，电气设备包括：顶表面和底表面; 从所述顶表面穿过所述装置延伸到所述底表面的接触孔; 导电密封元件，其在底表面处或附近密封接触孔; 导电连接，其连接到导电密封元件并且延伸穿过接触孔到达顶表面; 以及设置在导电性密封元件的底面上的焊料。
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