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    Flexible biomonitor with EMI shielding and module expansion
    1.
    发明授权
    Flexible biomonitor with EMI shielding and module expansion 有权
    具有EMI屏蔽和模块扩展的灵活生物医疗器械

    公开(公告)号：US08287451B2

    公开(公告)日：2012-10-16

    申请号：US12138638

    申请日：2008-06-13

    申请人： Ying-Chiang Hu ,  Ting-Chen Ke ,  Wen-Ying Chang ,  Chun-Hsun Chu

    发明人： Ying-Chiang Hu ,  Ting-Chen Ke ,  Wen-Ying Chang ,  Chun-Hsun Chu

    IPC分类号： A61B5/00

    CPC分类号： A61B5/0002 ,  A61B5/01 ,  A61B5/02438 ,  A61B2560/0412 ,  A61B2562/182 ,  H05K1/189

    摘要： A flexible biomonitor comprises: a flexible substrate having a circuit apparatus, a hybrid sensor, a plurality of IC devices, a central processing module, a RF transmitter circuit, an antenna, and a power supply. Thereupon the flexible biomonitor can be plastered on the skin where the human body needs to be monitored to achieve the purposes of reducing occupied area, providing comfortable wear and achieve compactness, module expansion and EMI shielding. Besides, it is capable of remote real-time monitoring this signal to achieve the purpose of home care.

    摘要翻译： 柔性生物体包括：具有电路装置，混合传感器，多个IC器件，中央处理模块，RF发射器电路，天线和电源的柔性基板。 因此，灵活的生物监测器可以涂抹在人体需要监测的皮肤上，以达到减少占用面积的目的，提供舒适的磨损，实现紧凑性，模块扩展和EMI屏蔽。 此外，它能够远程实时监控此信号，以达到家庭护理的目的。

    Flexible biomonitor
    2.
    发明申请
    Flexible biomonitor 审中-公开
    灵活的生物监测器

    公开(公告)号：US20060211936A1

    公开(公告)日：2006-09-21

    申请号：US11132216

    申请日：2005-05-19

    申请人： Ying-Chiang Hu ,  Yi-Tay Chiou ,  Chun-Hsun Chu ,  Bor-Chen Tsai

    发明人： Ying-Chiang Hu ,  Yi-Tay Chiou ,  Chun-Hsun Chu ,  Bor-Chen Tsai

    IPC分类号： A61B5/04 ,  A61B5/02 ,  A61B5/00

    CPC分类号： A61B5/0002 ,  A61B5/01 ,  A61B5/02438 ,  A61B2560/0412

    摘要： A flexible biomonitor comprises a flexible substrate, a circuit apparatus, a plurality of gauges, a RFID sensing chip, a micro-antenna, and a power supply. The flexible substrate has a plurality of through holes formed thereon. The circuit apparatus is electrically connected with the gauges via the through holes to sense and treat a physiological signal. The micro-antenna is electrically connected with the circuit apparatus to transmit this physiological signal. The power supply is designed to provide electric power. Thereupon the flexible biomonitor can be plastered on the skin where the human body needs to be monitored to achieve the purposes of reducing occupied area and providing comfortable wear. Besides, it is capable of remote real-time monitoring this signal to achieve the purpose of home care.

    摘要翻译： 灵活的生物体包括柔性基底，电路装置，多个量规，RFID感测芯片，微型天线和电源。 柔性基板具有形成在其上的多个通孔。 电路装置经由通孔与量规电连接以感测和处理生理信号。 微型天线与电路装置电连接以传送该生理信号。 电源设计用于提供电力。 因此，柔性生物监测器可以涂抹在需要监测人体的皮肤上，以达到减少占地面积和提供舒适磨损的目的。 此外，它能够远程实时监控此信号，以达到家庭护理的目的。

    Diaper
    5.
    发明申请
    Diaper 审中-公开
    尿布

    公开(公告)号：US20080074274A1

    公开(公告)日：2008-03-27

    申请号：US11654559

    申请日：2007-01-18

    申请人： Ying-Chiang Hu ,  Hung-Hsin Tsai ,  Chun-Hsun Chu ,  Tzong-Che Ho

    发明人： Ying-Chiang Hu ,  Hung-Hsin Tsai ,  Chun-Hsun Chu ,  Tzong-Che Ho

    IPC分类号： G08B23/00

    CPC分类号： A61F13/42

    摘要： The present invention provides a diaper including a body, a sensing module disposed on the body for detecting humidity of the body and wirelessly transmitting an electrical signal converted from the humidity and a receiving module for receiving the electrical signal transmitted by the sensing module and generating an alarm signal.

    摘要翻译： 本发明提供了一种尿布，其包括主体，设置在身体上用于检测身体湿度的无线传感器的感测模块，以及从湿度转换的电信号和接收模块，用于接收由感测模块发送的电信号， 报警信号。

    Structure and manufacturing method of inversed microphone module and microphone chip component
    6.
    发明授权
    Structure and manufacturing method of inversed microphone module and microphone chip component 有权
    反相麦克风模块和麦克风芯片组件的结构和制造方法

    公开(公告)号：US08472646B2

    公开(公告)日：2013-06-25

    申请号：US11690842

    申请日：2007-03-25

    申请人： Jung-Tai Chen ,  Chun-Hsun Chu

    发明人： Jung-Tai Chen ,  Chun-Hsun Chu

    IPC分类号： H04R25/00

    CPC分类号： H04R19/005 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16195 ,  H04R1/2819 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

    摘要： An inversed microphone module is provided. The module includes a substrate, a microphone chip, a back acoustic cavity cover, and a sealing material. The substrate has a plurality of connection pads and an acoustic hole. The microphone chip has a first surface and an opposite second surface. A plurality of electrically bonding portions and an acoustic sensing are disposed on the first surface. The microphone chip is electrically coupled to the connection pads of the substrate through the electrically bonding portions, and the acoustic hole corresponds to the acoustic sensing portion. The back acoustic cavity cover is fixed to the second surface and defines a back acoustic cavity with the acoustic sensing portion and the microphone chip. The sealing material encapsulates the microphone chip and covers the substrate, so that the sealing material, the substrate, the acoustic sensing portion, and the first surface define a front acoustic cavity.

    摘要翻译： 提供反向麦克风模块。 该模块包括基底，麦克风芯片，背部声腔盖和密封材料。 基板具有多个连接垫和声孔。 麦克风芯片具有第一表面和相对的第二表面。 多个电接合部分和声学感测设置在第一表面上。 麦克风芯片通过电接合部分电耦合到基板的连接焊盘，并且声孔对应于声感测部分。 背部声腔盖被固定到第二表面并且限定具有声学感测部分和麦克风芯片的反向声腔。 密封材料封装麦克风芯片并覆盖基板，使得密封材料，基板，声学感测部分和第一表面限定前声学腔。

    Illumination module
    7.
    发明授权
    Illumination module 有权
    照明模块

    公开(公告)号：US07461951B2

    公开(公告)日：2008-12-09

    申请号：US11340668

    申请日：2006-01-27

    申请人： Ming-Chieh Chou ,  Wen-Shan Lin ,  Yii-Tay Chiou ,  Chun-Hsun Chu

    发明人： Ming-Chieh Chou ,  Wen-Shan Lin ,  Yii-Tay Chiou ,  Chun-Hsun Chu

    IPC分类号： F21V29/00 ,  B60Q1/00

    CPC分类号： F21V29/763 ,  F21K9/68 ,  F21S41/143 ,  F21S41/147 ,  F21S45/43 ,  F21S45/49 ,  F21V5/04 ,  F21V29/51 ,  F21V29/67 ,  F21V29/677 ,  F21V29/76 ,  F21V29/773 ,  F21V29/83 ,  F21Y2107/40 ,  F21Y2115/10

    摘要： An illumination module is disclosed, which is comprised of a plurality of light sources, a plurality of light source substrates of high thermal conductivity, and a reflecting member for reflecting light. The plural light source substrates are arranged at positions corresponding to each other so as to form a polygon periphery of the illumination module, whereas the inner surface of the polygon periphery is enabled for at least one of the plural light sources to fit therein. The reflecting member is placed at the center of the module where it is corresponding to each of the plural light source substrates so as to reflect the light emitting from the light sources fitted thereon. In addition, a lens with light refraction ability is disposed at the light emitting end of the illumination module so as to enable the light illumination module to have light condensing/diffusing capability. Moreover, each light source substrate further comprises: a plurality of heat dissipating fins, being arranged at the outer surface thereof; and a assistant heat dissipating device; wherein the working range of the operation power and the luminous flux of the illumination module can be increased by the combined function provided by the heat dissipating fins and the assistant heat dissipating device. The assistant heat dissipating device can further comprise: a fan, being arranged at the bottom of the illumination module; and a heat pipe device, being fitted onto the light source substrate, for conducting waste heat to the heat dissipating fins to be dissipated.

    摘要翻译： 公开了一种照明模块，其包括多个光源，多个导热性高的光源基板和用于反射光的反射部件。 多个光源基板被布置在彼此对应的位置处以形成照明模块的多边形边缘，而多边形边缘的内表面能够使多个光源中的至少一个安装在其中。 反射部件位于模块的与多个光源基板中的每一个对应的中心处，以便反射从其上安装的光源发出的光。 此外，具有光折射能力的透镜设置在照明模块的发光端，以使得照明模块能够具有聚光/漫射能力。 此外，每个光源基板还包括：布置在其外表面处的多个散热片; 和辅助散热装置; 其中通过散热片和辅助散热装置提供的组合功能可以提高照明模块的操作功率和光通量的工作范围。 辅助散热装置还可以包括：风扇，布置在照明模块的底部; 以及安装在光源基板上的热管装置，用于将散热量散发到散热翅片上。

    Noise reduction device and method thereof
    8.
    发明申请
    Noise reduction device and method thereof 有权
    降噪装置及其方法

    公开(公告)号：US20080159554A1

    公开(公告)日：2008-07-03

    申请号：US11892778

    申请日：2007-08-27

    申请人： Po-Hsun Sung ,  Chun-Hsun Chu

    发明人： Po-Hsun Sung ,  Chun-Hsun Chu

    IPC分类号： A61F11/06

    CPC分类号： G10K11/178 ,  H04R1/1083

    摘要： A noise reduction device include at east a cavity; a plurality of ducts noise reduction, at least one of the ducts being connected to the cavity for transmitting an acoustic signal including a noise signal into/out of the cavity; a noise reduction circuit, for receiving the acoustic signal including the noise signal and generating an electrical signal; a microphone for receiving the acoustic signal inside the cavity, converting the received acoustic signal into another electrical signal and transmitting the electrical signal to the noise reduction circuit; and a speaker for receiving the electrical signal generated by the noise reduction circuit, using the received electrical signal to generate an out of phase acoustic signal accordingly, and feeding the out of phase acoustic signal into the cavity to interfere with the noise signal inside the cavity. With the noise reduction circuit and cavity structure designed in the noise reduction device, the full range of noise is attenuated

    摘要翻译： 降噪装置在东部包括一个空腔; 多个管道噪声降低，所述管道中的至少一个连接到所述腔体，用于将包括噪声信号的声学信号传输到所述腔体中或从所述腔体传出; 噪声降低电路，用于接收包括噪声信号的声信号并产生电信号; 麦克风，用于接收腔内的声信号，将接收到的声信号转换为另一电信号，并将电信号发送到降噪电路; 以及扬声器，用于接收由噪声降低电路产生的电信号，使用接收到的电信号相应地产生异相声信号，并将异相声信号馈送到空腔中以干扰腔内的噪声信号 。 在降噪装置中设计的降噪电路和腔结构，全面的噪声范围被衰减

    PACKAGE STRUCTURE AND PACKAGING METHOD OF MEMS MICROPHONE
    9.
    发明申请
    PACKAGE STRUCTURE AND PACKAGING METHOD OF MEMS MICROPHONE 有权
    MEMS麦克风的包装结构和包装方法

    公开(公告)号：US20080083960A1

    公开(公告)日：2008-04-10

    申请号：US11759940

    申请日：2007-06-08

    申请人： Jung-Tai Chen ,  Chun-Hsun Chu

    发明人： Jung-Tai Chen ,  Chun-Hsun Chu

    IPC分类号： H01L29/84 ,  H01L21/56

    CPC分类号： H04R1/04 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.

    摘要翻译： 公开了一种微机电系统（MEMS）型麦克风的封装结构。 MEMS麦克风包括基板，MEMS芯片，声波盖和密封剂。 衬底具有连接焊盘。 MEMS芯片电耦合到连接焊盘。 MEMS芯片包括声波感测部分。 声波罩固定在MEMS芯片上用于覆盖而不接触声波感测部分并且限定声波腔空间。 声波罩具有用于允许声波进入或离开声腔空间的开口。 密封剂封装衬底，MEMS芯片和声波罩，其中声波罩的表面被暴露。 声波罩的暴露表面与密封剂表面的水平相同。