公开(公告)号：US20060142746A1

公开(公告)日：2006-06-29

申请号：US10538548

申请日：2003-12-11

申请人： Beth Friedman ,  David Kleinfeld ,  Patrick Lyden ,  Nozomi Nishimura ,  Christopher Schaffer ,  Lee Schroeder ,  Philbert Tsai

发明人： Beth Friedman ,  David Kleinfeld ,  Patrick Lyden ,  Nozomi Nishimura ,  Christopher Schaffer ,  Lee Schroeder ,  Philbert Tsai

IPC分类号： A61B18/18

CPC分类号： A61B18/20 ,  A61B18/203 ,  A61B2017/00057 ,  A61B2018/00452

摘要： Ultrashort laser pulses are used to induce photodisruptive breakdown in vasculature in an animal to controllably produce hemorrhage, thrombosis or breach of the blood-brain barrier in individual, specifically-targeted blood vessels. Damage is limited to the targeted vessels such that neighboring vessels exhibit no signs of vascular damage, including vessels directly above and directly below the targeted vessel. Ultrashort laser pulses of lower energy are also used to observe and quantify the baseline and altered states of blood flow. Observation and measurement may be performed by TPLSM, OCT or other known techniques, providing a real-time, in vivo model for the dynamics and effects of vascular injury.

摘要翻译： 超短脉冲激光脉冲被用于诱发动物脉管系统中的光破坏性破坏，以可控地产生出血，血栓形成或破坏个体特异性靶向血管中的血脑屏障。 损害局限于目标船只，使相邻船只没有血管损伤迹象，包括直接位于目标船只正下方的血管。 较低能量的超短脉冲激光脉冲也用于观察和定量血流的基线和改变的状态。 观察和测量可以通过TPLSM，OCT或其他已知技术进行，为血管损伤的动力学和影响提供实时的体内模型。

公开(公告)号：US20050275112A1

公开(公告)日：2005-12-15

申请号：US11141861

申请日：2005-06-01

申请人： Christopher Schaffer

发明人： Christopher Schaffer

IPC分类号： H01L21/56 ,  H01L23/34 ,  H01L23/367 ,  H01L25/16 ,  H01L29/06

CPC分类号： H01L21/56 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3675 ,  H01L25/165 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and a manufacturing method providing improved coplanarity accommodation and heat dissipation in a multi-chip module. One of the components in a multi-chip module (MCM) is provided with a recess formed in its respective top surface; and a film is applied so as to cover the top surfaces of the components and so that any excess film can enter into the recess. The recess is preferably a peripheral groove. Then when molding material is injected, it may surround and seal the side surfaces of the components, while not substantially covering the top surfaces that are covered by the film. Since the recess receives any excess film material that may be present, it may prevent such excess film material from covering the respective side surfaces of the corresponding component and creating a void between the component and the molding material. This advantageous effect of the invention is particularly useful when the top component surface in which the recess is formed is higher above the circuit substrate than the respective top surface of another one of the components.

摘要翻译： 一种在多芯片模块中提供改善的共平面调节和散热的结构和制造方法。 多芯片模块（MCM）中的一个部件设置有形成在其各自顶表面上的凹部; 并且施加膜以覆盖部件的顶表面，并且使得任何多余的膜可以进入凹部。 凹部优选为周边槽。 然后当模制材料被注入时，它可以围绕和密封部件的侧表面，而基本上不覆盖被膜覆盖的顶表面。 由于凹部容纳可能存在的多余的薄膜材料，因此可以防止这种多余的薄膜材料覆盖相应的部件的相应的侧表面，并在组件和模制材料之间产生空隙。 当形成凹部的顶部部件表面比另一个部件的相应顶部表面高于电路基板时，本发明的这种有益效果是特别有用的。

公开(公告)号：US20050270057A1

公开(公告)日：2005-12-08

申请号：US11141860

申请日：2005-06-01

申请人： Christopher Schaffer ,  Johan Strydom ,  Andrea Ciuffoli

发明人： Christopher Schaffer ,  Johan Strydom ,  Andrea Ciuffoli

IPC分类号： G01R1/073 ,  G01R31/26

CPC分类号： G01R1/0735

摘要： A testing apparatus and method for testing a semiconductor device, and more particularly a test arrangement for measuring a guaranteed power loss of a semiconductor module, not requiring the module to have on-board decoupling capacitors for the power loss test. The conventional pogo-pin array and test socket are replaced by a novel low cost anisotropic conductive elastomer and a low cost socket, the conductive polymer providing electrical communication between the socket and the module under test.

摘要翻译： 一种用于测试半导体器件的测试装置和方法，更具体地，用于测量半导体模块的有保证的功率损耗的测试装置，不需要该模块具有用于功率损耗测试的板载去耦电容器。 常规的弹簧针阵列和测试插座由新颖的低成本各向异性导电弹性体和低成本插座代替，导电聚合物在插座和被测模块之间提供电气连接。

公开(公告)号：US06489634B1

公开(公告)日：2002-12-03

申请号：US09938073

申请日：2001-08-22

申请人： Christopher Schaffer ,  Steven R. Burkhart ,  Bartley J. Price

发明人： Christopher Schaffer ,  Steven R. Burkhart ,  Bartley J. Price

IPC分类号： H01L310312

CPC分类号： H01L23/13 ,  H01L23/3732 ,  H01L2224/48091 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A microelectronic device structure includes a package flange with a body having a body upper surface, a substantially circular body interior sidewall defining an opening in the body upper surface, and a substantially circular inlay made of CVD diamond. The inlay is received into the substantially circular opening and has an inlay exterior sidewall which is adjacent to the body interior sidewall and is brazed thereto. The inlay has an inlay upper surface that is substantially coplanar with the body upper surface. A microelectronic device is affixed to the inlay upper surface.

摘要翻译： 微电子器件结构包括具有主体的封装凸缘，主体具有主体上表面，在主体上表面中限定开口的大致圆形的主体内部侧壁以及由CVD金刚石制成的大致圆形的嵌体。 镶嵌物被接收到基本上圆形的开口中并且具有与主体内侧壁相邻并且钎焊到其上的镶嵌外侧壁。 镶嵌物具有与主体上表面基本上共面的镶嵌上表面。 微电子器件固定在镶嵌上表面上。

公开(公告)号：US20070299331A1

公开(公告)日：2007-12-27

申请号：US11777958

申请日：2007-07-13

申请人： Beth FRIEDMAN ,  David KLEINFELD ,  Patrick LYDEN ,  Nozomi NISHIMURA ,  Christopher SCHAFFER ,  Lee SCHROEDER ,  Philbert TSAI

发明人： Beth FRIEDMAN ,  David KLEINFELD ,  Patrick LYDEN ,  Nozomi NISHIMURA ,  Christopher SCHAFFER ,  Lee SCHROEDER ,  Philbert TSAI

IPC分类号： A61D99/00

CPC分类号： A61B18/20 ,  A61B18/203 ,  A61B2017/00057 ,  A61B2018/00452

摘要： Ultrashort laser pulses are used to induce photodisruptive breakdown in vasculature in an animal to controllably produce hemorrhage, thrombosis or breach of blood-brain barrier in individual, specifically targeted blood vessels. Damage is limited to the targeted vessels such that neighboring vessels exhibit no signs of vascular damage, including vessels directly above or below the targeted vessel. Ultrashort laser pulses of lower energy are also used to observe and quantify the baseline and altered states of blood flow. Observation and measurement may be performed (1) by TPLSM, OCT or other known techniques, providing a real-time, in vivo model for the dynamics and effects of vascular injury.

摘要翻译： 使用超短激光脉冲来引发动物脉管系统中的光破坏性破坏，从而可控制地产生个体特异性靶向血管中的出血，血栓形成或血脑屏障的破坏。 目标船舶受到的伤害仅限于相邻的船只，没有血管损伤迹象，包括直接在目标船只上方或下方的血管。 较低能量的超短脉冲激光脉冲也用于观察和定量血流的基线和改变的状态。 可以通过TPLSM，OCT或其他已知技术进行观察和测量（1），为血管损伤的动力学和作用提供实时的体内模型。

公开(公告)号：US20050280163A1

公开(公告)日：2005-12-22

申请号：US11144169

申请日：2005-06-03

申请人： Christopher Schaffer ,  Chuan Cheah ,  Kevin Hu

发明人： Christopher Schaffer ,  Chuan Cheah ,  Kevin Hu

IPC分类号： H01L23/34 ,  H01L23/48 ,  H01L23/538 ,  H01L25/16

CPC分类号： H01L25/162 ,  H01L23/5385 ,  H01L24/01 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00

摘要： The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.

摘要翻译： 电路的半导体部分包括在共同的壳体中以平面方式布置的多个倒装芯片器件。 多个倒装芯片器件彼此连接而不引线接合。 公共壳体包括包装结构，该包装结构包括连接部分和至少一个卷筒纸部分，其有助于热管理由多个倒装芯片装置发出的热量，并将倒装芯片装置彼此​​连接。 电路中的无源器件也可以以平面方式布置在公共壳体中。

公开(公告)号：US20060202320A1

公开(公告)日：2006-09-14

申请号：US11370716

申请日：2006-03-08

申请人： Christopher Schaffer

发明人： Christopher Schaffer

IPC分类号： H01L23/48

CPC分类号： H01L23/49562 ,  H01L23/4334 ,  H01L23/4824 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package that includes a semiconductor device and a lead frame having a first lead frame portion and a second lead frame portion, each lead frame portion including a plurality of fingers and a lead pad, each finger being electrically connected to a respective electrode of the semiconductor device.

摘要翻译： 一种半导体封装，包括半导体器件和具有第一引线框架部分和第二引线框架部分的引线框架，每个引线框架部分包括多个指状物和引线焊盘，每个指状物电连接到 半导体器件。