利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

2 条记录 (耗时 0.015 秒)

    Multi-layer circuit board and semiconductor flip chip connection
    1.
    发明授权
    Multi-layer circuit board and semiconductor flip chip connection 失效
    多层电路板和半导体倒装芯片连接

    公开(公告)号：US5768109A

    公开(公告)日：1998-06-16

    申请号：US681136

    申请日：1996-07-22

    申请人： Jon J. Gulick ,  Craig K. Shoda

    发明人： Jon J. Gulick ,  Craig K. Shoda

    IPC分类号： H01L23/13 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H01L23/34 ,  H01P1/00 ,  H05K7/02

    CPC分类号： H01L23/5384 ,  H01L23/13 ,  H01L23/5383 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1423 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K2201/09072 ,  H05K2201/10674

    摘要： A multi-layer circuit board (11) has a cofired ceramic with a configuration of circuit traces (27) extending though differing layers of the multi-layer circuit board (11) to facilitate mountable conductive contact with semiconductor flip chips (13). Via holes (23) are precisely formed in the multi-layer circuit board (11) and are filled with solder or conductive epoxy. Semiconductor chips (13) have an array of metallic posts (19) alignable with the holes (23) and are mounted upon the upper surface of the multi-layer circuit board (11) in plug fashion. An aperture (25) may be formed in multi-layer circuit board (11) directly below each semiconductor chip (13) for protection of the circuitry on semiconductor chip (13) from contact with multi-layer circuit board (11). The via holes (23) and transmission line structure of the circuit board (11) are precisely formed to achieve a desired characteristic impedance.

    摘要翻译： 多层电路板（11）具有共烧陶瓷，​​其具有通过多层电路板（11）的不同层延伸的电路迹线（27）的结构，以便于与半导体倒装芯片（13）的可安装的导电接触。 通孔（23）精确地形成在多层电路板（11）中并填充有焊​​料或导电环氧树脂。 半导体芯片（13）具有与孔（23）对准的金属柱（19）的阵列，并且以插头方式安装在多层电路板（11）的上表面上。 可以在每个半导体芯片（13）的正下方的多层电路板（11）中形成孔（25），以保护半导体芯片（13）上的电路与多层电路板（11）的接触。 通孔（23）和电路板（11）的传输线结构被精确地形成以实现期望的特性阻抗。

    Airline transmission structures in low temperature co-fired ceramic
    2.
    发明授权
    Airline transmission structures in low temperature co-fired ceramic 失效
    低温共烧陶瓷航空传输结构

    公开(公告)号：US5157364A

    公开(公告)日：1992-10-20

    申请号：US712176

    申请日：1991-05-22

    申请人： Ramona G. Pond ,  Louis W. Hendrick ,  Craig K. Shoda

    发明人： Ramona G. Pond ,  Louis W. Hendrick ,  Craig K. Shoda

    IPC分类号： H01P1/203

    CPC分类号： H01P1/20336 ,  H01P1/20363

    摘要： An airline transmission structure in a low temperature co-fired ceramic ("LTCC"). A cavity is made within the LTCC structure. Ground planes surround the cavity. Electronic processing circuitry, such as an airline filter, is suspended within the cavity. Transmission lines are provided to connect the electronic circuitry to the electronic signals (typically microwave) which require processing. Full integration of the airline filter with other electronic circuitry in a single LTCC package is also shown.

    摘要翻译： 低温共烧陶瓷（“LTCC”）中的航空传输结构。 在LTCC结构内形成空腔。 地平面围绕着空腔。 诸如航空公司过滤器的电子处理电路悬挂在空腔内。 提供传输线以将电子电路连接到需要处理的电子信号（通常为微波）。 还显示了将Airline滤波器与单个LTCC封装中的其他电子电路完全集成。