公开(公告)号：US07649265B2

公开(公告)日：2010-01-19

申请号：US11541124

申请日：2006-09-29

申请人： Chunfei Ye ,  Boping Wu

发明人： Chunfei Ye ,  Boping Wu

IPC分类号： H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2223/6616 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/112 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/10674 ,  H01L2224/0401

摘要： In some embodiments, a micro-via structure design for high performance integrated circuits is presented. In this regard, an integrated circuit chip package is introduced having a dielectric layer, a plated throughhole in the dielectric layer, and a micro-via coupled with the plated throughhole, wherein the micro-via forms a path around an axis. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提出了用于高性能集成电路的微通孔结构设计。 在这方面，引入集成电路芯片封装，其具有电介质层，电介质层中的电镀通孔和与电镀通孔耦合的微通孔，其中微通孔围绕轴线形成路径。 还公开并要求保护其他实施例。

公开(公告)号：US20080079139A1

公开(公告)日：2008-04-03

申请号：US11541124

申请日：2006-09-29

申请人： Chunfei Ye ,  Boping Wu

发明人： Chunfei Ye ,  Boping Wu

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2223/6616 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/112 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/10674 ,  H01L2224/0401

摘要： In some embodiments, a micro-via structure design for high performance integrated circuits is presented. In this regard, an integrated circuit chip package is introduced having a dielectric layer, a plated throughhole in the dielectric layer, and a micro-via coupled with the plated throughhole, wherein the micro-via forms a path around an axis. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提出了用于高性能集成电路的微通孔结构设计。 在这方面，引入集成电路芯片封装，其具有电介质层，电介质层中的电镀通孔和与电镀通孔耦合的微通孔，其中微通孔围绕轴线形成路径。 还公开并要求保护其他实施例。

公开(公告)号：US06982672B2

公开(公告)日：2006-01-03

申请号：US10795781

申请日：2004-03-08

申请人： Shengli Lin ,  Chunfei Ye ,  Nilesh N. Shah

发明人： Shengli Lin ,  Chunfei Ye ,  Nilesh N. Shah

IPC分类号： H01Q1/38

CPC分类号： H01Q1/38 ,  H01Q9/0414

摘要： A multi-band antenna comprises a first conductive layer having one or more parasitic patches, a second conductive layer having a plurality of radiating patches, and a third conductive layer having a ground patch. The first, second and third conductive layers may be separated by first and second substrate layers. The second conductive layer may comprise a first radiating patch having dimensions selected to radiate signals within a first frequency spectrum and second radiating patches having dimensions selected to radiate signals within a second frequency spectrum. In wireless local area network (WLAN) embodiments, the first frequency spectrum may comprise a frequency band ranging from approximately 5.1 to 5.9 GHz, and the second frequency spectrum may comprise frequency bands ranging from approximately 2.4 to 2.5 GHz.

摘要翻译： 多频带天线包括具有一个或多个寄生片的第一导电层，具有多个辐射片的第二导电层和具有接地片的第三导电层。 第一，第二和第三导电层可以由第一和第二衬底层分离。 第二导电层可以包括第一辐射贴片，其具有被选择用于辐射第一频谱内的信号的尺寸，以及具有被选择用于辐射第二频谱内的信号的尺寸的第二辐射贴片。 在无线局域网（WLAN）实施例中，第一频谱可以包括范围从大约5.1到5.9GHz的频带，并且第二频谱可以包括范围从大约2.4到2.5GHz的频带。

公开(公告)号：US20080080155A1

公开(公告)日：2008-04-03

申请号：US11540986

申请日：2006-09-28

申请人： Chunfei Ye ,  Xiaoning Ye

发明人： Chunfei Ye ,  Xiaoning Ye

IPC分类号： H05K7/00

CPC分类号： H05K1/0248 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/0969 ,  Y10T29/49124

摘要： According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity will also be changed. As a result, the flying time from one location or point to a different location or point of the transmission line will also be changed. This concept applies to a single trace. Similarly, this concept may be applied to one trace of a differential pair of traces (e.g., so that the two parts of the differential signal transmitted at one point in time at a location on the pair arrive at the same time at another location of the pair).

摘要翻译： 根据实施例，可以在邻近所选轨迹线的接地平面上或通过接地平面上切割小孔或开口，使得C和L将相应地改变。 那么相位速度也会改变。 结果，从一个位置或点到传输线的不同位置或点的飞行时间也将被改变。 这个概念适用于单一轨迹。 类似地，该概念可以应用于差分对迹线的一个迹线（例如，使得在一个位置上的一个时间点发送的差分信号的两个部分在同一时间在 对）。

公开(公告)号：US20080314620A1

公开(公告)日：2008-12-25

申请号：US12194484

申请日：2008-08-19

申请人： Chunfei Ye ,  Xiaoning Ye

发明人： Chunfei Ye ,  Xiaoning Ye

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K1/0248 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/0969 ,  Y10T29/49124

摘要： According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity will also be changed. As a result, the flying time from one location or point to a different location or point of the transmission line will also be changed. This concept applies to a single trace. Similarly, this concept may be applied to one trace of a differential pair of traces (e.g., so that the two parts of the differential signal transmitted at one point in time at a location on the pair arrive at the same time at another location of the pair).

摘要翻译： 根据实施例，可以在邻近所选轨迹线的接地平面上或通过接地平面上切割小孔或开口，使得C和L将相应地改变。 那么相位速度也会改变。 结果，从一个位置或点到传输线的不同位置或点的飞行时间也将被改变。 这个概念适用于单一轨迹。 类似地，该概念可以应用于差分对迹线的一个迹线（例如，使得在一个位置处的一个时间点发送的差分信号的两个部分在同一时间在 对）。

公开(公告)号：US07450396B2

公开(公告)日：2008-11-11

申请号：US11540986

申请日：2006-09-28

申请人： Chunfei Ye ,  Xiaoning Ye

发明人： Chunfei Ye ,  Xiaoning Ye

IPC分类号： H05K7/00

CPC分类号： H05K1/0248 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/0969 ,  Y10T29/49124

摘要： According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity will also be changed. As a result, the flying time from one location or point to a different location or point of the transmission line will also be changed. This concept applies to a single trace. Similarly, this concept may be applied to one trace of a differential pair of traces (e.g., so that the two parts of the differential signal transmitted at one point in time at a location on the pair arrive at the same time at another location of the pair).

公开(公告)号：US20050195110A1

公开(公告)日：2005-09-08

申请号：US10795781

申请日：2004-03-08

申请人： Shengli Lin ,  Chunfei Ye ,  Nilesh Shah

发明人： Shengli Lin ,  Chunfei Ye ,  Nilesh Shah

IPC分类号： H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q1/38 ,  H01Q9/0414

摘要： A multi-band antenna comprises a first conductive layer having one or more parasitic patches, a second conductive layer having a plurality of radiating patches, and a third conductive layer having a ground patch. The first, second and third conductive layers may be separated by first and second substrate layers. The second conductive layer may comprise a first radiating patch having dimensions selected to radiate signals within a first frequency spectrum and second radiating patches having dimensions selected to radiate signals within a second frequency spectrum. In wireless local area network (WLAN) embodiments, the first frequency spectrum may comprise a frequency band ranging from approximately 5.1 to 5.9 GHz, and the second frequency spectrum may comprise frequency bands ranging from approximately 2.4 to 2.5 GHz.

摘要翻译： 多频带天线包括具有一个或多个寄生片的第一导电层，具有多个辐射片的第二导电层和具有接地片的第三导电层。 第一，第二和第三导电层可以由第一和第二衬底层分离。 第二导电层可以包括第一辐射贴片，其具有被选择用于辐射第一频谱内的信号的尺寸，以及具有被选择用于辐射第二频谱内的信号的尺寸的第二辐射贴片。 在无线局域网（WLAN）实施例中，第一频谱可以包括范围从大约5.1到5.9GHz的频带，并且第二频谱可以包括范围从大约2.4到2.5GHz的频带。